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公开(公告)号：US11178473B1
公开(公告)日：2021-11-16
申请号：US16894611
申请日：2020-06-05
Applicant: INPHI CORPORATION
Inventor： Radhakrishnan L. Nagarajan , Liang Ding , Mark Patterson , Roberto Coccioli , Steve Aboagye
Abstract: A co-packaged optical-electrical module includes a module substrate with a minimum lateral dimension no greater than 100 mm. The co-packaged optical-electrical module further includes a main die with a processor chip disposed at a central region of the module substrate, the processor chip being configured to operate with a digital-signal processing (DSP) interface for extra-short-reach data interconnect. Additionally, the co-packaged optical-electrical module includes a plurality of chiplet dies disposed densely along a peripheral region of the module substrate. Each chiplet die is configured to be self-packaged light engine on a sub-module substrate with a minimum lateral dimension to allow a maximum number of chiplet dies on the module substrate with a distance of any chiplet die from the main die smaller than 50 mm for extra-short-reach interconnect operation.
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公开(公告)号：US11109515B1
公开(公告)日：2021-08-31
申请号：US16894639
申请日：2020-06-05
Applicant: INPHI CORPORATION
Inventor： Radhakrishnan L. Nagarajan , Liang Ding , Mark Patterson , Roberto Coccioli , Steve Aboagye
Abstract: An integrated heatsink for a co-packaged optical-electrical module includes a base plate attached on top of a co-packaged optical-electrical module. The integrated heatsink further includes a plurality of fin structures extended upward from the base plate except a central cavity region with missing sections of fins, each fin extended along an axial direction from a front edge to a back edge of the base plate except some trenches shallow in depth across some fin structures and some other trenches deep in depth down to the base plate either along or across some fin structures. Additionally, the integrated heatsink includes multiple heat pipes including shaped portions embedded in the trenches in the plurality of fin structures. At least one bottom horizontal portion per heat pipe is brazed to the base plate in a corresponding region that is superimposed on hot spots of the co-packaged optical-electrical module under the base plate.
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公开(公告)号：US10951003B1
公开(公告)日：2021-03-16
申请号：US16800974
申请日：2020-02-25
Applicant: Inphi Corporation
Inventor： Xiaoguang He , Radhakrishnan L. Nagarajan
IPC: H04B10/00 , H01S5/00 , H01S5/022 , H01S5/02 , H01S5/323 , H04B10/27 , H04B10/07 , G01R31/26 , G02B6/12 , H01S5/12
Abstract: A light source based on integrated silicon photonics includes a die of a silicon substrate having at least one chip site configured with a surface region, a trench region, and a first stopper region located separately between the surface region and the trench region. The trench region is configured to be a depth lower than the surface region. The light source includes a laser diode chip having a p-side facing the chip site and a n-side being distal to the chip site. The p-side includes a gain region bonded to the trench region, an electrode region bonded to the surface region, and an isolation region engaged with the stopper region to isolate the gain region from the electrode region. The light source also includes a conductor layer in the die configured to connect the gain region to an anode electrode and separately connect the electrode region to a cathode electrode.
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公开(公告)号：US10942323B1
公开(公告)日：2021-03-09
申请号：US16578090
申请日：2019-09-20
Applicant: INPHI CORPORATION
Inventor： Chris Togami , Radhakrishnan L. Nagarajan , Gary Sasser , Brian Taylor
Abstract: An apparatus for dissipating heat from a photonic transceiver module. The apparatus includes a top-plate member disposed in a length direction of a package for the photonic transceiver module. The apparatus further includes multiple fins formed on the top-plate member along the length direction from a backend position to a frontend position except at least one fin with a shorter length, forming an elongated void from the backend position to one backend of the at least one fin. Additionally, the apparatus includes a cover member disposed over the multiple fins with a horizontal sheet, two vertical side sheets, and a flange bent vertically from a middle portion of backend of the horizontal sheet. Furthermore, the apparatus includes a spring loaded in the elongated void between the flange and the one backend of the at least one fin to minimize an air gap at the backend of the horizontal sheet.
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公开(公告)号：US10826621B2
公开(公告)日：2020-11-03
申请号：US16720472
申请日：2019-12-19
Applicant: INPHI CORPORATION
Inventor： Todd Rope , Sung Choi , James Stewart , Radhakrishnan L. Nagarajan , Paul Yu , Ilya Lyubomirsky
IPC: H04B10/079 , H04B10/61 , H04B10/67 , H04B10/69 , H04L27/18 , G02B6/12 , G02B6/293 , H04B17/20 , H04L27/06
Abstract: The present invention is directed to a communication signal tracking system comprising an optical receiver including one or more delay line interferometers (DLIs) configured to demultiplex incoming optical signals and a transimpedance amplifier configured to convert the incoming optical signals to incoming electrical signals. The communication signal tracking system further includes a control module configured to calculate a bit-error-rate (BER) of the incoming electrical signals before forward-error correction decoding, and use the BER as a parameter for optimizing settings of the one or more DLIs in one or more iterations in a control loop and generating a back-channel data.
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Patent Agency Ranking
公开(公告)号：US10826613B1
公开(公告)日：2020-11-03
申请号：US16706450
申请日：2019-12-06
Applicant: INPHI CORPORATION
Inventor： Ding Liang , Mark Patterson , Roberto Coccioli , Radhakrishnan L. Nagarajan
Abstract: An integrated compact light engine configured in a on-board in-package optics assembly. The compact light engine includes a single substrate to integrate multiple optical-electrical modules. Each optical-electrical module includes an integrated optical transceiver based on silicon-photonics platform, in which a transmit path configured to output four light signals centered at four CWDM wavelengths and from four laser devices and to modulate the four light signals respectively by four modulators driven by a driver chipand to deliver a multiplexed transmission light. A receive path includes a photodetector to detect four input signals demultiplexed from an incoming light and a trans-impedance amplifier chip to process electrical signals converted from the four input signals detected. A multi-channel light engine is formed by co-integrating or co-mounting a switch device with multiple compact light engines on a common substrate member to provide up to 51.2 Tbit/s total capacity of data communication with median-or-short-reach electrical interconnect.
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公开(公告)号：US10425164B2
公开(公告)日：2019-09-24
申请号：US16146936
申请日：2018-09-28
Applicant: INPHI CORPORATION
Inventor： Todd Rope , Radhakrishnan L. Nagarajan , Hari Shankar
IPC: H04B10/516 , G02F1/01 , G02F1/225 , H01S5/0687 , H01S5/40 , H04B10/50 , H01S5/14 , H04J14/02 , H04B10/556 , G02F1/025 , H01S3/067 , H01S5/00 , G02F1/21
Abstract: The present invention relates to telecommunication techniques and integrated circuit (IC) devices. More specifically, embodiments of the present invention provide an off-quadrature modulation system. Once an off-quadrature modulation position is determined, a ratio between DC power transfer amplitude and dither tone amplitude for a modulator is as a control loop target to stabilize off-quadrature modulation. DC power transfer amplitude is obtained by measuring and sampling the output of an optical modulator. Dither tone amplitude is obtained by measuring and sampling the modulator output and performing calculation using the optical modulator output values and corresponding dither tone values. There are other embodiments as well.
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公开(公告)号：US10274688B2
公开(公告)日：2019-04-30
申请号：US16013737
申请日：2018-06-20
Applicant: INPHI CORPORATION
Inventor： Radhakrishnan L. Nagarajan , Peng-Chih Li , Masaki Kato
IPC: G02B6/42 , H04B10/40 , H04B10/516
Abstract: A photonic transceiver apparatus in QSFP package. The apparatus includes a case having a base member, two partial side members, and a lid member to provide a spatial volume with an opening at a back end of the base member. Additionally, the apparatus includes a PCB, installed inside the spatial volume over the base member having a pluggable electrical connector at the back end. Further, the apparatus includes multiple optical transmitting devices in mini-transmit-optical-sub-assembly package, each being mounted on a common support structure and having a laser output port in reversed orientation toward the back end. Furthermore, the apparatus includes a silicon photonics chip, including a fiber-to-silicon attachment module, mounted on the PCB and coupled to a modulation driver module and a trans-impedance amplifier module. Moreover, the apparatus includes a pair of optical input/output ports being back connected to the fiber-to-silicon attachment module.
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公开(公告)号：US10133004B2
公开(公告)日：2018-11-20
申请号：US15928732
申请日：2018-03-22
Applicant: INPHI CORPORATION
Inventor： Masaki Kato , Radhakrishnan L. Nagarajan
Abstract: An apparatus for converting fiber mode to waveguide mode. The apparatus includes a silicon substrate member and a dielectric member having an elongated body. Part of the elongated body from a back end overlies the silicon substrate member and remaining part of the elongated body up to a front end is separated from the silicon substrate member by a second dielectric material at an under region. The apparatus also includes a waveguide including a segment from the back end to a tail end formed on the dielectric member at least partially overlying the remaining part of the elongated body. The segment is buried in a cladding overlying entirely the dielectric member. The cladding has a refractive index that is less than the waveguide but includes an index-graded section with decreasing index that is formed at least over the segment from the tail end toward the back end.
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公开(公告)号：US10116393B2
公开(公告)日：2018-10-30
申请号：US15976659
申请日：2018-05-10
Applicant: INPHI CORPORATION
Inventor： Radhakrishnan L. Nagarajan , Todd Rope
Abstract: A single chip dual-channel driver for two independent traveling wave modulators. The driver includes two differential pairs inputs per channel respectively configured to receive two digital differential pair signals. The driver further includes a two-bit DAC per channel coupled to the two differential pairs inputs to produce a single analog differential pair PAM signal at a differential pair output for driving a traveling wave modulator. Additionally, the driver includes a control block having internal voltage/current signal generators respective coupled to each input and the 2-bit DAC for providing a bias voltage, a tail current, a dither signal to assist modulation control per channel. Furthermore, the driver includes an internal I2C communication block coupled to a high-speed clock generator to generate control signals to the control block and coupled to host via an I2C digital communication interface.
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