公开(公告)号：US20230268286A1

公开(公告)日：2023-08-24

申请号：US17679185

申请日：2022-02-24

Applicant: Intel Corporation

Inventor： Mohan Prashanth Javare Gowda ,  Stephan Stoeckl ,  Thomas Wagner ,  Sonja Koller ,  Wolfgang Molzer ,  Pouya Talebbeydokhti

IPC: H01L23/552 ,  H01L23/498

CPC classification number: H01L23/552 ,  H01L23/49822 ,  H01L23/49827

Abstract: Embodiments of a microelectronic assembly comprise a package substrate, including: a first layer comprising a first plurality of mutually parallel channels of a first material; a second layer comprising columns of the first material; and a third layer comprising a second plurality of mutually parallel channels of the first material. The second layer is between the first layer and the third layer, at least some columns extend between and contact the first plurality of mutually parallel channels and the second plurality of mutually parallel channels, and at least a portion of the first layer, the second layer, and the third layer comprises a second material different from the first material.

公开(公告)号：US20220294115A1

公开(公告)日：2022-09-15

申请号：US17831151

申请日：2022-06-02

Applicant: Intel Corporation

Inventor： Andreas Augustin ,  Sonja Koller ,  Bernd Waidhas ,  Georg Seidemann ,  Andreas Wolter ,  Stephan Stoecki ,  Thomas Wagner ,  Josef Hagn

IPC: H01Q9/04 ,  H01L23/00 ,  H01Q1/22 ,  H01Q21/06

Abstract: A patch antenna array is fabricated with a package-on-package setup that contains a transceiver. The patch antenna array has a footprint that intersects the transceiver footprint. The package-on-package setup includes through-mold vias that couple to a redistribution layer disposed between the patch antennas and the package-on-package setup.

公开(公告)号：US20220015244A1

公开(公告)日：2022-01-13

申请号：US17486462

申请日：2021-09-27

Applicant: Intel Corporation

Inventor： Georg Seidemann ,  Sonja Koller ,  Bernd Waidhas

IPC: H05K3/34 ,  H01L23/498

Abstract: A printed wiring-board island relieves added complexity to a printed circuit board. The printed wiring-board island creates an island form factor in the printed circuit board. Coupling of a semiconductive device package to the printed wiring-board island includes a ball-grid array. The ball-grid array can at least partially penetrate the printed wiring-board island.

公开(公告)号：US20160224148A1

公开(公告)日：2016-08-04

申请号：US14778142

申请日：2014-12-16

Applicant: Intel Corporation

Inventor： Sven ALBERS ,  Klaus Reingruber ,  Teodora Ossiander ,  Andreas Wolter ,  Sonja Koller ,  Georg Seidemann ,  Jan Proschwitz ,  Hans-Joachim Barth ,  Bastiaan Elshof

IPC: G06F3/044 ,  H04B1/3827

CPC classification number: G06F3/044 ,  G01L1/24 ,  G06F1/163 ,  G06F3/03547 ,  G06F3/038 ,  G06F3/042 ,  G06F3/045 ,  G06F2203/04102 ,  G06F2203/04109 ,  H04B1/385

Abstract: Some forms relate to wearable computing devices that include a “touch pad” like interface. In some forms, the example wearable computing devices may be integrated with (or attached to) textiles (i.e. clothing). In other forms, the example wearable computing devices may be attached directly to the skin of someone (i.e., similar to a bandage) that utilizes any of the example wearable computing devices. The example wearable computing devices include a flexible touch pad that may allow a user of the wearable computing device to more easily operate the wearable computing device. The example wearable computing devices described herein may include a variety of electronics. Some examples include a power supply and/or a communication device among other types of electronics.

Abstract translation: 一些形式涉及包括诸如接口的“触摸板”的可穿戴计算设备。 在一些形式中，可穿戴式计算设备的示例可以与（或附着）纺织品（即服装）集成。 在其他形式中，可穿戴式计算设备的示例可以直接附接到使用任何示例性可穿戴计算设备的某人的皮肤（即类似于绷带）。 示例性可穿戴计算设备包括柔性触摸板，其可以允许可穿戴计算设备的用户更容易地操作可穿戴式计算设备。 本文所述的示例性可穿戴计算设备可以包括各种电子设备。 一些示例包括电源和/或其他类型的电子设备中的通信设备。