摘要:
A semiconductor laminating portion including a light emitting layer forming portion having at least an n-type layer and a p-type layer is formed on a semiconductor substrate. A current blocking layer is partially formed on its surface while a current diffusing electrode is formed on the entire surface thereof. The current diffusing electrode is patterned into a plurality of light emitting unit portions (A), electrode pad portion (B), and connecting portions (C) for connecting between the electrode pad portion (B) and the light emitting unit portions (A) or between two of the light emitting unit portions (A), and a part of the semiconductor laminating portion may be etched according to the patterning of the current diffusing electrode. The bonding electrode may be formed on the electrode pad portion (B) which is formed so as to make the light emitting layer forming portion non-luminous.
摘要:
A semiconductor laminating portion including a light emitting layer forming portion having at least an n-type layer and a p-type layer is formed on a semiconductor substrate. A current blocking layer is partially formed on its surface. A current diffusing electrode is formed on the entire surface thereof. A bonding electrode is formed thereon. The semiconductor laminating portion and the current diffusing electrode are separated into light emitting unit portions A, electrode pad portion B, and connecting portions C for connecting between electrode pad portion B and light emitting unit portions A or between two of the light emitting unit portions A, and the semiconductor laminating portion between the light emitting unit portions A is removed through etching to make clearances except for connecting portions C. The bonding electrode is formed on electrode pad portion B.
摘要:
A turntable can be manufactured inexpensively using a comparatively inexpensive material and in accordance with ordinary injection molding technique and mold management. A thin-walled cylindrical fixing portion having an insertion hole, into which a rotational shaft is pressed, is formed at a central portion of the turntable. A thin-walled cylindrical reinforcing portion, which is concentric with the fixing portion and has a large diameter, is formed at the outer circumferential side of the fixing portion. Reinforcing rib portions are provided radially between the fixing portion and the reinforcing portion. In this way, deformation due to sink or the like does not occur at the time of injection molding, and extracting force of the rotational shaft which was pressed into the insertion hole can be adjusted to a predetermined value.
摘要:
A light emitting layer forming portion (9) comprising InGaAlP based compound semiconductor and forming a light emitting layer is deposited on an n-type GaAs substrate (1), a p-type current dispersion layer (5) comprising AlGaAs based compound semiconductor is provided on a surface of the light emitting layer forming portion (9), a p-side electrode (7) is provided on a portion of a surface of the current dispersion layer (5) through a contact layer (6) comprising p-type GaAs, and an n-side electrode (8) is provided on a back. surface of the GaAs substrate (1). Vickers' hardness of the current dispersion layer (5) comprising AlGaAs is 700 or higher. As a result, at the time of handling for mounting, or wire bonding, a fracture or a crack is not generated in the LED chip, and it is possible to enhance the yield of assembling steps.
摘要:
A semiconductor light emitting device is disclosed. An emitting layer forming portion for forming an emitting layer made of a compound semiconductor of AlGaInP group or AlGaAs group including a n-type layer, an active layer and a p-type layer laid one on another is formed on a GaAs substrate. Further, a current diffusion layer of GaP is formed on the front surface of the emitting layer forming portion. The p-type layer between the active layer and the current diffusion layer is formed to the thickness of not less than about 2 &mgr;m, or the current diffusion layer is formed to the thickness of about 3 to 7 &mgr;m. As a result, the semiconductor light emitting device of a high luminance is thus realized, in which the distortion due to the lattice mismatch has no effect on the emitting layer.
摘要:
A light emitting layer forming portion is formed of an AlGaInP-based compound semiconductor and having an n-type layer and a p-type layer to form a light emitting layer on the substrate. A large bandgap energy semiconductor layer is provided on a surface of the light emitting layer forming portion to constitute a window layer. A buffer layer is interposed between the light emitting layer forming portion and the large bandgap energy semiconductor layer to relieve lattice mismatch of between the light emitting layer forming portion and the large bandgap energy semiconductor layer. The interposition of this buffer layer provides a light emitting device that is high in light emitting efficiency and excellent in electrical characteristics without degrading the film property of the window layer.
摘要:
After fillet surfaces have been generated with respect to surfaces, a joint surface is generated between the fillet surface. New fillet surfaces are determined from the fillet surfaces and the joint surface. Then, a phase relationship is established between data relative to the surfaces and data relative to the new fillet surfaces, and these data are combined into shape data including data of fillet surfaces which are capable of representing the complete shape of a product.
摘要:
A MIDI apparatus and a MIDI system wherein an operation ON signal for starting operation to a MIDI instrument and an operation OFF signal for stopping the operation are obtained and supplied to the MIDI instrument in response to a MIDI format signal included in a subcode signal generated during play of a record medium play apparatus. If the play state of the record medium play apparatus becomes discontinuous, such as a pause after the operation ON signal is supplied to the MIDI instrument and before the operation OFF signal corresponding to the operation ON signal is obtained, the operation OFF signal is forcedly supplied to the MIDI instrument. Thereby such the sound of the MIDI instrument is stopped when there is a discontinuous play state after the operation ON signal is supplied to the MIDI instrument and before the operation OFF signal corresponding to the operation ON signal would ordinarily be supplied.
摘要:
A money receiving and disbursing machine includes a switch for initiating a dispensing operation in which bills sorted in money cases and a money receiving and disbursing box, a first pick-out device for taking out the bills in the money cases where a quantity of the bills in the money cases is more than a predetermined value after the switch is turned on, a first discriminating device for discriminating the bills from the money cases, a second pick-out device for taking out the bills in the box where the quantity of the bills in the money cases is not more than the predetermined value after the switch is turned on, a second discriminating device discriminating the bills from the box, a conveying device for conveying normal bills to a transaction window, for rejecting abnormal bills in accordance with a result of the first discriminating device, and for conveying normal bills to the money cases of corresponding denominations and for rejecting abnormal bills in accordance with a result in the second discriminaitng device, and a controller for counting the quantity of the normal bills conveyed by the coveying device to stop an operation of the first pick-out device when the quantity of the normal bills is an exact quantity for a set of bills and for counting the quantity of bills to the money cases from the box to stop an operation of the second pick-out device when the quantity of bills in the money cases reaches the predetermined quantity.
摘要:
It is known that a sectional shape of a spring wire can be formed into an oval made by a semicircle and a semiellipse. However, it has been found that such a shape is not the best obtainable, and that stress distribution can be improved by increasing the diameter of the spring wire slightly in a portion where the stress is greatest, along the semielliptical surface. Parameters are disclosed for determining dimensions that result in increased energy efficiency.