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公开(公告)号：US09343716B2
公开(公告)日：2016-05-17
申请号：US13339733
申请日：2011-12-29
IPC分类号： H01M2/10 , H01M2/02 , H01L31/048 , H01M10/04 , H01M10/42 , H01M10/657 , H01M10/647 , H01M10/623 , H01M10/613 , H01M6/46
CPC分类号： H01M2/1066 , H01L31/048 , H01M2/0207 , H01M6/46 , H01M10/0436 , H01M10/425 , H01M10/613 , H01M10/623 , H01M10/647 , H01M10/657 , H01M10/6572 , H01M2220/30 , Y02E10/50 , Y10T156/10 , Y10T156/1082
摘要： Flexible battery packs for use in electronic devices are disclosed. In one embodiment of the present disclosure, the flexible battery pack may include a plurality of cells, such as galvanic or photovoltaic cells. The battery pack also may include a plurality of laminate layers coupled to the cells that include a top laminate layer and a bottom laminate layer. An adhesive may be used to couple the top and bottom laminate layers together such that each of the plurality of cells is isolated from each other. This arrangement may allow the battery to be shaped to fit a form factor of the electronic device. This arrangement also may allow one or more of the cells to be selectively removed from the plurality, which may be desirable from a manufacturing perspective.
摘要翻译： 公开了用于电子设备的柔性电池组。 在本公开的一个实施例中，柔性电池组可以包括多个电池，例如电流或光伏电池。 电池组还可以包括耦合到电池的多个层压层，其包括顶层叠层和底层叠层。 可以使用粘合剂将顶部和底部层压层连接在一起，使得多个单元中的每一个彼此隔离。 这种布置可以允许电池成形为适合电子设备的外形尺寸。 这种布置还可以允许从多个单元中选择性地移除一个或多个单元，这从制造的角度来看是可取的。
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公开(公告)号：US20130171490A1
公开(公告)日：2013-07-04
申请号：US13339733
申请日：2011-12-29
CPC分类号： H01M2/1066 , H01L31/048 , H01M2/0207 , H01M6/46 , H01M10/0436 , H01M10/425 , H01M10/613 , H01M10/623 , H01M10/647 , H01M10/657 , H01M10/6572 , H01M2220/30 , Y02E10/50 , Y10T156/10 , Y10T156/1082
摘要： Flexible battery packs for use in electronic devices are disclosed. In one embodiment of the present disclosure, the flexible battery pack may include a plurality of cells, such as galvanic or photovoltaic cells. The battery pack also may include a plurality of laminate layers coupled to the cells that include a top laminate layer and a bottom laminate layer. An adhesive may be used to couple the top and bottom laminate layers together such that each of the plurality of cells is isolated from each other. This arrangement may allow the battery to be shaped to fit a form factor of the electronic device. This arrangement also may allow one or more of the cells to be selectively removed from the plurality, which may be desirable from a manufacturing perspective.
摘要翻译： 公开了用于电子设备的柔性电池组。 在本公开的一个实施例中，柔性电池组可以包括多个电池，例如电流或光伏电池。 电池组还可以包括耦合到电池的多个层压层，其包括顶层叠层和底层叠层。 可以使用粘合剂将顶部和底部层压层连接在一起，使得多个单元中的每一个彼此隔离。 这种布置可以允许电池成形为适合电子设备的外形尺寸。 这种布置还可以允许从多个单元中选择性地移除一个或多个单元，这从制造的角度来看是可取的。
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公开(公告)号：US09131135B2
公开(公告)日：2015-09-08
申请号：US12481558
申请日：2009-06-09
IPC分类号： H04N5/225
CPC分类号： H04N5/2254 , H04N5/2256 , H04N5/2257
摘要： An electronic device may have a camera module for acquiring still and video digital images of a subject. A light source such as a light-emitting diode may serve as a flash for the camera module. A shutter may be mounted above the light-emitting diode. When the light-emitting diode is not being used to produce a flash of light for illuminating the subject, the shutter may be closed to block the light-emitting diode from view by a user. During image acquisition operations in which it is desired to illuminate the subject, the shutter may be opened to allow light from the light-emitting diode to exit the electronic device. The electronic device may have a touch screen display with an active region and an inactive region. The camera module and light source may be mounted under a portion of the inactive region of the display. The shutter may include a filter structure.
摘要翻译： 电子设备可以具有用于获取被摄体的静止和视频数字图像的照相机模块。 诸如发光二极管的光源可以用作相机模块的闪光灯。 遮光板可以安装在发光二极管的上方。 当发光二极管不被用于产生用于照亮被摄体的闪光时，可以关闭快门以阻止用户观察发光二极管。 在期望照亮被摄体的图像获取操作期间，可以打开快门以允许来自发光二极管的光离开电子设备。 电子设备可以具有具有活动区域和非活动区域的触摸屏显示。 相机模块和光源可以安装在显示器的非活动区域的一部分下方。 快门可以包括过滤器结构。
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公开(公告)号：US08879266B2
公开(公告)日：2014-11-04
申请号：US13480458
申请日：2012-05-24
IPC分类号： H05K7/20
CPC分类号： G06F1/20 , G06F1/182 , H05K1/0207 , H05K3/30 , H05K2201/0338
摘要： Electronic devices having a multi-layer structure that provides enhanced conductivity (thermal and/or electrical conductivity) are disclosed. The multi-layer structure can have a plurality of adjacent layers. At least one layer can primarily provide structural rigidity, and at least another layer can primarily provide enhanced conductivity. The layer of high conductivity can serve to provide the electronic device with greater ability to disperse generated heat and/or to provide an accessible voltage potential (e.g., ground plane). Advantageously, the multi-layer structure can provide enhanced conductivity using an otherwise required structural component and without necessitating an increase in thickness.
摘要翻译： 公开了具有提供增强的导电性（热和/或导电性）的多层结构的电子器件。 多层结构可以具有多个相邻的层。 至少一层可以主要提供结构刚性，并且至少另一层可主要提供增强的导电性。 高导电性层可用于为电子器件提供更大的分散产生的热量和/或提供可接近的电压电位（例如接地平面）的能力。 有利地，多层结构可以使用另外需要的结构部件提供增强的导电性，而不需要增加厚度。
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公开(公告)号：USD697918S1
公开(公告)日：2014-01-21
申请号：US29384916
申请日：2011-02-04
申请人： Jody Akana , Bartley K. Andre , Jeremy Bataillou , Daniel J. Coster , Daniele De Iuliis , M. Evans Hankey , Richard P. Howarth , Jonathan P. Ive , Daniel W. Jarvis , Steve Jobs , Duncan Robert Kerr , Nicholas George LeBreton Merz , Scott A. Myers , Shin Nishibori , Matthew Dean Rohrbach , Peter Russell-Clarke , Christopher J. Stringer , Tang Yew Tan , Eugene Antony Whang , Rico Zörkendörfer
设计人： Jody Akana , Bartley K. Andre , Jeremy Bataillou , Daniel J. Coster , Daniele De Iuliis , M. Evans Hankey , Richard P. Howarth , Jonathan P. Ive , Daniel W. Jarvis , Steve Jobs , Duncan Robert Kerr , Nicholas George LeBreton Merz , Scott A. Myers , Shin Nishibori , Matthew Dean Rohrbach , Peter Russell-Clarke , Christopher J. Stringer , Tang Yew Tan , Eugene Antony Whang , Rico Zörkendörfer
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公开(公告)号：US08607444B2
公开(公告)日：2013-12-17
申请号：US12895822
申请日：2010-09-30
IPC分类号： H05K3/36
CPC分类号： H05K5/0208 , B32B37/16 , H05K5/0017 , H05K5/02 , Y10T29/49126 , Y10T29/49128 , Y10T29/49158
摘要： Improved techniques for forming an electronic device housing in which an outer housing member can be assembled with one or more other housing members of the electronic device are disclosed. The one or more other housing members can together with a thin substrate layer (or thin substrate) form a frame to which the outer housing member can be secured. The thin substrate layer facilitates molding of the one or more other housing members adjacent to the outer housing member. In one embodiment, the outer housing member can be made of glass and the one or more other housing members can be made of a polymer, such as plastic. The substrate layer can, for example, be formed of a polymer or a metal. The resulting electronic device housing can be thin yet be sufficiently strong to be suitable for use in electronic devices, such as portable electronic devices.
摘要翻译： 公开了用于形成电子设备外壳的改进技术，其中外壳构件可以与电子设备的一个或多个其它外壳构件组装。 一个或多个其它壳体构件可以与薄的衬底层（或薄衬底）一起形成框架，外壳构件可以固定到框架上。 薄的衬底层有助于模制与外部壳体构件相邻的一个或多个其它壳体构件。 在一个实施例中，外部壳体构件可以由玻璃制成，并且一个或多个其它壳体构件可以由诸如塑料的聚合物制成。 衬底层可以例如由聚合物或金属形成。 所得到的电子器件外壳可以是薄的，但足够坚固以适合用于诸如便携式电子设备的电子设备中。
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公开(公告)号：US20130314875A1
公开(公告)日：2013-11-28
申请号：US13480458
申请日：2012-05-24
CPC分类号： G06F1/20 , G06F1/182 , H05K1/0207 , H05K3/30 , H05K2201/0338
摘要： Electronic devices having a multi-layer structure that provides enhanced conductivity (thermal and/or electrical conductivity) are disclosed. The multi-layer structure can have a plurality of adjacent layers. At least one layer can primarily provide structural rigidity, and at least another layer can primarily provide enhanced conductivity. The layer of high conductivity can serve to provide the electronic device with greater ability to disperse generated heat and/or to provide an accessible voltage potential (e.g., ground plane). Advantageously, the multi-layer structure can provide enhanced conductivity using an otherwise required structural component and without necessitating an increase in thickness.
摘要翻译： 公开了具有提供增强的导电性（热和/或导电性）的多层结构的电子器件。 多层结构可以具有多个相邻的层。 至少一层可以主要提供结构刚性，并且至少另一层可主要提供增强的导电性。 高导电性层可用于为电子器件提供更大的分散产生的热量和/或提供可接近的电压电位（例如接地平面）的能力。 有利地，多层结构可以使用另外需要的结构部件提供增强的导电性，而不需要增加厚度。
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公开(公告)号：US20100273530A1
公开(公告)日：2010-10-28
申请号：US12429157
申请日：2009-04-23
CPC分类号： F21V33/0052 , F16F1/027 , F16F1/185 , G01J1/4204 , G02B6/0081 , G06F1/1626 , G06F1/1637 , G06F1/1671 , G06F1/1684 , G06F1/169
摘要： Portable electronic devices are provided. A device may include cover glass with a light mask. The light mask may be microperforated to allow light to pass through the light mask. The microperforations may allow light to pass through the light mask. The devices may include sensors and light emitters that receive and transmit light through the microperforations. The devices may include a variable cantilever spring as part of a button assembly. The spring may be flattened against itself without exceeding its elastic limit. The devices may include display modules. The display module may include structures that block light from leaking out of the module. The structures may include opaque tapes, opaque enclosures for the display module, and other suitable structures.
摘要翻译： 提供便携式电子设备。 装置可以包括具有光罩的玻璃罩。 光罩可以是微穿孔的，以允许光穿过光罩。 微穿孔可以允许光穿过光罩。 这些装置可以包括传感器和发光器，其通过微穿孔接收和透射光。 装置可以包括作为按钮组件的一部分的可变悬臂弹簧。 弹簧可以在不超过其弹性极限的情况下自身平坦化。 设备可以包括显示模块。 显示模块可以包括阻挡光从模块中泄漏的结构。 结构可以包括不透明带，用于显示模块的不透明外壳以及其它合适的结构。
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公开(公告)号：US08866679B2
公开(公告)日：2014-10-21
申请号：US12703937
申请日：2010-02-11
申请人： Albert Golko , Daniel W. Jarvis , Felix Alvarez
发明人： Albert Golko , Daniel W. Jarvis , Felix Alvarez
CPC分类号： H01Q1/241 , H01Q1/084 , H01Q1/40 , Y10T29/49016
摘要： Certain embodiments may take the form of an electronic device having a metal housing encapsulating operative circuitry for the device. The electronic device includes an attachment member coupled to the metal housing at an attachment point. An antenna is coupled to the attachment member and communicatively coupled to the operative circuitry in the metal housing via the attachment point to enable the electronic device to communicate wirelessly.
摘要翻译： 某些实施例可以采用电子设备的形式，该电子设备具有封装用于该设备的操作电路的金属外壳。 电子设备包括在附接点处联接到金属壳体的附接构件。 天线耦合到附接构件并且经由附接点通信耦合到金属外壳中的操作电路，以使得电子设备能够无线通信。
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公开(公告)号：US09633247B2
公开(公告)日：2017-04-25
申请号：US13409615
申请日：2012-03-01
CPC分类号： G06K9/00013 , G06F3/0416 , G06F3/044 , G06K9/0002 , H04B5/0012 , H04B5/0075
摘要： An electronic device may have electrical components such as sensors. A sensor may have sensor circuitry that gathers sensor data using a conductive structure. The sensor may be a touch sensor that uses the conductive structure to form a capacitive touch sensor electrode or may be a fingerprint sensor that uses the conductive structure with a fingerprint electrode array to handle fingerprint sensor signals. Near field communications circuitry may be included in an electronic device. When operated in a sensor mode, the sensor circuitry may use the conductive structure to gather a fingerprint or other sensor data. When operated in near field communications mode, the near field communications circuitry can use the conductive structure to transmit and receive capacitively coupled or inductively coupled near field communications signals. A fingerprint sensor may have optical structures that communicate with external equipment.
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