Abstract:
A bidirectional optical transceiver is disclosed. In the bidirectional optical transceiver, by implementing, as a stacked structure, an optical bench in which an optical system and an optical-transmitting module are installed and a multi-layer substrate with good thermal, electrical and high-resistance characteristics in which an optical-receiving module and a driving circuit for driving the optical-transmitting module are installed, thermal, electrical or optical crosstalk is prevented, high-speed transmission of transmission signals is possible through high-speed modulation thereof, and miniaturization is achieved.
Abstract:
A method of inter-layer search of a multi-layer disk, the method including determining whether a search is required of a layer other than a currently accessed layer; searching the currently accessed layer for a position corresponding to a target address on the layer not currently accessed; and moving access to the layer not currently accessed according to the position corresponding to the target address.
Abstract:
Example embodiments relate to a semiconductor device and a method of manufacturing the same. A semiconductor device according to example embodiments may have reduced disturbances during reading operations and a reduced short channel effect. The semiconductor device may include a semiconductor substrate having a body and a pair of fins protruding from the body. Inner spacer insulating layers may be formed on an upper portion of an inner sidewall of the pair of fins so as to reduce the entrance to the region between the pair of fins. A gate electrode may cover a portion of the external sidewalls of the pair of fins and may extend across the inner spacer insulating layers so as to define a void between the pair of fins. Gate insulating layers may be interposed between the gate electrode and the pair of fins.
Abstract:
An image sensor coated with an anti-reflection material having a microlens provided on a semiconductor substrate, the microlens corresponding to a light receiving device formed in the semiconductor substrate wherein the image sensor includes a first layer coated on a surface of the microlens, and a second layer coated on the first layer, wherein the second layer has a smaller refractive index than the first layer.
Abstract:
A method for fabricating an electrode structure of an integrated circuit device comprises the following steps. Initially, a conductive layer is formed on a substrate. A photoresist layer is formed on the conductive layer, wherein said photoresist layer includes a hole exposing a portion of said conductive layer. A portion of the conductive layer is then etched to a predetermined thickness that is less than a thickness of the conductive layer using said photoresist layer as an etching mask. The hole in the photoresist layer is enlarged by removing a portion of the photoresist layer, thereby exposing a surface portion of the conductive layer outside the etched portion of the conductive layer. An insulating layer is then formed on the surface portion of the conductive layer and the etched portion of the first conductive layer. The insulating layer is used as an etching mask for etching the conductive layer to form an electrode structure.