Modulation semiconductor integrated circuit device and testing method for oscillation circuit
    22.
    发明授权
    Modulation semiconductor integrated circuit device and testing method for oscillation circuit 失效
    调制半导体集成电路器件及振荡电路的测试方法

    公开(公告)号:US06731101B2

    公开(公告)日:2004-05-04

    申请号:US10086718

    申请日:2002-03-04

    IPC分类号: H03H1328

    摘要: In accomplishing an LC-oscillation VCO circuit which is immune to frequency deviation and a frequency-hopping radio communication apparatus using the VCO circuit, a modulation semiconductor integrated circuit device is designed to control the LC-oscillation VCO directly with data to be transmitted thereby implementing the modulation and switch the carrier frequency for frequency hopping. The integrated circuit device includes a current adjusting circuit which varies the current value of a D/A conversion circuit for producing a control voltage of VCO in accordance with the carrier frequency so that the variation of a modulation control voltage of VCO has a characteristic that is opposite to the characteristic of modulation frequency deviation, thereby nullifying the modulation frequency deviation of VCO.

    摘要翻译: 在实现对频率偏移免疫的LC振荡VCO电路和使用VCO电路的跳频无线电通信装置的情况下,调制半导体集成电路装置被设计成直接用要发送的数据来控制LC振荡VCO,从而实现 调制和切换跳频的载波频率。 集成电路装置包括电流调节电路,其根据载波频率改变用于产生VCO的控制电压的D / A转换电路的电流值,使得VCO的调制控制电压的变化具有 与调制频率偏差的特性相反,从而使VCO的调制频率偏差无效。

    Efficient inspection of light-gathering rate of microlens in solid state imaging device
    23.
    发明授权
    Efficient inspection of light-gathering rate of microlens in solid state imaging device 失效
    有效检查固态成像装置中微透镜的聚光率

    公开(公告)号:US06252285B1

    公开(公告)日:2001-06-26

    申请号:US09288299

    申请日:1999-04-08

    IPC分类号: H01L27148

    CPC分类号: H01L27/14627 H01L27/14806

    摘要: A solid state imaging device includes a plurality of photoelectric conversion elements arranged in an imaging area of a semiconductor substrate. Above each of the photoelectric conversion elements, a light-gathering microlens for gathering light on the photoelectric conversion element is disposed. Further, a microlens for shape inspection having the same shape as that of the light-gathering microlens is disposed outside the imaging area. A base pattern for inspection is disposed below the microlens for shape inspection. The shape of the microlens for shape inspection is inspected through observing an image of the base pattern through the microlens for shape inspection. A result of this inspection applies as it is to the light-gathering microlenses.

    摘要翻译: 固态成像装置包括布置在半导体衬底的成像区域中的多个光电转换元件。 在每个光电转换元件上方,设置用于在光电转换元件上聚集光的聚光微透镜。 此外,具有与聚光微透镜相同形状的形状检查用微透镜设置在摄像区域的外侧。 用于检查的基本图案被放置在微透镜的下面用于形状检查。 用于形状检查的微透镜的形状通过观察通过微透镜的基底图案的图像进行检查。 这种检查的结果适用于聚光微透镜。

    Numerical controller for a grinding machine
    25.
    发明授权
    Numerical controller for a grinding machine 失效
    磨床数控

    公开(公告)号:US4498259A

    公开(公告)日:1985-02-12

    申请号:US503589

    申请日:1983-06-13

    摘要: In a computerized numerical controller for a grinding machine, various grinding modes in which a plurality of portions on a cylindrical workpiece are respectively ground and plural sets of machining data each for use in machining a corresponding one of the workpiece portions are input by a manual data input device for storage in a memory device under the control of a data processor. For preparation of an NC program for the workpiece, the data processor first decides a grinding order in which the workpiece portions are successively ground, based upon the grinding modes and the machining data stored in the memory device. The grinding order is decided in accordance with a predetermined rule designed to decrease the number of dressing operations effected on a grinding wheel of the grinding machine. Then, the data processor automatically prepares a NC program based upon the decided grinding order and the machining data. In an NC operation, the data processor controls a pulse generating circuit in accordance with the NC program. Therefore, first and second feed devices responsive to feed pulses from the pulse generating circuit effect relative movement between a grinding wheel head and a workpiece support table in accordance with the NC program, whereby the workpiece portions can be successively ground in the automatically decided grinding order.

    摘要翻译: 在用于磨床的计算机化数值控制器中,分别研磨圆柱形工件上的多个部分的各种研磨模式以及用于加工对应的一个工件部分的多组加工数据由手动数据输入 输入设备,用于在数据处理器的控制下存储在存储器设备中。 为了准备用于工件的NC程序,数据处理器首先基于存储在存储器件中的磨削模式和加工数据,先决定其中工件部分被连续接地的磨削顺序。 研磨顺序是根据设计成减少在研磨机的砂轮上进行的修整操作次数的预定规则来决定的。 然后,数据处理器根据确定的磨削顺序和加工数据自动准备NC程序。 在NC操作中,数据处理器根据NC程序控制脉冲发生电路。 因此,响应于来自脉冲发生电路的进给脉冲的第一和第二进给装置根据NC程序影响砂轮头和工件支撑台之间的相对运动,由此工件部分可以以自动确定的磨削顺序连续地接地 。

    Image sensor having micro-lens array separated with ridge structures and method of making
    27.
    发明授权
    Image sensor having micro-lens array separated with ridge structures and method of making 有权
    图像传感器具有用脊结构分离的微透镜阵列和制作方法

    公开(公告)号:US08031253B2

    公开(公告)日:2011-10-04

    申请号:US10603729

    申请日:2003-06-24

    申请人: Katsumi Yamamoto

    发明人: Katsumi Yamamoto

    CPC分类号: H01L27/14627 H01L27/14685

    摘要: An image sensor having micro-lenses is disclosed. The image sensor comprises a plurality of pixels formed in a semiconductor substrate, each pixel including a light sensitive element. A micro-lens is formed over each of the light sensitive elements. Finally, a raised ridge structure surrounds each of the micro-lenses.

    摘要翻译: 公开了一种具有微透镜的图像传感器。 图像传感器包括形成在半导体衬底中的多个像素,每个像素包括光敏元件。 在每个光敏元件上形成微透镜。 最后,围绕每个微透镜的凸脊结构。

    Solid-state image pickup device and method for manufacturing the same
    28.
    发明授权
    Solid-state image pickup device and method for manufacturing the same 有权
    固体摄像装置及其制造方法

    公开(公告)号:US07968961B2

    公开(公告)日:2011-06-28

    申请号:US12385762

    申请日:2009-04-17

    申请人: Katsumi Yamamoto

    发明人: Katsumi Yamamoto

    IPC分类号: H01L31/0203

    摘要: A solid-state image pickup device which includes a solid-state image pickup chip, a transparent plate disposed to face a light-receiving surface of the solid-state image pickup chip, a frame-like spacer disposed on a peripheral portion of the light-receiving surface of the solid-state image pickup chip for maintaining a space between the solid-state image pickup chip and the transparent plate, and an adhesion layer sealing a circumferential gap formed between the solid-state image pickup chip and the transparent plate, wherein the spacer includes a plurality of partition walls.

    摘要翻译: 一种固态图像拾取装置,包括固态图像拾取芯片,设置成面对固态图像拾取芯片的光接收表面的透明板,布置在光的周边部分上的框状间隔件 用于保持固态摄像芯片和透明板之间的空间的固态图像拾取芯片的接收表面以及密封形成在固态图像拾取芯片和透明板之间的周向间隙的粘附层, 其中所述间隔件包括多个分隔壁。

    Solid-state image pickup device and electronic instruments
    29.
    发明申请
    Solid-state image pickup device and electronic instruments 有权
    固态图像拾取装置和电子仪器

    公开(公告)号:US20090213254A1

    公开(公告)日:2009-08-27

    申请号:US12453113

    申请日:2009-04-29

    申请人: Katsumi Yamamoto

    发明人: Katsumi Yamamoto

    IPC分类号: H04N5/335 H04N5/225 H04M1/00

    摘要: A solid-state image pickup device which includes a circuit board provided with a hole and with a circuit layer formed thereon, a solid-state image pickup element housed in the hole and having an upper surface constituting a light-receiving face and electrodes formed on a peripheral portion of the upper surface, and a glass plate disposed over the light-receiving face and provided with a connecting conductive layer which is extended from the underside of the glass plate, via the sidewall of the glass plate, to the upper surface of the glass plate. The electrode is electrically connected with the connecting conductive layer formed on the underside of glass plate, and the connecting conductive layer is electrically connected with the circuit layer formed on the upper surface of the circuit board.

    摘要翻译: 一种固态图像拾取装置,其包括设置有孔和电路层的电路板,固体摄像元件,容纳在孔中并具有构成受光面的上表面和形成在 上表面的周边部分和玻璃板,其设置在光接收面上方,并且设置有从玻璃板的下侧经由玻璃板的侧壁延伸到其上表面的连接导电层 玻璃板。 电极与形成在玻璃板下侧的连接导电层电连接,并且连接导电层与形成在电路板的上表面上的电路层电连接。