公开(公告)号：US20210376437A1

公开(公告)日：2021-12-02

申请号：US17403571

申请日：2021-08-16

Applicant: Intel Corporation

Inventor： Aleksandar Aleksov ,  Georgios C. Dogiamis ,  Telesphor Kamgaing ,  Sasha N. Oster ,  Adel A. Elsherbini ,  Shawna M. Liff ,  Johanna M. Swan ,  Brandon M. Rawlings ,  Richard J. Dischler

IPC: H01P3/16 ,  H01P11/00 ,  H01P3/12 ,  H01Q9/04

Abstract: A method of forming a waveguide comprises forming an elongate waveguide core including a dielectric material; and arranging a conductive sheet around an outside surface of the dielectric core to produce a conductive layer around the waveguide core.

公开(公告)号：US11095012B2

公开(公告)日：2021-08-17

申请号：US16329587

申请日：2016-09-30

Applicant: Intel Corporation

Inventor： Aleksandar Aleksov ,  Georgios C. Dogiamis ,  Telesphor Kamgaing ,  Sasha N. Oster ,  Adel A. Elsherbini ,  Shawna M. Liff ,  Johanna M. Swan ,  Brandon M. Rawlings ,  Richard J. Dischler

IPC: H01P3/16 ,  H01P11/00 ,  H01P3/12 ,  H01Q9/04 ,  H04L29/08

Abstract: A method of forming a waveguide comprises forming an elongate waveguide core including a dielectric material; and arranging a conductive sheet around an outside surface of the dielectric core to produce a conductive layer around the waveguide core.

公开(公告)号：US10593636B2

公开(公告)日：2020-03-17

申请号：US16127820

申请日：2018-09-11

Applicant: Intel Corporation

Inventor： Georgios C. Dogiamis ,  Sasha N. Oster ,  Telesphor Kamgaing ,  Adel A. Elsherbini ,  Brandon M. Rawlings ,  Feras Eid

IPC: H01L23/36 ,  H01L23/66 ,  H01L23/498 ,  H01L23/367 ,  H01L23/538 ,  H01L23/00 ,  H01L25/065

Abstract: Embodiments of the invention may include a packaged device that includes thermally stable radio frequency integrated circuits (RFICs). In one embodiment the packaged device may include an integrated circuit chip mounted to a package substrate. According to an embodiment, the package substrate may have conductive lines that communicatively couple the integrated circuit chip to one or more external components. One of the external components may be an RFIC module. The RFIC module may comprise an RFIC and an antenna. Additional embodiments may also include a packaged device that includes a plurality of cooling spots formed into the package substrate. In an embodiment the cooling spots may be formed proximate to interconnect lines the communicatively couple the integrated circuit chip to the RFIC.

公开(公告)号：US10187998B2

公开(公告)日：2019-01-22

申请号：US15621403

申请日：2017-06-13

Applicant: Intel Corporation

Inventor： Brandon M. Rawlings ,  Henning Braunisch

IPC: H05K1/11 ,  H05K3/40 ,  H05K3/00 ,  H05K3/46 ,  H05K3/42

Abstract: A photoresist is deposited on a seed layer on a substrate. A first region of the photoresist is removed to expose a first portion of the seed layer to form a via-pad structure. A first conductive layer is deposited onto the first portion of the seed layer. A second region of the photoresist adjacent to the first region is removed to expose a second portion of the seed layer to form a line. A second conductive layer is deposited onto the first conductive layer and the second portion of the seed layer.

公开(公告)号：US20180097269A1

公开(公告)日：2018-04-05

申请号：US15282086

申请日：2016-09-30

Applicant: Intel Corporation

Inventor： Georgios C. Dogiamis ,  Sasha Oster ,  Telesphor Kamgaing ,  Adel A. Elsherbini ,  Johanna M. Swan ,  Shawna M. Liff ,  Aleksandar Aleksov ,  Brandon M. Rawlings ,  Richard J. Dischler

IPC: H01P3/16 ,  G06F1/18

CPC classification number: H01P3/122 ,  G06F1/182 ,  H01P3/14 ,  H01P3/16 ,  H01P11/006

Abstract: An apparatus comprises a plurality of waveguides, wherein the waveguides include a dielectric material; an outer shell; and a supporting feature within the outer shell, wherein the waveguides are arranged separate from each other within the outer shell by the supporting feature.

公开(公告)号：US20250006695A1

公开(公告)日：2025-01-02

申请号：US18344260

申请日：2023-06-29

Applicant: Intel Corporation

Inventor： Bhaskar Jyoti Krishnatreya ,  Adel A. Elsherbini ,  Brandon M. Rawlings ,  Kimin Jun ,  Omkar G. Karhade ,  Mohit Bhatia ,  Nitin A. Deshpande ,  Prashant Majhi ,  Johanna M. Swan

IPC: H01L25/065 ,  H01L23/00 ,  H01L23/31 ,  H01L23/48

Abstract: Microelectronic assemblies, related devices and methods, are disclosed herein. In some embodiments, a microelectronic assembly may include a first layer with a first die having a first contact; a second die having a second contact; and a pad layer, on the first and second dies, including a first pad and a second pad, where the first pad is coupled to and offset from the first contact in a first direction, and the second pad is coupled to and is offset from the second contact in a second direction different than the first direction; and a second layer including a third die having third and fourth contacts, where the first layer is coupled to the second layer by metal-to-metal bonds and fusion bonds, the first contact is coupled to the third contact by the first pad, and the second contact is coupled to the fourth contact by the second pad.

公开(公告)号：US12183961B2

公开(公告)日：2024-12-31

申请号：US17403571

申请日：2021-08-16

Applicant: Intel Corporation

Inventor： Aleksandar Aleksov ,  Georgios C. Dogiamis ,  Telesphor Kamgaing ,  Sasha N. Oster ,  Adel A. Elsherbini ,  Shawna M. Liff ,  Johanna M. Swan ,  Brandon M. Rawlings ,  Richard J. Dischler

IPC: H01P3/16 ,  H01P3/12 ,  H01P11/00 ,  H01Q9/04 ,  H04L67/10

Abstract: A method of forming a waveguide comprises forming an elongate waveguide core including a dielectric material; and arranging a conductive sheet around an outside surface of the dielectric core to produce a conductive layer around the waveguide core.

公开(公告)号：US11527501B1

公开(公告)日：2022-12-13

申请号：US17122934

申请日：2020-12-15

Applicant: Intel Corporation

Inventor： Adel A. Elsherbini ,  Veronica Aleman Strong ,  Shawna M. Liff ,  Brandon M. Rawlings ,  Jagat Shakya ,  Johanna M. Swan ,  David M. Craig ,  Jeremy Alan Streifer ,  Brennen Karl Mueller

IPC: H01L23/00 ,  H01L21/18 ,  B81B7/00

Abstract: Microelectronic assemblies, related devices and methods, are disclosed herein. In some embodiments, a microelectronic assembly may include a first microelectronic component having a first direct bonding region, wherein the first direct bonding region includes first metal contacts and a first dielectric material between adjacent ones of the first metal contacts; a second microelectronic component having a second direct bonding region and coupled to the first microelectronic component by the first and second direct bonding regions, wherein the second direct bonding region includes second metal contacts and a second dielectric material between adjacent ones of the second metal contacts, and wherein individual first metal contacts in the first direct bonding region are coupled to respective individual second metal contacts in the second direct bonding region; and a void between an individual first metal contact and a respective individual second metal contact.

公开(公告)号：US11024933B2

公开(公告)日：2021-06-01

申请号：US16325351

申请日：2016-09-30

Applicant: Intel Corporation

Inventor： Brandon M. Rawlings ,  Shawna M. Liff ,  Sasha N. Oster ,  Georgios C. Dogiamis ,  Telesphor Kamgaing ,  Adel A. Elsherbini ,  Aleksandar Aleksov ,  Johanna M. Swan ,  Richard J. Dischler

IPC: H01P3/16 ,  H01P3/12 ,  H01P3/123 ,  H01P3/14 ,  H01P11/00

Abstract: A method of making a waveguide, comprises: extruding a first dielectric material as a waveguide core of the waveguide, wherein the waveguide core is elongate; and coextruding an outer layer with the waveguide core, wherein the outer layer is arranged around the waveguide core.

公开(公告)号：US10452571B2

公开(公告)日：2019-10-22

申请号：US15746318

申请日：2015-09-25

Applicant: Intel Corporation

Inventor： Sasha N. Oster ,  Telesphor Kamgaing ,  Adel A. Elsherbini ,  Georgios C. Dogiamis ,  Brandon M. Rawlings

IPC: G06F13/14 ,  G06F13/00 ,  H04M9/06 ,  G06F3/14

Abstract: Microelectronic package communications are described that use radio interfaces that are connected through waveguides. One example includes an integrated circuit chip, a package substrate to carry the integrated circuit chip, the package substrate having conductive connectors to connect the integrated circuit chip to external components, and a radio on the package substrate coupled to the radio chip to modulate the data over a carrier and to transmit the modulated data. A waveguide connector is coupled to a dielectric waveguide to receive the transmitted modulated data from the radio and to couple it into the waveguide, the waveguide carries the modulated data to an external component.