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    CAMERA ALIGNMENT AND MOUNTING STRUCTURES
    21.
    发明申请
    CAMERA ALIGNMENT AND MOUNTING STRUCTURES 有权
    相机对准和安装结构

    公开(公告)号：US20110255000A1

    公开(公告)日：2011-10-20

    申请号：US12794664

    申请日：2010-06-04

    Applicant: Trent Weber ,  Scott Myers ,  David A. Pakula ,  Matthew Hill ,  Erik L. Wang ,  Richard Hung Minh Dinh

    Inventor： Trent Weber ,  Scott Myers ,  David A. Pakula ,  Matthew Hill ,  Erik L. Wang ,  Richard Hung Minh Dinh

    IPC: H04N5/225 ,  B23K26/38 ,  G03B17/02

    CPC classification number: G03B17/02 ,  B23K26/351 ,  H04N5/2251

    Abstract: An electronic device may be provided with a housing. A camera module may be mounted within the housing. The housing may have a camera window with which a lens in the camera module is aligned. To rotationally and laterally align the camera module with respect to the camera window and the electronic device housing, an alignment structure may be mounted to the housing in alignment with the camera window and housing. The alignment structure may be formed form a ring-shaped structure with an opening. The alignment structures may have sidewalls that form an alignment groove for the camera module. The camera window may be formed from a circular opening in a layer of opaque material deposited on a transparent housing member such as a planar layer of glass. During the process, a laser tool may be used to trim the opening in the opaque material.

    Abstract translation: 电子设备可以设置有壳体。 相机模块可以安装在壳体内。 外壳可以具有相机窗口，照相机模块中的透镜与其对准。 为了相对于照相机窗口和电子设备外壳旋转和横向对准照相机模块，对准结构可以安装到壳体上，与摄像机窗口和外壳对准。 对准结构可以形成为具有开口的环形结构。 对准结构可以具有形成相机模块的对准凹槽的侧壁。 相机窗口可以由沉积在诸如平面玻璃层的透明外壳构件上的不透明材料层中的圆形开口形成。 在该过程中，可以使用激光工具来修整不透明材料中的开口。

    DISPLAY MODULES
    22.
    发明申请
    DISPLAY MODULES 有权
    显示模块

    公开(公告)号：US20110012873A1

    公开(公告)日：2011-01-20

    申请号：US12608928

    申请日：2009-10-29

    Applicant: Christopher D. Prest ,  Stephen P. Zadesky ,  David A. Pakula

    Inventor： Christopher D. Prest ,  Stephen P. Zadesky ,  David A. Pakula

    IPC: G09G5/00 ,  B60S1/60 ,  H01J9/26 ,  H01L21/00

    CPC classification number: H01L51/5237 ,  H01L51/5243 ,  H01L51/5246

    Abstract: An electronic device may have a display. The display may have active components such as display pixels formed on a display substrate layer. The display substrate layer may be formed from a glass substrate layer. Thin-film transistors and other components for the display pixels may be formed on the glass substrate. An encapsulation glass layer may be bonded to the glass substrate using a ring-shaped bond structure. The ring-shaped bond structure may extend around the periphery of the encapsulation glass layer and the substrate glass layer. The bond structure may be formed from a glass frit, a solid glass ring, integral raised glass portions of the glass layers, meltable metal alloys, or other bond materials. Chemical and physical processing operations may be used to temper the glass layers, to perform annealing operations, to preheat the glass layers, and to promote adhesion.

    Abstract translation: 电子设备可以具有显示器。 显示器可以具有诸如形成在显示基板层上的显示像素的有源部件。 显示基板层可以由玻璃基板层形成。 可以在玻璃基板上形成用于显示像素的薄膜晶体管和其它部件。 可以使用环形粘结结构将包封玻璃层结合到玻璃基板。 环形结合结构可以围绕封装玻璃层和基板玻璃层的周边延伸。 粘结结构可以由玻璃料，固体玻璃环，玻璃层的一体凸起玻璃部分，可熔融金属合金或其它粘结材料形成。 可以使用化学和物理加工操作来回火玻璃层，进行退火操作，以预热玻璃层并促进粘附。

    Methods for assembling electronic devices using embedded light guide structures
    23.
    发明授权
    Methods for assembling electronic devices using embedded light guide structures 有权
    使用嵌入式导光结构组装电子设备的方法

    公开(公告)号：US08944659B2

    公开(公告)日：2015-02-03

    申请号：US13401692

    申请日：2012-02-21

    Applicant: Teodor Dabov ,  Casey J. Feinstein ,  David A. Pakula ,  Stephen Brian Lynch

    Inventor： Teodor Dabov ,  Casey J. Feinstein ,  David A. Pakula ,  Stephen Brian Lynch

    IPC: F21V8/00

    CPC classification number: G02B6/0081 ,  C09J5/00 ,  C09J2203/318 ,  C09J2205/31 ,  G02B6/001 ,  G02B6/0086 ,  G02B6/102

    Abstract: Electronic devices may include assemblies of structures such as electronic device assemblies connected using light-cured liquid adhesive such as ultraviolet-light-cured adhesive. Light guide structures may be mounted in the assemblies. During manufacture of an electronic device, ultraviolet light may be injected into a light guide structure to cure the light-cured liquid adhesive. A light guide structure may include portions that prevent escape of ultraviolet light and portions that allow ultraviolet light to escape into the light-cured liquid adhesive. Light guide structures may include masked portions, rigid support members, and one or more openings. Openings in a light guide structure may allow the light-cured liquid adhesive to be injected into an assembly through the openings. An adhesive applicator may be used to apply the adhesive to portions of the assembly. An external light source may be used to inject light that cures the adhesive into the light guide structures.

    Abstract translation: 电子设备可以包括诸如使用诸如紫外光固化粘合剂的光固化液体粘合剂连接的电子设备组件的结构的组件。 导光结构可以安装在组件中。 在制造电子装置时，可以将紫外光注入导光结构中以固化光固化液体粘合剂。 光导结构可以包括防止紫外线逸出的部分和允许紫外线逸出到光固化液体粘合剂中的部分。 导光结构可以包括掩模部分，刚性支撑构件和一个或多个开口。 在导光结构中的开口可允许光固化的液体粘合剂通过开口注入到组件中。 可以使用粘合剂施加器将粘合剂施加到组件的部分。 外部光源可以用于将固化粘合剂的光注入光导结构中。

    Insert Molded Cowling Structures
    25.
    发明申请
    Insert Molded Cowling Structures 有权
    插入成型的结构结构

    公开(公告)号：US20140071651A1

    公开(公告)日：2014-03-13

    申请号：US13607440

    申请日：2012-09-07

    Applicant: Michael B. Wittenberg ,  Sawyer I. Cohen ,  Jared M. Kole ,  Shayan Malek ,  David A. Pakula ,  Ashutosh Y. Shukla

    Inventor： Michael B. Wittenberg ,  Sawyer I. Cohen ,  Jared M. Kole ,  Shayan Malek ,  David A. Pakula ,  Ashutosh Y. Shukla

    IPC: H05K5/04 ,  H05K13/00

    CPC classification number: H01Q1/243

    Abstract: Electronic devices may be provided with electronic components and cowling structures that secure the electronic components. A cowling structure may include a metal portion and an insulating portion that has been insert-molded onto the metal portion. The metal portion and the insert-molded insulating portion may each have an opening that receives a screw. The screws may pass through the respective opening and attach to a substrate. The substrate may be a transparent cover layer for a device display. The cowling structure may press the electronic components against the transparent substrate layer. The device may include an antenna. The insert-molded insulating portion may extend from an edge of the metal portion in the direction of the antenna. The insert-molded insulating portion may prevent one of the screws from forming an electrical connection with the metal portion.

    Abstract translation: 电子设备可以设置有固定电子部件的电子部件和整流罩结构。 整流罩结构可以包括已经插入模制到金属部分上的金属部分和绝缘部分。 金属部分和嵌入成型的绝缘部分可以各自具有容纳螺钉的开口。 螺钉可以穿过相应的开口并附着到基底上。 衬底可以是用于器件显示的透明覆盖层。 整流罩结构可以将电子部件压靠在透明基板层上。 该装置可以包括天线。 插入成型的绝缘部分可以沿着天线的方向从金属部分的边缘延伸。 插入成型的绝缘部分可以防止其中一个螺钉与金属部分形成电连接。

    LOW PROFILE HINGE AND PIN MOUNT
    26.
    发明申请
    LOW PROFILE HINGE AND PIN MOUNT 审中-公开
    低剖面铰链和针脚安装

    公开(公告)号：US20140055019A1

    公开(公告)日：2014-02-27

    申请号：US13592240

    申请日：2012-08-22

    Applicant: Andriy PLETENETSKYY ,  Tang Yew Tan ,  David A. Pakula

    Inventor： Andriy PLETENETSKYY ,  Tang Yew Tan ,  David A. Pakula

    IPC: H05K7/16 ,  B23P11/00

    CPC classification number: H04M1/026 ,  Y10T29/49947

    Abstract: Described embodiments provide a low profile hinge and pin mount to be mounted within a small encasement. The mount has a low profile and takes up minimal space within the small encasement without sacrificing structural support for a component and external forces placed on the mount. The mount includes a bracket, a pin and a fastener. The bracket includes a rounded end, a fastening end and a beam configured to support the component placed between the rounded end and the fastening end. The rounded end of the bracket is sized and shaped to fit in an enclosure of the encasement and to pivot about the pin during a rework process. Methods for installing and reworking the low profile hinge and pin mount are described.

    Abstract translation: 所描述的实施例提供了一种小型铰链和销安装件，以安装在小的装置内。 安装座具有低外形，并且在小包装内占用最小的空间，而不会牺牲部件的结构支撑和安装在安装座上的外力。 支架包括支架，销和紧固件。 支架包括圆形端部，紧固端部和被配置为支撑放置在圆形端部和紧固端部之间的部件的梁。 支架的圆形端部的尺寸和形状适于装在外壳的外壳中，并在返工过程中围绕销枢转。 描述了用于安装和重新加工低剖面铰链和销安装件的方法。

    Compact Portable Electronic Device Having Augmented Back Volume for Speaker
    28.
    发明申请
    Compact Portable Electronic Device Having Augmented Back Volume for Speaker 审中-公开
    紧凑型便携式电子设备增强扬声器背部音量

    公开(公告)号：US20130260823A1

    公开(公告)日：2013-10-03

    申请号：US13436924

    申请日：2012-03-31

    Applicant: Ashutosh Y. Shukla ,  David A. Pakula ,  Mathew D. Hill ,  Richard Hung Minh Dinh ,  Sawyer I. Cohen ,  Terence N. Tam

    Inventor： Ashutosh Y. Shukla ,  David A. Pakula ,  Mathew D. Hill ,  Richard Hung Minh Dinh ,  Sawyer I. Cohen ,  Terence N. Tam

    IPC: H04M1/00 ,  H04R1/02

    CPC classification number: H04M1/0264 ,  H04M1/035 ,  H04R1/2815 ,  H04R2499/11

    Abstract: Improved approaches to providing a sealed acoustic chamber (e.g., a back volume) for an acoustic component (e.g., speaker) resident in a compact portable electronic device are disclosed. In one embodiment, a compact portable electronic device includes an internal module (or housing), such as an optical camera module that includes optical components, which contains a module volume. The module volume can be provided with a port (e.g., opening) but is otherwise a substantially enclosed (e.g., at least substantially sealed) volume. By acoustically coupling the acoustic component to the port, the module volume can be used as some or all of the back volume for the acoustic component. Advantageously, a compact portable electronic can provide quality acoustic audio output while requiring only a limited amount of dedicated space.

    Abstract translation: 公开了用于为驻留在紧凑型便携式电子设备中的声学组件（例如，扬声器）提供密封声学室（例如，后部体积）的改进方法。 在一个实施例中，紧凑型便携式电子设备包括内部模块（或外壳），诸如包含模块体积的光学组件的光学相机模块。 模块体积可以设置有端口（例如开口），但是可以设置为基本封闭的（例如，至少基本上密封的）体积。 通过将声学组件声学耦合到端口，模块体积可以用作声学部件的后部体积的一些或全部。 有利地，紧凑型便携式电子器件可以提供质量良好的声学音频输出，同时仅需要有限量的专用空间。

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