DUAL FEED COLD SPRAY NOZZLE WITH SEPARATE TEMPERATURE AND FEEDING RATE CONTROL

    公开(公告)号:US20230285999A1

    公开(公告)日:2023-09-14

    申请号:US17694302

    申请日:2022-03-14

    CPC classification number: B05B7/1486 B05B7/1626

    Abstract: Cold-spray nozzles, systems, and techniques are described herein related to manufacturing implementations of efficient film deposition. A deposition system includes multiple feed systems to deliver solid powder materials at controlled feed rates and temperatures, and a nozzle, including convergent and divergent sections and connections to the feed systems, to receive a carrier fluid in the convergent section and to spray the carrier fluid and the solid powder materials out of the divergent section. A nozzle includes multiple ports to receive solid powder materials for admission into a carrier fluid, with one or more ports in the convergent section and one or more ports in the divergent section. A method may include delivering a carrier fluid to a nozzle, heating multiple solid powder materials, delivering these solid powder materials to the nozzle, and spraying the solid powder materials out of a divergent section of the nozzle.

    Package with thermal interface material retaining structures on die and heat spreader

    公开(公告)号:US11387161B2

    公开(公告)日:2022-07-12

    申请号:US16651329

    申请日:2017-09-30

    Inventor: Feras Eid

    Abstract: A device package and a method of forming a device package are described. The device package includes a lid with one or more legs on an outer periphery of the lid, a top surface, and a bottom surface, where the lid is disposed on the substrate. The legs of the lid are attached to the substrate with a sealant. The device package also has one or more dies disposed on the substrate. The die(s) are below the bottom surface of the lid, where each of the dies has a top surface and a bottom surface. The device package further includes a retaining structure disposed between the bottom surface of the lid and the top surface of the die, where the retaining structure has one or more inner walls. The device package includes a thermal interface material disposed within the inner walls of the retaining structure and above the top surface of the die.

    CARRIER FOR MICROELECTRONIC ASSEMBLIES HAVING DIRECT BONDING

    公开(公告)号:US20220199450A1

    公开(公告)日:2022-06-23

    申请号:US17132429

    申请日:2020-12-23

    Abstract: Described herein are carrier assemblies, and related devices and methods. In some embodiments, a carrier assembly includes a carrier; a textured material including texturized microstructures coupled to the carrier; and microelectronic components mechanically coupled to the texturized microstructures. In some embodiments, a carrier assembly includes a carrier having a front side and a back side; an electrode on the front side of the carrier; a dielectric material on the electrode; a charging contact on the back side coupled to the electrode; and microelectronic components electrostatically coupled to the front side of the carrier. In some embodiments, a carrier assembly includes a carrier having a front side and a back side; electrodes on the front side; a dielectric material including texturized microstructures on the electrodes; charging contacts on the back side coupled to the plurality of electrodes; and microelectronic components mechanically and electrostatically coupled to the front side of the carrier.

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