摘要:
A semiconductor device and a method of fabricating the same are provided. The semiconductor device includes a first interlayer insulating layer including a first trench, on a substrate a first liner layer formed along a side wall and a bottom surface of the first trench and including noble metal, the noble metal belonging to one of a fifth period and a sixth period of a periodic chart that follows numbering of International Union of Pure and Applied Chemistry (IUPAC) and belonging to one of eighth to tenth groups of the periodic chart, and a first metal wire filling the first trench on the first liner layer, a top surface of the first metal wire having a convex shape toward a bottom surface of the first trench.
摘要:
An optical transmission apparatus having a temperature control function includes: a package having a cavity; a cooler mounted in the cavity and controlling temperature; and a substrate mounted on the cooler and including a light source mounted thereon to generate light. In spite of the presence of the cooler, the apparatus can be implemented to be compact and have a simple structure.
摘要:
Disclosed is a bidirectional optical transmitting and receiving device which includes a bottom case; a sidewall case; an upper case; a thermoelectric cooler provided on a first portion of the bottom case; a temperature sensor, a light emitting element, and a first lens collecting light emitted from the light emitting element, the temperature sensor, the light emitting element, and the first lens formed over the thermoelectric cooler; a second lens contacting with the exterior via the sidewall case; a filter transmitting light propagated from the first lens to the second lens and reflecting light propagated from the second lens; a third lens coupled with a lower surface of the filter and collecting light reflected from the filter; a light receiving element provided on a second portion of the bottom case and receiving light propagated from the third lens to output an electric signal; a pre-amplifier provided on the second portion and amplifying the electric signal from the light emitting element; and a support formed on the second portion and supporting the filter.
摘要:
A printed circuit board and a method of manufacturing the printed circuit board are disclosed. In an embodiment of the present invention, the method of manufacturing a printed circuit board can include: providing a pair of conductive layers, in which roughness of one surface of one of the pair of conductive layers is different from roughness of one surface of the other of the pair of conductive layers; and stacking the pair of the conductive layers on a dielectric layer such that one surface of one of the pair of conductive layers faces one surface of the dielectric layer and one surface of the other of the pair of conductive layers faces another surface of the dielectric layer.
摘要:
Proposed is an efficient method of configuration of a transmitter and a receiver for realizing an optical transmission/reception module apparatus including at least one transmission wavelength and two or more reception wavelengths over a time division multiple access passive optical network or an optical network using multiple transmission/reception wavelengths. Further, proposed is a method of configuration of an apparatus which enables optical alignment and assembly in a single package by using a single lens and three different WDM optical filters for a reception module capable of receiving four wavelengths.
摘要:
The present invention relates to a method for producing hollow noodles, and more specifically to one in which a gelatinized doughy substance is passed through a die designed to form a hollow area, such that the noodles which have passed therethrough have a tubular hollow area on the inside and hence it is possible to produce noodles which have a dramatically reduced cooking time and readily allow soap and sauces to penetrate the noodle during cooking and so enhance the taste thereof. Further, it is possible to produce noodles in which the formation of the hollow causes the noodle surface area to be increased and, as a result, there is rapid evaporation of the water present on the surface of the noodle which is being gelatinized and injected, and hence noodle stickiness is dramatically improved and consequently noodle sticking is reduced.
摘要:
The present inventive concept herein relates to multi-channel optical modules, and more particularly, to a multi-channel optical module capable of processing a plurality of signals having different optical wavelengths. The multi-channel optical module may include a stem including one or more cavities; at least one lead pin formed in one or more cavities; a plurality of optical devices formed in the one or more cavities; and a filter portion forming an optical path between the plurality of optical devices and an optical fiber by separating a plurality of optical signals according to a wavelength. According to the inventive concept, processing capacity of the optical module may be improved. Also, according to the inventive concept, electrical and optical cross talk of the optical module may be reduced.
摘要:
A method of manufacturing a printed circuit board is disclosed. A method of manufacturing a printed circuit board, which includes: forming at least one interlayer connector on a first carrier, stacking at least one insulation layer on the first carrier such that the interlayer connector is exposed, removing the first carrier, and forming at least one circuit pattern on the insulation layer such that the circuit pattern is electrically coupled with the interlayer connector, can be used to increase the density of circuit patterns, as the method can provide electrical connection between circuit patterns and vias without using lands.
摘要:
A complementary metal-oxide-semiconductor (CMOS) image sensor (CIS) includes a semiconductor substrate including a photodiode therein as a light sensing unit. A floating diffusion region of a first conductivity type is provided in the semiconductor substrate, and is configured to receive charges generated in the photodiode. A power supply voltage region of the first conductivity type is also provided in the semiconductor substrate. A reset transistor including a reset gate electrode on a surface of the substrate between the floating diffusion region and a power supply voltage region is configured to discharge charges stored in the floating diffusion region in response to a reset control signal. The reset transistor includes a channel region in the substrate extending between the floating diffusion region and the power supply voltage region such that the floating diffusion region and the power supply voltage regions define source/drain regions for the reset transistor. An impurity region is provided in a first portion of the channel region adjacent to the floating diffusion region. The impurity region has a doping such that the first portion of the channel region adjacent to the floating diffusion region has a different built-in potential than a second portion of the channel region adjacent to the power supply voltage region.
摘要:
A bidirectional optical transceiver module with a temperature control function is provided. The bidirectional optical transceiver module includes a package configured to have a flat bottom surface and include two windows used for optical transmission and reception; a ferrule configured to be coupled to one side of the package and allow an optical fiber to be inserted therein; an optical receiver module configured to be coupled to another side of the package in a direction perpendicular to that of the ferrule coupled to the package; a sub-optical transmitter module configured to be built in the package and include a light-emitting element and a collimating lens used to collimate light from the light-emitting element; an optical filter configured to be built in the package, transmit light from the light-emitting element to the optical fiber and reflect light received through the optical fiber to the optical receiver module; and a temperature regulator configured to be built in the package and control the sub-optical transmitter module to a preset temperature. Accordingly, it is possible to reduce the manufacturing cost of the package, effectively discharge heat, and be more endurable to external impact or vibration.