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公开(公告)号：US12177960B2
公开(公告)日：2024-12-24
申请号：US17891197
申请日：2022-08-19
Applicant: KYOCERA AVX Components Corporation
Inventor： Cory Nelson
Abstract: A surface mount component can include a first substrate and a second substrate arranged adjacent the first substrate to form a monolithic body. At least one of the first substrate or the second substrate can include a thermally conductive material that is electrically insulating. A thin film component can be arranged between the first substrate and the second substrate. A first terminal can be formed over a first end of the monolithic body. A second terminal can be formed over a second end of the monolithic body that is opposite the first end. A heat sink terminal can contact the thermally conductive material of the at least one of the first substrate or the second substrate.
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公开(公告)号：US20240379649A1
公开(公告)日：2024-11-14
申请号：US18632390
申请日：2024-04-11
Applicant: KYOCERA AVX Components Corporation
Inventor： Cory Nelson , Marianne Berolini , Jessica Parry , Jonathan Shealy
Abstract: Single layer capacitors and circuit boards having such capacitors are provided. A circuit board can include a circuit board substrate having a mounting surface and a single layer capacitor at least partially embedded therein. The single layer capacitor includes a first conductive layer formed over at least a portion of a substrate first surface and a second conductive layer formed over at least a portion of a substrate second surface. At least one of the first or second conductive layers has a thickness that is at least about 5 microns. A method of forming a single layer capacitor includes depositing a first conductive layer over at least a portion of a substrate first surface and depositing a second conductive layer over at least a portion of a substrate second surface. At least one of the first or second conductive layers has a thickness that is at least about 5 microns.
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公开(公告)号：US20240234591A9
公开(公告)日：2024-07-11
申请号：US18489042
申请日：2023-10-18
Applicant: KYOCERA AVX Components Corporation
Inventor： Ronald S. Demcko , Cory Nelson , Marianne Berolini , Jeff Borgman
IPC: H01L29/94
CPC classification number: H01L29/94
Abstract: A metal-oxide-semiconductor (MOS) capacitor can include a substrate comprising a semiconductor material, an oxide layer formed over a first surface of the substrate, a resistive layer formed over at least a portion of the oxide layer, and a conductive layer formed over at least a portion of the resistive layer. As such, the MOS capacitor can include a resistor and a capacitor formed in series with one another.
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公开(公告)号：US20240234038A9
公开(公告)日：2024-07-11
申请号：US18489039
申请日：2023-10-18
Applicant: KYOCERA AVX Components Corporation
Inventor： Ronald S. Demcko , Cory Nelson , Marianne Berolini , Jeff Borgman
CPC classification number: H01G4/33 , H01G4/1254 , H01G4/252 , H05K1/162 , H05K2201/09554
Abstract: A single layer capacitor can include a substrate having a first surface and a second surface opposite the first surface. A resistive layer can be formed over at least a portion of the first surface of the substrate. A first conductive layer can be formed over at least a portion of the resistive layer. A second conductive layer can be formed over at least a portion of the second surface of the substrate. As such, the single layer capacitor can include a resistor and a capacitor formed in series with one another.
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公开(公告)号：US20240062959A1
公开(公告)日：2024-02-22
申请号：US18495864
申请日：2023-10-27
Applicant: KYOCERA AVX Components Corporation
Inventor： Marianne Berolini , Cory Nelson , Seth Fuller , Alma Iris Cordova
CPC classification number: H01G4/008 , H01G4/1227 , H01G4/248 , H01G4/30
Abstract: The present invention is directed to a multilayer ceramic capacitor. The multilayer ceramic capacitor has a first end and a second end that is spaced apart from the first end in a longitudinal direction that is perpendicular to a lateral direction wherein the lateral direction and longitudinal direction are each perpendicular to a Z-direction. The multilayer ceramic capacitor comprises a monolithic body comprising a plurality of dielectric layers and a plurality of electrode layers parallel with the lateral direction. At least one electrode layer includes a first electrode comprising a connecting portion and a central portion extending from the connecting portion in the longitudinal direction wherein the central portion includes a Z-directional edge and the connecting portion includes an edge extending in both the longitudinal direction and the Z-direction and wherein the Z-directional edge of the central portion forms a first angle of from greater than 90° to less than 180° with the edge of the connecting portion. A first external termination disposed along the first end and a second external termination disposed along the second end.
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Patent Agency Ranking
公开(公告)号：US20220172891A1
公开(公告)日：2022-06-02
申请号：US17537827
申请日：2021-11-30
Applicant: KYOCERA AVX Components Corporation
Inventor： Marianne Berolini , Cory Nelson , Seth Fuller , Alma Iris Cordova
Abstract: The present invention is directed to a multilayer ceramic capacitor. The multilayer ceramic capacitor has a first end and a second end that is spaced apart from the first end in a longitudinal direction that is perpendicular to a lateral direction wherein the lateral direction and longitudinal direction are each perpendicular to a Z-direction. The multilayer ceramic capacitor comprises a monolithic body comprising a plurality of dielectric layers and a plurality of electrode layers parallel with the lateral direction. At least one electrode layer includes a first electrode comprising a connecting portion and a central portion extending from the connecting portion in the longitudinal direction wherein the central portion includes a Z-directional edge and the connecting portion includes an edge extending in both the longitudinal direction and the Z-direction and wherein the Z-directional edge of the central portion forms a first angle of from greater than 90° to less than 180° with the edge of the connecting portion. A first external termination disposed along the first end and a second external termination disposed along the second end.
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27.发明申请公开(公告)号：US20250167750A1
公开(公告)日：2025-05-22
申请号：US18944067
申请日：2024-11-12
Applicant: KYOCERA AVX Components Corporation
Inventor： Cory Nelson , Marianne Berolini , Jonathan Herr
Abstract: Filters, filter assemblies, and methods of forming filters are provided. For example, a filter includes a plurality of dielectric layers stacked in a Z-direction to form a substrate having a top and a bottom, and at least one conductive layer is formed over a dielectric layer. The conductive layer is positioned at a location along the Z-direction between the top and bottom of the substrate that is about 200 μm or less from the bottom of the substrate. An assembly includes the filter attached to a device substrate. A method of forming the filter includes forming the dielectric layers and the at least one conductive layer, such as by forming the conductive layer over a dielectric layer, and stacking the plurality of layers to form a substrate with the conductive layer disposed about 200 μm or less from a bottom of the substrate.
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28.发明申请公开(公告)号：US20250106979A1
公开(公告)日：2025-03-27
申请号：US18973212
申请日：2024-12-09
Applicant: KYOCERA AVX Components Corporation
Inventor： Cory Nelson , Jeff Borgman , Marianne Berolini
Abstract: A heat sink component can include a body including a thermally conductive material that is electrically non-conductive, a lower conductive layer formed over a bottom surface of the body and electrically connected with the ground plane layer, and an upper conductive layer formed over a top surface of the body. The heat sink component can have a length in an X-direction that is parallel with the top surface of the body and a thickness in a direction perpendicular to the top surface. A ratio of the length to the thickness can be greater than about 7.
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公开(公告)号：US20250079404A1
公开(公告)日：2025-03-06
申请号：US18805594
申请日：2024-08-15
Applicant: KYOCERA AVX Components Corporation
Inventor： Jonathan Herr , Cory Nelson , Marianne Berolini , Joseph Hock
IPC: H01L25/065 , H01L23/48 , H01L23/538 , H01L25/00
Abstract: A vertical component stack, assembly, and method are provided. For example, a vertical component stack may include a plurality of components that each include an upper surface and a lower surface opposite the upper surface along a vertical direction. The plurality of components are stacked along the vertical direction such that a lower surface of a second component of the plurality of components is disposed over an upper surface of a first component of the plurality of components. An input and an output of each component of the plurality of components is exposed on a lower surface of the first component of the plurality of components.
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公开(公告)号：US12159945B2
公开(公告)日：2024-12-03
申请号：US17740412
申请日：2022-05-10
Applicant: KYOCERA AVX Components Corporation
Inventor： Cory Nelson , Jeff Borgman
Abstract: A semiconductor-based capacitor can include a substrate including a semiconductor material, an oxide layer formed on a surface of the substrate, a conductive layer formed over at least a portion of the oxide layer, a plurality of distinct coplanar upper terminals, and at least one lower terminal formed. Each of the upper terminals and the at least one lower terminal can be exposed along the top and bottom surfaces of the substrate, respectively, for embedding the capacitor in a substrate such as a circuit board. The semiconductor-based capacitor can be sufficiently miniaturized to be embeddable within a circuit board while providing superior capacitance values. For example, a ratio of the length to the width of the substrate can be in a range from about 3:1 to about 1:3 and an area of the substrate can be less than about 3 mm2.
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