利索-全球专利检索

  1. 登录
  2. 注册

搜索结果

66 条记录 (耗时 0.022 秒)

    Taping apparatus for electronic components
    24.
    发明授权
    Taping apparatus for electronic components 失效
    电子元器件编带设备

    公开(公告)号：US06634159B1

    公开(公告)日：2003-10-21

    申请号：US09662175

    申请日：2000-09-14

    申请人： Kenichi Muto ,  Ryuichi Komatsu ,  Yasuhiro Tanaka ,  Akio Watanabe ,  Yasuhiro Oribe

    发明人： Kenichi Muto ,  Ryuichi Komatsu ,  Yasuhiro Tanaka ,  Akio Watanabe ,  Yasuhiro Oribe

    IPC分类号： B65B1504

    CPC分类号： B65B15/04 ,  B65B9/045 ,  H05K13/022

    摘要： Electronic computers are brought to a position for a pickup by the movement of a X-Y table, then picked up by suction and held by a holding tool, and transported by the rotation of a rotating table. Then, after the completion of a posture-recognition procedure by a sensing device, the electronic components held by the holding tool are stored one by one in storage compartments within a tape while position of the holding tool with respect to the tape being adjusted by the movement of the X-Y table based on the result of the position recognition. Thus, the electronic components are securely stored in the tape without sacrificing the efficiency of production.

    摘要翻译： 电子计算机通过X-Y工作台的移动被带到拾取位置，然后通过抽吸拾取并由保持工具保持，并通过旋转台的旋转传送。 然后，在通过感测装置完成姿态识别过程之后，由保持工具保持的电子部件一个接一个地存储在带内的存储隔间中，同时保持工具相对于带的位置由 基于位置识别结果的XY表的移动。 因此，电子部件被安全地存储在带中，而不牺牲生产效率。

    Integrated optical circuit for fiber-optics gyroscopes
    25.
    发明授权
    Integrated optical circuit for fiber-optics gyroscopes 失效
    光纤陀螺仪的集成光电路

    公开(公告)号：US5293439A

    公开(公告)日：1994-03-08

    申请号：US973004

    申请日：1992-11-10

    申请人： Hiroshi Mori ,  Akio Watanabe

    发明人： Hiroshi Mori ,  Akio Watanabe

    IPC分类号： G01C19/72 ,  G02B6/12 ,  G02B6/125 ,  G02B6/28 ,  G02B6/42

    CPC分类号： G02B6/12 ,  G01C19/725 ,  G02B6/125 ,  G02B6/2821 ,  G02B6/42 ,  G02B2006/1204 ,  G02B2006/12045 ,  G02B2006/12078 ,  G02B2006/2865

    摘要： An integrated optical circuit for fiber-optics gyroscopes comprising two pairs of waveguide conduits each having a pair of input/output ports on each of end surfaces of a substrate opposed to each other and a pair of directional couplers each disposed between the two waveguide conduits forming each of the pairs of waveguide conduits. The pair of the directional couplers are connected to each other through a waveguide conduit in which a polarizer is disposed in its course, the other waveguide conduits connected to the directional couplers have metal coatings in their courses and non-reflective coatings on an end surface of the substrate. This integrated optical circuit is capable of preventing electromagnetic beams from being radiated into the substrate and suppressing re-entry of radiated electromagnetic beams into the waveguide conduits.

    摘要翻译： 一种用于光纤陀螺仪的集成光学电路，包括两对波导管道，每对波导管道在彼此相对的基板的每个端面上具有一对输入/输出端口，以及一对定向耦合器，每个定向耦合器设置在两个波导管道之间，形成 每对波导管道。 一对定向耦合器通过波导管道相互连接，其中偏振器设置在其中，其中连接到定向耦合器的另一个波导导管在它们的行程中具有金属涂层，在端面上具有非反射涂层 底物。 该集成光电路能够防止电磁波辐射入衬底并抑制辐射电磁波束进入波导管道。

    Electronic component mounting apparatus
    27.
    发明授权
    Electronic component mounting apparatus 有权
    电子元件安装装置

    公开(公告)号：US08336195B2

    公开(公告)日：2012-12-25

    申请号：US12727349

    申请日：2010-03-19

    申请人： Akio Watanabe ,  Akihiro Kawai ,  Tetsuji Ono ,  Makio Kameda ,  Kazuyoshi Oyama ,  Kazuyoshi Ieizumi

    发明人： Akio Watanabe ,  Akihiro Kawai ,  Tetsuji Ono ,  Makio Kameda ,  Kazuyoshi Oyama ,  Kazuyoshi Ieizumi

    IPC分类号： B23P19/00

    CPC分类号： H05K13/0812 ,  H05K13/0215 ,  H05K13/0417 ,  Y10T29/49131 ,  Y10T29/53087 ,  Y10T29/53091 ,  Y10T29/53178 ,  Y10T29/53191

    摘要： The invention is directed to an unfailing pickup operation of an electronic component from a component storage portion at a seam of storage tapes connected even using a connection tape and prevention of reduction in a pickup rate of an electronic component. A CPU sends a feeding command to a component feeding unit to perform a component feeding operation or the like. Then, when the CPU judges that a connection tape reaches a pickup position, the CPU drives an X axis drive motor and a Y axis drive motor to move a board recognition camera to the pickup position of the feeding unit, the camera takes an image of a storage portion of a storage tape, and a recognition processing device performs recognition processing. A correction value based on a result of this recognition processing is stored in a RAM, and a suction nozzle is moved taking this correction value into account and lowers to pick up an electronic component.

    摘要翻译： 本发明涉及即使使用连接带连接的存储带的接缝处的部件存储部分中的电子部件的可靠的拾取操作，并且防止电子部件的拾取速率的降低。 CPU向组件供给单元发送进给命令以执行部件供给操作等。 然后，当CPU判断连接带到达拾取位置时，CPU驱动X轴驱动电动机和Y轴驱动电动机将板识别摄像机移动到馈送单元的拾取位置，摄像机拍摄图像 存储带的存储部分，以及识别处理装置执行识别处理。 将基于该识别处理的结果的校正值存储在RAM中，并且考虑到该校正值移动吸嘴并降低拾取电子部件。

    Electronic component mounting method
    28.
    发明授权
    Electronic component mounting method 有权
    电子元件安装方法

    公开(公告)号：US08181337B2

    公开(公告)日：2012-05-22

    申请号：US12349249

    申请日：2009-01-06

    申请人： Akio Watanabe ,  Akihiro Kawai ,  Tetsuji Ono ,  Makio Kameda ,  Kazuyoshi Oyama

    发明人： Akio Watanabe ,  Akihiro Kawai ,  Tetsuji Ono ,  Makio Kameda ,  Kazuyoshi Oyama

    IPC分类号： H01R43/00

    CPC分类号： H05K13/0215 ,  H05K13/0419 ,  H05K13/081 ,  Y10T29/4913 ,  Y10T29/49131 ,  Y10T29/49133 ,  Y10T29/49146 ,  Y10T29/53174 ,  Y10T29/53178

    摘要： A method of mounting electronic components on a printed board includes providing a storage tape including a first portion and a second portion that are connected by a connection tape and containing electronic components stored therein, advancing the storage tape so that an electronic component is advanced to a component pickup position where electronic components are picked up by a suction nozzle, picking up the advanced electronic component at the component pickup position by the suction nozzle, and mounting the picked up electronic component on a printed board. The advancing of the storage tape, the picking up of the electronic component and the mounting of the electronic component are repeated, and the component pickup position is adjusted when the second portion of the storage tape is advanced to the component pickup position.

    摘要翻译： 将电子部件安装在印刷电路板上的方法包括提供包括第一部分和第二部分的存储带，所述第一部分和第二部分通过连接带连接并包含存储在其中的电子部件，使存储带前进，使得电子部件前进到 部件拾取位置，其中电子部件由吸嘴吸取，通过吸嘴从部件拾取位置拾起高级电子部件，并将拾取的电子部件安装在印刷电路板上。 重复存储带的推进，电子部件的拾取和电子部件的安装，并且当存储带的第二部分前进到部件拾取位置时，调整部件拾取位置。

    Method and Device for Manufacturing Content-Filled Bottle
    29.
    发明申请
    Method and Device for Manufacturing Content-Filled Bottle 审中-公开
    制造内装瓶的方法和装置

    公开(公告)号：US20090218003A1

    公开(公告)日：2009-09-03

    申请号：US12226868

    申请日：2007-05-11

    申请人： Shunzo Miyazaki ,  Yasuhiro Sato ,  Hiroyuki Nakane ,  Akio Watanabe ,  Masaru Kimura ,  Tomoya Oosaka

    发明人： Shunzo Miyazaki ,  Yasuhiro Sato ,  Hiroyuki Nakane ,  Akio Watanabe ,  Masaru Kimura ,  Tomoya Oosaka

    IPC分类号： B67C3/14 ,  B67C3/24

    CPC分类号： B65D1/0276 ,  B29K2067/00 ,  B29L2031/7158 ,  B67C3/045 ,  B67C3/14 ,  B67C2003/226

    摘要： A method and device for manufacturing a content-filled bottle having an inversion part at its bottom. In producing the bottle, the inversion part is inverted to prevent deformation of a body part caused by a pressure reduction in the bottle, and as a result, inappropriate deformation and buckling of the bottle are prevented, enabling efficient manufacturing of the bottle with high quality. The bottle (3) is held from the outside by an empty-bottle chuck (41) of auxiliary device mounting means in such a way that the bottle (3) is held at its a mouth part (4) by the chuck along the upper surface of a flange part (10) of the bottle (3). Next, an empty-bottle support table (42) on which an assistance device (24) is placed is raised, the assistance device (24) is mounted on a bottom part (7) of the bottle (3), and the bottle (3) is placed on the empty-bottle support table (42). After that, with the empty bottle (3) held positioned by the empty-bottle chuck (41) and the empty-bottle support table (42), the inversion part (12) is projected to the outside of the body part (6) by a push-down member (54) of bottom projecting means. Then, the bottle (3) is filled with contents and sealed by a cap. The inverted part (12) is recessed into the body part (6), and the assistance device (24) is separated from the bottle (3).

    摘要翻译： 一种在其底部具有反转部分的内装瓶的制造方法和装置。 在生产瓶子时，反转部分被倒置以防止由于瓶子的压力降低引起的身体部位的变形，从而防止了瓶子的不适当的变形和弯曲，从而能够高效地制造具有高质量的瓶子 。 瓶子（3）通过辅助装置安装装置的空瓶卡盘（41）从外部保持，使得瓶子（3）沿着上部通过卡盘保持在其口部（4）处， 瓶子（3）的凸缘部分（10）的表面。 接着，升起在其上放置有辅助装置（24）的空瓶支撑台（42），辅助装置（24）安装在瓶（3）的底部（7）上，并且瓶 3）放置在空瓶支撑台（42）上。 之后，通过由空瓶卡盘（41）和空瓶支撑台（42）定位的空瓶（3），反转部（12）突出到主体部（6）的外侧， 通过底部突出装置的下推构件（54）。 然后，将瓶子（3）填充内容物并用盖子密封。 倒置部分（12）凹入主体部分（6）中，辅助装置（24）与瓶子（3）分离。

    ELECTRONIC COMPONENT MOUNTING APPARATUS
    30.
    发明申请
    ELECTRONIC COMPONENT MOUNTING APPARATUS 有权
    电子元件安装设备

    公开(公告)号：US20090119912A1

    公开(公告)日：2009-05-14

    申请号：US12349249

    申请日：2009-01-06

    申请人： Akio Watanabe ,  Akihiro Kawai ,  Tetsuji Ono ,  Makio Kameda ,  Kazuyoshi Oyama

    发明人： Akio Watanabe ,  Akihiro Kawai ,  Tetsuji Ono ,  Makio Kameda ,  Kazuyoshi Oyama

    IPC分类号： H05K3/30

    CPC分类号： H05K13/0215 ,  H05K13/0419 ,  H05K13/081 ,  Y10T29/4913 ,  Y10T29/49131 ,  Y10T29/49133 ,  Y10T29/49146 ,  Y10T29/53174 ,  Y10T29/53178

    摘要： This invention is directed to prevention of reduction of a pickup rate of an electronic component when a component feeding unit is dismounted from a feeder base and mounted back thereon. A CPU sends a feeding command to a component feeding unit feeding an electronic component belonging to a first step number, and drives a servomotor and a drive motor of the feeding unit to perform a component feeding operation and so on. After then, when the CPU judges that the feeding unit is dismounted from the feeder base and mounted back thereon, the CPU drives a X axis drive motor and a Y axis drive motor to move a board recognition camera to the pickup position of the feeding unit, the camera takes an image of a storage portion of a storage tape, and a recognition processing device performs recognition processing to the image. A correction value based on this recognition result is stored in a RAM, the X axis drive motor and the Y axis drive motor are driven taking this correction value into account, a vertical axis drive motor is driven, and a suction nozzle lowers and picks up the electronic component.

    摘要翻译： 本发明涉及防止当将元件供给单元从供料器基座上拆下并安装在其上时降低电子元件的拾取速度。 CPU向馈送属于第一步骤的电子部件的部件供给部发送进给命令，驱动供给部的伺服马达和驱动马达进行部件供给动作等。 然后，当CPU判断进给单元从进料器基座上卸下并安装在其上时，CPU驱动X轴驱动电机和Y轴驱动电机将板识别摄像机移动到进给单元的拾取位置 相机拍摄存储带的存储部分的图像，并且识别处理装置对图像执行识别处理。 基于该识别结果的校正值存储在RAM中，考虑到该修正值来驱动X轴驱动电动机和Y轴驱动电动机，驱动垂直轴驱动电动机，吸嘴降低并取出 电子元件。