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公开(公告)号：US20240038710A1
公开(公告)日：2024-02-01
申请号：US18338453
申请日：2023-06-21
IPC分类号： H01L23/00 , H01L23/373
CPC分类号： H01L24/29 , H01L24/32 , H01L23/3733 , H01L2924/10158 , H01L25/16
摘要： A heat radiation structure includes a vapor chamber provided along a surface of a die, a mesh interposed between the die and the vapor chamber, and a liquid metal impregnated in the mesh. In the mesh, a peripheral portion has a higher material density per unit volume than a central portion. In the mesh, the central portion may be formed of a single layer, and the peripheral portion is formed of two layers. The mesh may be a resin material.
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公开(公告)号：US20230079287A1
公开(公告)日：2023-03-16
申请号：US17859714
申请日：2022-07-07
摘要： An electronic apparatus uses the cooling effect of a vapor chamber and includes: a chassis; a motherboard which is provided in the chassis and has a CPU mounted on a front surface thereof; a vapor chamber having a working fluid sealed in a hermetically sealed space formed between two metal plates; a stud fixed to the upper surface of the vapor chamber; and a screw fixing the stud and the motherboard. The CPU is thermally connected to the upper surface of the vapor chamber. The motherboard has a mounting hole formed therein, and the screw is screwed to the stud through the mounting hole from the rear surface of the motherboard. The CPU is rectangular, and four studs and four screws are provided at positions in the vicinity of the four corners of the CPU.
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23.发明授权公开(公告)号：US11579676B2
公开(公告)日：2023-02-14
申请号：US16939526
申请日：2020-07-27
IPC分类号： G06F1/28 , G06F1/3225 , H05K7/20
摘要： Systems, apparatus, and methods that control power consumption in a processor are disclosed. One system apparatus, and method includes a processor that operates in at least a first power control mode including a first power amount and a second power control mode including a second power amount lower than the first power amount and a power control device. The power control device is configured to control power consumption in the processor, change a power control mode of the processor to the first power control mode in response to a first excess time period in which the power consumption of the processor exceeds a first reference power for a first period of time, and change the power control mode of the processor to the second power control mode in response to a second period of time in which the power consumption is less than or equal to a second reference power.
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公开(公告)号：US20210216120A1
公开(公告)日：2021-07-15
申请号：US17074917
申请日：2020-10-20
摘要： An electronic apparatus includes: an apparatus chassis including therein an electronic board; a keyboard provided on a top of the apparatus chassis; and a fan device that includes a fan chassis and a blade part. The fan chassis includes a first air intake formed on a bottom surface thereof, a second air intake formed on a top surface thereof, and an air outlet formed on a side surface thereof. The blade part rotates inside the fan chassis. The fan device is arranged between a basal plate and a bottom surface of the keyboard inside the apparatus chassis. The basal plate includes a first inlet at a position overlapping the first air intake. The keyboard includes a second inlet that makes air pass through the keyboard in an up-down direction thereof. The electronic apparatus further includes a first water stop member that separates the first air intake from the electronic board.
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25.发明申请公开(公告)号：US20210026430A1
公开(公告)日：2021-01-28
申请号：US16939526
申请日：2020-07-27
IPC分类号： G06F1/28 , G06F1/3225 , H05K7/20
摘要： Systems, apparatus, and methods that control power consumption in a processor are disclosed. One system apparatus, and method includes a processor that operates in at least a first power control mode including a first power amount and a second power control mode including a second power amount lower than the first power amount and a power control device. The power control device is configured to control power consumption in the processor, change a power control mode of the processor to the first power control mode in response to a first excess time period in which the power consumption of the processor exceeds a first reference power for a first period of time, and change the power control mode of the processor to the second power control mode in response to a second period of time in which the power consumption is less than or equal to a second reference power.
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公开(公告)号：US10509458B2
公开(公告)日：2019-12-17
申请号：US15864198
申请日：2018-01-08
IPC分类号： G06F1/00 , G06F1/3296 , G06F1/20 , G06F1/3206 , G06F1/28 , G06F9/4401
摘要： An information processing device suppresses the entering of a state unintended by a user in a standby mode. The information processing device, which has a standby mode and a normal operation mode, has a mode control portion changing the mode to the standby mode of bringing the state into a first low power consumption state and configured to be switched to a first operating state in which background processing is executed in response to a stop of a display of a display portion, and a power setting processing portion configured to set a first upper limit power consumption in the first operating state and a second upper limit power consumption in a second operating state in the normal operation mode, and set the first upper limit power consumption so as to be lower than the second upper limit power consumption when the mode control portion changes the mode to the standby mode.
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公开(公告)号：US20190313548A1
公开(公告)日：2019-10-10
申请号：US16022656
申请日：2018-06-28
IPC分类号： H05K7/20
摘要： The present invention aims to reduce noise derived from an operation sound of a fan while maintaining cooling capacity of the fan. A cooling system includes a fan which is disposed in a chassis in which a CPU which is exemplified as a heating element is housed, one temperature sensor which is disposed in the chassis, another temperature sensor which is disposed at a position which is different from a position of the one temperature sensor, and a fan control unit which drives the fan in a case where one temperature, which is based on a measured value of one temperature sensor, is at least a first threshold value or in a case where another temperature, which is based on a measured value of the other temperature sensor, is at least a second threshold value which is set to a value lower than the first threshold value.
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公开(公告)号：US20190037725A1
公开(公告)日：2019-01-31
申请号：US16040317
申请日：2018-07-19
发明人： Akinori Uchino , Kazuo Fujii , Takuroh Kamimura , Kenji Watamura , Hiroshi Yamazaki , Takanori Hoshino
摘要： An electronic apparatus is provided. The electronic apparatus includes a main body chassis equipped with a keyboard device, a CPU, a heat diffusion component and a heat transport component. The CPU is disposed on a rear end side beyond the keyboard device. The heat diffusion component is disposed at a position located under the keyboard device in a mutually superposed state. The heat transport component is connected between the CPU and the heat diffusion component to provide heat transfer.
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29.发明申请公开(公告)号：US20170337895A1
公开(公告)日：2017-11-23
申请号：US15599131
申请日：2017-05-18
发明人： Kazuhiro Kosugi , Takuroh Kamimura , Hiroki Oda , Atsushi Ohyama , Yuhsaku Sugai , Hideshi Tsukamoto , Hiroyuki Uchida
摘要： A method, apparatus and computer program product are disclosed. The method includes detecting ambient light around an electronic device, determining whether a user is present based on the ambient light, and controlling an operation of the electronic device. The apparatus includes a component that consumes electric power, a light sensor that detects ambient light, a frequency analyzing unit that specifies a frequency component, and a control unit that determines whether a user is present and controls an operation of the component. The computer program product includes code to perform detecting ambient light around an electronic device, determining whether a user is present based on the ambient light, and controlling an operation of the electronic device.
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公开(公告)号：US20240297094A1
公开(公告)日：2024-09-05
申请号：US18411320
申请日：2024-01-12
IPC分类号： H01L23/373 , G06F1/20 , H01L23/42 , H05K7/20
CPC分类号： H01L23/3737 , G06F1/206 , H01L23/42 , H05K7/20463
摘要： A heat dissipation structure, of a semiconductor chip that includes a substrate and a die provided on a top surface of the substrate, includes: a heat dissipator provided along a surface of the die; a liquid metal interposed between the die and the heat dissipator; and a thermal putty interposed between the substrate and the heat dissipator in a state of sealing therebetween and surrounding the die.
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