公开(公告)号：US20240047617A1

公开(公告)日：2024-02-08

申请号：US18364975

申请日：2023-08-03

Applicant: Japan Display Inc.

Inventor： Kenichi TAKEMASA

IPC: H01L33/38 ,  H01L25/075 ,  H01L33/62

CPC classification number: H01L33/382 ,  H01L25/0753 ,  H01L33/62

Abstract: An anode electrode includes a first recess portion which does not contact a first projection electrode and a first protruding portion which protrudes in a direction away from an insulating layer than the first recess portion and is in contact with the first projection electrode.
A cathode electrode includes a second recess portion which does not contact a second projection electrode and a second protruding portion which protrudes in a direction away from the insulating layer than the second recess portion and is in contact with the second projection electrode. A space between the first recess portion and the first projection electrode communicates with a space around a connection portion between the anode electrode and the first projection electrode. A space between the second recess portion and the second projection electrode communicates with a space around a connection portion between the second electrode and the second projection electrode.

公开(公告)号：US20240047605A1

公开(公告)日：2024-02-08

申请号：US18356321

申请日：2023-07-21

Applicant: Japan Display Inc.

Inventor： Kazuyuki YAMADA ,  Keisuke ASADA ,  Kenichi TAKEMASA ,  Daiki ISONO

IPC: H01L33/00 ,  H01L25/16 ,  H01L23/00

CPC classification number: H01L33/0093 ,  H01L25/167 ,  H01L24/13 ,  H01L24/16 ,  H01L2224/13021 ,  H01L2224/13111 ,  H01L2224/13139 ,  H01L2224/16145

Abstract: Disclosed is a manufacturing method of a display device including: transferring at least one inorganic light-emitting diode formed over a base substrate onto a first carrier substrate; arranging a plurality of spacers configured to be elastically deformed over a substrate over which a pixel including a plurality of sub-pixels is arranged; and transforming the at least one inorganic light-emitting diode over the first carrier substrate onto the substrate. The manufacturing method may further include removing the plurality of spacers.

公开(公告)号：US20240045228A1

公开(公告)日：2024-02-08

申请号：US18363958

申请日：2023-08-02

Applicant: Japan Display Inc.

Inventor： Kenichi TAKEMASA

IPC: G02B30/56 ,  G06F3/0354 ,  G06F3/038 ,  G06F3/044 ,  G09G3/20

CPC classification number: G02B30/56 ,  G06F3/03543 ,  G06F3/038 ,  G06F3/044 ,  G09G3/20 ,  G06F2203/04108 ,  G09G2300/023 ,  G09G2354/00 ,  G09G2320/0686

Abstract: According to one embodiment, a display device includes a first display panel including a first display surface, a second display panel opposed to the first display panel, configured to transmit image light emitted from the first display surface, and including a second display surface on a side opposite to a side opposed to the first display surface, and an imaging optical element located between the first display panel and the second display panel, and generating in space an imaging plane where the image light is imaged.

公开(公告)号：US20210398939A1

公开(公告)日：2021-12-23

申请号：US17337626

申请日：2021-06-03

Applicant: Japan Display Inc.

Inventor： Kazuyuki YAMADA ,  Keisuke ASADA ,  Kenichi TAKEMASA

IPC: H01L23/00 ,  H01L25/16 ,  H01L33/62

Abstract: A method for manufacturing a display device includes preparing a circuit board including a drive circuit for driving a LED chip, forming a connecting electrode on the circuit board, forming an adhesive layer on the connecting electrode, adhering a terminal electrode of the LED chip on the adhesive layer and joining the connecting electrode and the terminal electrode by irradiating a laser light. The adhesive layer may be formed only on a upper surface of the connecting electrode.