公开(公告)号：US12105538B2

公开(公告)日：2024-10-01

申请号：US17821028

申请日：2022-08-19

Applicant: HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP

Inventor： Michael Scott ,  Harvey J. Lunsman ,  David Collins

IPC: F15B1/02 ,  F15B1/027 ,  F15B1/033 ,  F15B1/24 ,  F15B21/00 ,  G05D16/10 ,  H05K7/20 ,  F16L55/052 ,  F16L55/053

CPC classification number: G05D16/109 ,  F15B1/021 ,  F15B1/025 ,  F15B1/027 ,  F15B1/033 ,  F15B1/24 ,  F15B21/006 ,  H05K7/20272 ,  H05K7/20281 ,  F15B2201/31 ,  F15B2201/32 ,  F15B2201/413 ,  F16L55/052 ,  F16L55/053

Abstract: Example implementations relate to a pressure regulator assembly for a closed fluid loop of a CDU. The pressure regulator assembly has a cylinder having an internal volume, and first and second hollow pistons slidably connected to the cylinder to split the internal volume into a first volume portion having cooling fluid, a second volume portion having driver fluid, and a third volume portion having compressible matter. The first volume portion is fluidically connected to the closed fluid loop. The first hollow piston is reciprocated by the compressible matter to maintain operating pressure of the cooling fluid in the closed fluid loop. The second hollow piston is driven by the driver fluid in response to predefined pressure drop of the cooling fluid during predefined time period, to inject additional cooling fluid from the first volume portion into the closed fluid loop to restore pressure level of cooling fluid to operating pressure.

公开(公告)号：US11464133B2

公开(公告)日：2022-10-04

申请号：US16247350

申请日：2019-01-14

Applicant: HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP

Inventor： Michael Scott ,  Bret Cuda ,  David Petersen ,  Eng Lim Goh ,  Mark R. Fernandez ,  John Kichury ,  Robert Behringer ,  Calandra Szulgit

IPC: H05K7/20 ,  G06F1/20

Abstract: Example containers are provided to retain and cool electronic devices in environments where power and/or coolant (e.g., airflow) is limited or finite. In examples, a container can include a housing and a conduit system. The housing can include a plurality of sides including a front side and a back side, and can be structured to retain at least a first computing device. In addition, the housing can provide for a first and second inlet opening and a first and second outlet opening on the back side of the container. The conduit system can be provided within the housing to guide the airflow received from each of the first and second outlet openings through an interior volume of the container to cause the airflow to exit from each of the first and second outlet openings. Further, the conduit system can include a plurality of structures that combine to guide at least a portion of the airflow received through the first and second inlet openings through a top region of the interior volume as the airflow is moved from the back side of the container to the front side of the container. Further still, the conduit system can guide at least a portion of the warmed airflow to a bottom region of the interior volume as the warmed airflow is moved from the front side to the back side of the container.

公开(公告)号：US20210109574A1

公开(公告)日：2021-04-15

申请号：US16653335

申请日：2019-10-15

Applicant: HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP

Inventor： John Franz ,  Robert Mascia ,  Harvey Lunsman ,  Steven Dean ,  Michael Scott

IPC: G06F1/20 ,  G06F1/26 ,  H05K7/20

Abstract: A computing apparatus includes an enclosure to house computing nodes; a slot to receive a power supply unit that is to provide power to the computing nodes; and a cold plate assembly positioned in the slot. The cold plate assembly includes a first thermal exchange surface and a cooling loop. The first thermal exchange surface is inclined relative to a horizontal dimension of the slot and is to make thermal contact with a complementary thermal exchange surface of the power supply unit when the power supply unit is received by the slot, the complementary thermal exchange surface also being inclined relative to a horizontal dimension of the slot. The cooling loop is thermally coupled to the first interface and through which liquid coolant is to flow.

公开(公告)号：US20190182988A1

公开(公告)日：2019-06-13

申请号：US15834636

申请日：2017-12-07

Applicant: Hewlett Packard Enterprise Development LP

Inventor： Harvey Lunsman ,  Steven Dean ,  Michael Scott

IPC: H05K7/20

CPC classification number: H05K7/20781 ,  H05K7/20254 ,  H05K7/20272 ,  H05K7/20281 ,  H05K7/20772 ,  H05K7/20836

Abstract: Example implementations relate to a chassis cooling device. In some examples, a chassis cooling device may include a manifold within the chassis to distribute a cooling resource among a cooling loop and a heat exchanger; a first plurality of pumps, coupled to a cooling loop return portion of the manifold, arranged in parallel in the chassis to pump the cooling resource; and a second plurality of pumps, coupled to a cooling loop supply portion of the manifold, arranged in parallel in the chassis to pump the cooling resource, wherein the second plurality of pumps are arranged in series with the first plurality of pumps.