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公开(公告)号：US20060024880A1
公开(公告)日：2006-02-02
申请号：US11189690
申请日：2005-07-26
申请人： Clarence Chui , William Cummings , Brian Gally , Ming-Hau Tung
发明人： Clarence Chui , William Cummings , Brian Gally , Ming-Hau Tung
IPC分类号： H01L21/8238
CPC分类号： B81B3/001 , B81B2201/042 , G02B26/001
摘要： An interferometric modulator is formed by a stationary layer and a mirror facing the stationary layer. The mirror is movable between the undriven and driven positions. Landing pads, bumps or spring clips are formed on at least one of the stationary layer and the mirror. The landing pads, bumps or spring clips can prevent the stationary layer and the mirror from contacting each other when the mirror is in the driven position. The spring clips exert force on the mirror toward the undriven position when the mirror is in the driven position and in contact with the spring clips.
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公开(公告)号：US20120127556A1
公开(公告)日：2012-05-24
申请号：US13353132
申请日：2012-01-18
CPC分类号： B81B7/0067 , B81B2201/045 , B81C2203/0109 , B81C2203/0145 , B81C2203/019 , G02B26/001
摘要： A package structure and method of packaging for an interferometric modulator. A transparent substrate having an interferometric modulator formed thereon is provided. A backplane is joined to the transparent substrate with a seal where the interferometric modulator is exposed to the surrounding environment through an opening in either the backplane or the seal. The opening is sealed after the transparent substrate and backplane are joined and after any desired desiccant, release material, and/or self-aligning monolayer is introduced into the package structure.
摘要翻译： 用于干涉式调制器的封装结构和封装方法。 提供了其上形成有干涉式调制器的透明基板。 背板通过密封件连接到透明基板上，其中干涉式调制器通过背板或密封件中的开口暴露于周围环境。 在透明基板和背板接合之后，并且在任何期望的干燥剂，剥离材料和/或自对准单层被引入到包装结构中之后，将开口密封。
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公开(公告)号：US07816710B2
公开(公告)日：2010-10-19
申请号：US12019590
申请日：2008-01-24
IPC分类号： H01L29/80
CPC分类号： G02B26/001
摘要： A package is made of a transparent substrate having an interferometric modulator and a back plate. A non-hermetic seal joins the back plate to the substrate to form a package, and a desiccant resides inside the package. A method of packaging an interferometric modulator includes providing a transparent substrate and manufacturing an interferometric modulator array on a backside of the substrate. A back plate includes a curved portion relative to the substrate. The curved portion is substantially throughout the back plate. The back plate is sealed to the backside of the substrate with a back seal in ambient conditions, thereby forming a package.
摘要翻译： 封装由具有干涉式调制器和背板的透明基板制成。 非气密密封件将背板连接到基板以形成包装，并且干燥剂驻留在包装内。 封装干涉式调制器的方法包括提供透明衬底并在衬底的背面制造干涉式调制器阵列。 背板包括相对于基板的弯曲部分。 弯曲部分基本上遍及后板。 背板在环境条件下用背密封件密封到基板的背面，由此形成封装。
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公开(公告)号：US07443563B2
公开(公告)日：2008-10-28
申请号：US11653088
申请日：2007-01-12
IPC分类号： G02F1/03
CPC分类号： G02B26/001
摘要： A package is made of a transparent substrate having an interferometric modulator and a back plate. A non-hermetic seal joins the back plate to the substrate to form a package, and a desiccant resides inside the package. A method of packaging an interferometric modulator includes providing a transparent substrate and manufacturing an interferometric modulator array on a backside of the substrate. A back plate is provided and a desiccant is applied to the back plate. The back plate is sealed to the backside of the substrate with a back seal in ambient conditions, thereby forming a package.
摘要翻译： 封装由具有干涉式调制器和背板的透明基板制成。 非气密密封件将背板连接到基板以形成包装，并且干燥剂驻留在包装内。 封装干涉式调制器的方法包括提供透明衬底并在衬底的背面制造干涉式调制器阵列。 设置背板，并将干燥剂施加到背板上。 背板在环境条件下用背密封件密封到基板的背面，由此形成封装。
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公开(公告)号：US20060219435A1
公开(公告)日：2006-10-05
申请号：US11436345
申请日：2006-05-18
申请人： Manish Kothari , Clarence Chui , Lauren Palmateer
发明人： Manish Kothari , Clarence Chui , Lauren Palmateer
IPC分类号： H01R13/46
CPC分类号： G02B26/001 , B81B7/0038
摘要： A MEMS device is packaged with a control material that is included in the package to affect an operation of a moveable element of the device. The control material may affect operational characteristics including actuation and release voltages and currents, mechanical affects including damping and stiffness, lifetime of the device, optical properties, thermal affects and corrosion. The control material may be inserted into the package as part of any of several structural components of the package or the MEMS device.
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公开(公告)号：US20050247477A1
公开(公告)日：2005-11-10
申请号：US10839307
申请日：2004-05-04
申请人： Manish Kothari , Clarence Chui , Lauren Palmateer
发明人： Manish Kothari , Clarence Chui , Lauren Palmateer
CPC分类号： G02B26/001 , B81B7/0038
摘要： A device has a first surface. A second surface is offset from a first surface to form a package. At least one movable element is within the package having a movable surface to contact another surface. An environmental control material is included inside the package to affect an operation of the movable element.
摘要翻译： 设备具有第一表面。 第二表面偏离第一表面以形成包装。 至少一个可移动元件在封装内具有可移动的表面以接触另一表面。 包装内包含环境控制材料以影响可移动元件的操作。
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公开(公告)号：US07060895B2
公开(公告)日：2006-06-13
申请号：US10839307
申请日：2004-05-04
申请人： Manish Kothari , Clarence Chui , Lauren Palmateer
发明人： Manish Kothari , Clarence Chui , Lauren Palmateer
IPC分类号： H01L23/18
CPC分类号： G02B26/001 , B81B7/0038
摘要： A MEMS device is packaged with a control material that is included in the package to affect an operation of a moveable element of the device. The control material may affect operational characteristics including actuation and release voltages and currents, mechanical affects including damping and stiffness, lifetime of the device, optical properties, thermal affects and corrosion. The control material may be inserted into the package as part of any of several structural components of the package or the MEMS device.
摘要翻译： MEMS装置与包含在包装中的控制材料一起被包装以影响装置的可移动元件的操作。 控制材料可能影响操作特性，包括致动和释放电压和电流，机械影响包括阻尼和刚度，器件寿命，光学性能，热影响和腐蚀。 控制材料可以作为封装或MEMS器件的几个结构部件中的任何一个插入到封装中。
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公开(公告)号：US08853747B2
公开(公告)日：2014-10-07
申请号：US12904825
申请日：2010-10-14
CPC分类号： G02B26/001
摘要： A package is made of a transparent substrate having an interferometric modulator and a back plate. A non-hermetic seal joins the back plate to the substrate to form a package, and a desiccant resides inside the package. A method of packaging an interferometric modulator includes providing a transparent substrate and manufacturing an interferometric modulator array on a backside of the substrate. A back plate includes a curved portion relative to the substrate. The curved portion is substantially throughout the back plate. The back plate is sealed to the backside of the substrate with a back seal in ambient conditions, thereby forming a package.
摘要翻译： 封装由具有干涉式调制器和背板的透明基板制成。 非气密密封件将背板连接到基板以形成包装，并且干燥剂驻留在包装内。 封装干涉式调制器的方法包括提供透明衬底并在衬底的背面制造干涉式调制器阵列。 背板包括相对于基板的弯曲部分。 弯曲部分基本上遍及后板。 背板在环境条件下用背密封件密封到基板的背面，由此形成封装。
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公开(公告)号：US20080164544A1
公开(公告)日：2008-07-10
申请号：US12019590
申请日：2008-01-24
CPC分类号： G02B26/001
摘要： A package is made of a transparent substrate having an interferometric modulator and a back plate. A non-hermetic seal joins the back plate to the substrate to form a package, and a desiccant resides inside the package. A method of packaging an interferometric modulator includes providing a transparent substrate and manufacturing an interferometric modulator array on a backside of the substrate. A back plate includes a curved portion relative to the substrate. The curved portion is substantially throughout the back plate. The back plate is sealed to the backside of the substrate with a back seal in ambient conditions, thereby forming a package.
摘要翻译： 封装由具有干涉式调制器和背板的透明基板制成。 非气密密封件将背板连接到基板以形成包装，并且干燥剂驻留在包装内。 封装干涉式调制器的方法包括提供透明衬底并在衬底的背面制造干涉式调制器阵列。 背板包括相对于基板的弯曲部分。 弯曲部分基本上遍及后板。 背板在环境条件下用背密封件密封到基板的背面，由此形成封装。
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公开(公告)号：US08124434B2
公开(公告)日：2012-02-28
申请号：US11150496
申请日：2005-06-10
IPC分类号： H01L21/00
CPC分类号： B81B7/0067 , B81B2201/045 , B81C2203/0109 , B81C2203/0145 , B81C2203/019 , G02B26/001
摘要： A package structure and method of packaging for an interferometric modulator. A transparent substrate having an interferometric modulator formed thereon is provided. A backplane is joined to the transparent substrate with a seal where the interferometric modulator is exposed to the surrounding environment through an opening in either the backplane or the seal. The opening is sealed after the transparent substrate and backplane are joined and after any desired desiccant, release material, and/or self-aligning monolayer is introduced into the package structure.
摘要翻译： 用于干涉式调制器的封装结构和封装方法。 提供了其上形成有干涉式调制器的透明基板。 背板通过密封件连接到透明基板上，其中干涉式调制器通过背板或密封件中的开口暴露于周围环境。 在透明基板和背板接合之后，并且在任何期望的干燥剂，剥离材料和/或自对准单层被引入到包装结构中之后，将开口密封。
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