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公开(公告)号：US20230200013A1
公开(公告)日：2023-06-22
申请号：US17935088
申请日：2022-09-24
发明人： Kengo Sano , Masahiro Kitamura , Junki Hashiba , Shusaku Tomizawa
CPC分类号： H05K7/20336 , G06F1/203 , H05K7/20172 , H05K7/20154 , H05K7/20409
摘要： An electronic apparatus includes: a chassis; a first and a second heat generating elements which are placed with a step between surfaces thereof; and a cooling module that absorbs heat generated by the first and the second heat generating elements. The cooling module has: a first heat pipe having a first surface thereof connected to a surface of the first heat generating element; a plate-shaped vapor chamber having a first surface thereof connected to a surface of the second heat generating element and a second surface of the first heat pipe; a second heat pipe which is connected to a second surface of the vapor chamber and overlaps the second heat generating element; a first fin connected to the first heat pipe; and a second fin connected to the second heat pipe.
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公开(公告)号：US20240297094A1
公开(公告)日：2024-09-05
申请号：US18411320
申请日：2024-01-12
IPC分类号： H01L23/373 , G06F1/20 , H01L23/42 , H05K7/20
CPC分类号： H01L23/3737 , G06F1/206 , H01L23/42 , H05K7/20463
摘要： A heat dissipation structure, of a semiconductor chip that includes a substrate and a die provided on a top surface of the substrate, includes: a heat dissipator provided along a surface of the die; a liquid metal interposed between the die and the heat dissipator; and a thermal putty interposed between the substrate and the heat dissipator in a state of sealing therebetween and surrounding the die.
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公开(公告)号：US20230147548A1
公开(公告)日：2023-05-11
申请号：US17822154
申请日：2022-08-25
CPC分类号： G06F1/1662 , H05K7/20145
摘要： An electronic apparatus includes a chassis, a keyboard device which is installed on the upper surface side of the chassis and has a plurality of keycaps and a frame which is installed on the upper surface side of the chassis and isolates the respective keycaps of the keyboard device from one another, in which each of at least some of the plurality of keycaps has an upper plate which forms an operation surface, and side walls on four sides which are provided so as to hang down from a peripheral edge part of the upper plate and face the frame respectively, and in at least the side wall on one side of the side walls on the four sides, a flow path formation part which widens a clearance between that side wall and the frame and thereby forms an air flow path is provided.
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公开(公告)号：US12108561B2
公开(公告)日：2024-10-01
申请号：US17932720
申请日：2022-09-16
CPC分类号： H05K7/20145 , G06F1/203 , H05K7/20154 , H05K7/20172 , H05K7/20409
摘要： An electronic apparatus includes a chassis, a heating element in the chassis, and a cooling module in the chassis to cool the heating element. The cooling module includes: a blower fan; a heat sink having a plurality of fins spaced to have a gap therebetween, a first face with a first gap from the first cover member, and a second face with a second gap from the second cover member; a seal member attached to the first face of the heat sink so as to surround the first face; and a cover sheet attached to a surface of the seal member so as to cover the first face of the heat sink, thus defining a duct between the cover sheet and the first face to let air from the blower fan pass through the duct.
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公开(公告)号：US20240014098A1
公开(公告)日：2024-01-11
申请号：US18332816
申请日：2023-06-12
IPC分类号： H01L23/373 , G06F1/20
CPC分类号： H01L23/3733 , G06F1/20
摘要： A heat radiating structure includes a mesh which abuts on a surface of a die of a GPU and a copper plate which is equipped with a recessed part into which the mesh fits and which sandwiches and holds the mesh together with the surface of the die. The mesh includes a heat generating element abutment range part into which a liquid metal is impregnated and which abuts on the surface of the die and receives heat from the die and a heat generating element non-abutment region part which is contiguous to the heat generating element abutment range part and does not abut on the surface of the die. The heat generating element non-abutment range part is fixed to the copper plate with the use of a sponge tape. The heat generating element abutment range part is shaped to protrude from the heat generating element abutment range part.
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公开(公告)号：US20230189471A1
公开(公告)日：2023-06-15
申请号：US17932720
申请日：2022-09-16
CPC分类号： H05K7/20145 , G06F1/203 , H05K7/20172 , H05K7/20409 , H05K7/20154
摘要： An electronic apparatus includes a chassis, a heating element in the chassis, and a cooling module in the chassis to cool the heating element. The cooling module includes: a blower fan; a heat sink having a plurality of fins spaced to have a gap therebetween, a first face with a first gap from the first cover member, and a second face with a second gap from the second cover member; a seal member attached to the first face of the heat sink so as to surround the first face; and a cover sheet attached to a surface of the seal member so as to cover the first face of the heat sink, thus defining a duct between the cover sheet and the first face to let air from the blower fan pass through the duct.
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公开(公告)号：US12096598B2
公开(公告)日：2024-09-17
申请号：US17935088
申请日：2022-09-24
发明人： Kengo Sano , Masahiro Kitamura , Junki Hashiba , Shusaku Tomizawa
CPC分类号： H05K7/20336 , G06F1/203 , H05K7/20154 , H05K7/20172 , H05K7/20409
摘要： An electronic apparatus includes: a chassis; a first and a second heat generating elements which are placed with a step between surfaces thereof; and a cooling module that absorbs heat generated by the first and the second heat generating elements. The cooling module has: a first heat pipe having a first surface thereof connected to a surface of the first heat generating element; a plate-shaped vapor chamber having a first surface thereof connected to a surface of the second heat generating element and a second surface of the first heat pipe; a second heat pipe which is connected to a second surface of the vapor chamber and overlaps the second heat generating element; a first fin connected to the first heat pipe; and a second fin connected to the second heat pipe.
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公开(公告)号：US20240038710A1
公开(公告)日：2024-02-01
申请号：US18338453
申请日：2023-06-21
IPC分类号： H01L23/00 , H01L23/373
CPC分类号： H01L24/29 , H01L24/32 , H01L23/3733 , H01L2924/10158 , H01L25/16
摘要： A heat radiation structure includes a vapor chamber provided along a surface of a die, a mesh interposed between the die and the vapor chamber, and a liquid metal impregnated in the mesh. In the mesh, a peripheral portion has a higher material density per unit volume than a central portion. In the mesh, the central portion may be formed of a single layer, and the peripheral portion is formed of two layers. The mesh may be a resin material.
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公开(公告)号：US20230152867A1
公开(公告)日：2023-05-18
申请号：US17934158
申请日：2022-09-21
发明人： Masahiro Kitamura , Junki Hashiba , Po Han Chen , Satoshi Douzono
CPC分类号： G06F1/203 , H05K7/20136 , G06F1/1662 , G06F3/0213
摘要： An electronic apparatus includes a chassis, a keyboard device, a frame including partition walls, and a fan device. At least part of the partition walls has a bottom edge surface notched to form an air flow path between the notched bottom edge surface and a top surface of the plate-shaped member, to have a communicating path through which adjacent key arrangement holes communicate. A height of the communicating path in a region not overlapping with the fan device is lower than a height of the communicating path in a region overlapping with the fan device, in a plan view of the chassis.
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公开(公告)号：US12124303B2
公开(公告)日：2024-10-22
申请号：US17934158
申请日：2022-09-21
发明人： Masahiro Kitamura , Junki Hashiba , Po Han Chen , Satoshi Douzono
CPC分类号： G06F1/203 , G06F1/1662 , G06F3/0213 , H05K7/20136
摘要： An electronic apparatus includes a chassis, a keyboard device, a frame including partition walls, and a fan device. At least part of the partition walls has a bottom edge surface notched to form an air flow path between the notched bottom edge surface and a top surface of the plate-shaped member, to have a communicating path through which adjacent key arrangement holes communicate. A height of the communicating path in a region not overlapping with the fan device is lower than a height of the communicating path in a region overlapping with the fan device, in a plan view of the chassis.
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