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239 条记录 (耗时 0.053 秒)

    Cooling apparatus, cooled electronic module and methods of fabrication thereof employing an integrated manifold and a plurality of thermally conductive fins
    21.
    发明授权
    Cooling apparatus, cooled electronic module and methods of fabrication thereof employing an integrated manifold and a plurality of thermally conductive fins 有权
    冷却装置，冷却电子模块及其采用集成歧管和多个导热翅片的制造方法

    公开(公告)号：US07233494B2

    公开(公告)日：2007-06-19

    申请号：US11124064

    申请日：2005-05-06

    申请人： Levi A. Campbell ,  Richard C. Chu ,  Michael J. Ellsworth, Jr. ,  Madhusudan K. Iyengar ,  Roger R. Schmidt ,  Robert E. Simons

    发明人： Levi A. Campbell ,  Richard C. Chu ,  Michael J. Ellsworth, Jr. ,  Madhusudan K. Iyengar ,  Roger R. Schmidt ,  Robert E. Simons

    IPC分类号： H05K7/20

    CPC分类号： H01L23/4735 ,  H01L2924/0002 ,  H01L2924/00

    摘要： A cooling apparatus and method of fabrication are provided for facilitating removal of heat from a heat generating electronic device. The cooling apparatus includes a plurality of thermally conductive fins coupled to and projecting away from a surface to be cooled. The fins facilitate transfer of heat from the surface to be cooled. The apparatus further includes an integrated manifold having a plurality of inlet orifices for injecting coolant onto the surface to be cooled, and a plurality of outlet openings for exhausting coolant after impinging on the surface to be cooled. The inlet orifices and the outlet openings are interspersed in a common surface of the integrated manifold. Further, the integrated manifold and the surface to be cooled are disposed with the common surface of the manifold and the surface to be cooled in spaced, opposing relation, and with the plurality of thermally conductive fins disposed therebetween.

    摘要翻译： 提供冷却装置和制造方法以便于从发热电子装置中除去热量。 冷却装置包括耦合到待冷却表面并远离待冷却表面的多个导热翅片。 散热片有助于从要冷却的表面传递热量。 该装置还包括具有多个用于将冷却剂喷射到待冷却表面上的入口孔的集成歧管，以及用于在撞击待冷却表面之后排出冷却剂的多个出口开口。 入口孔和出口开口散布在集成歧管的共同表面中。 此外，集成歧管和要冷却的表面与歧管的共同表面和待冷却的表面以间隔相对的关系设置，并且多个导热翅片设置在它们之间。

    Electronic device cooling assembly and method employing elastic support material holding a plurality of thermally conductive pins
    22.
    发明授权
    Electronic device cooling assembly and method employing elastic support material holding a plurality of thermally conductive pins 失效
    电子设备冷却组件和使用保持多个导热销的弹性支撑材料的方法

    公开(公告)号：US07206203B2

    公开(公告)日：2007-04-17

    申请号：US10873432

    申请日：2004-06-22

    申请人： Levi A. Campbell ,  Richard C. Chu ,  Michael J. Ellsworth, Jr. ,  Madhusudan K. Iyengar ,  Robert E. Simons ,  Roger R. Schmidt

    发明人： Levi A. Campbell ,  Richard C. Chu ,  Michael J. Ellsworth, Jr. ,  Madhusudan K. Iyengar ,  Robert E. Simons ,  Roger R. Schmidt

    IPC分类号： H05K7/20 ,  H01L23/34 ,  H02G3/03 ,  F28F7/00

    CPC分类号： H01L23/4336 ,  H01L2924/0002 ,  H01L2924/09701 ,  H01L2924/00

    摘要： An electronic device cooling assembly and fabrication method are provided which include a manifold with an orifice for injecting a cooling liquid onto a surface to be cooled, and an elastic pin support material with an opening aligned to the orifice of the manifold. Multiple thermally conductive pins are mounted within the support material, extending therefrom, and are sized to physically contact the surface to be cooled. The support material has a thickness and compliance which facilitates thermal interfacing of the pins to the surface by allowing second ends thereof to move vertically and tilt. The second end of each pin has a planar surface which is normal to an axis of the pin, and the support material facilitates the planar surfaces of the second pin ends establishing planar contact with the surface to be cooled, notwithstanding that the surface may be other than planar.

    摘要翻译： 提供了一种电子设备冷却组件和制造方法，其包括具有用于将冷却液体喷射到待冷却表面上的孔口的歧管以及具有与歧管孔口对准的开口的弹性销支撑材料。 多个导热销安装在支撑材料内，从其延伸，并且其尺寸设计成物理接触要冷却的表面。 支撑材料具有厚度和顺从性，其通过允许其第二端垂直移动和倾斜来促进销与表面的热接合。 每个销的第二端具有垂直于销的轴线的平坦表面，并且支撑材料有助于第二销端的平面表面与待冷却的表面建立平面接触，尽管表面可以是其他 比平面。

    Vapor condenser with three-dimensional folded structure
    23.
    发明授权
    Vapor condenser with three-dimensional folded structure 有权
    蒸汽冷凝器具有三维折叠结构

    公开(公告)号：US08941994B2

    公开(公告)日：2015-01-27

    申请号：US13613753

    申请日：2012-09-13

    申请人： Levi A. Campbell ,  Richard C. Chu ,  Milnes P. David ,  Michael J. Ellsworth, Jr. ,  Madhusudan K. Iyengar ,  Roger R. Schmidt ,  Robert E. Simons

    发明人： Levi A. Campbell ,  Richard C. Chu ,  Milnes P. David ,  Michael J. Ellsworth, Jr. ,  Madhusudan K. Iyengar ,  Roger R. Schmidt ,  Robert E. Simons

    IPC分类号： H05K7/20 ,  F28F3/00

    CPC分类号： H05K7/20309 ,  B23P15/26 ,  F28D9/0025 ,  F28D15/02 ,  F28F3/046 ,  F28F3/12 ,  F28F9/02 ,  H05K7/203 ,  H05K7/20809 ,  Y10T29/4935 ,  Y10T29/49359 ,  Y10T29/49396

    摘要： A vapor condenser is provided which includes a three-dimensional folded structure which defines, at least in part, a set of coolant-carrying channels and a set of vapor condensing channels, with the coolant-carrying channels being interleaved with and extending parallel to the vapor condensing channels. The folded structure includes a thermally conductive sheet with multiple folds in the sheet. One side of the sheet is a vapor condensing surface, and the opposite side of the sheet is a coolant-cooled surface, with at least a portion of the coolant-cooled surface defining the coolant-carrying channels, and being in contact with coolant within the coolant-carrying channels. The vapor condenser further includes, in one embodiment, a top plate, and first and second end manifolds which are coupled to opposite ends of the folded structure and in fluid communication with the coolant-carrying channels to facilitate flow of coolant through the coolant-carrying channels.

    摘要翻译： 提供了一种蒸汽冷凝器，其包括三维折叠结构，其至少部分地限定一组冷却剂传送通道和一组蒸气冷凝通道，其中冷却剂传送通道与 蒸汽冷凝通道。 折叠结构包括在片材中具有多个折叠的导热片。 片材的一侧是蒸汽冷凝表面，并且片材的相对侧是冷却剂冷却的表面，冷却剂冷却表面的至少一部分限定了冷却剂传送通道，并与冷却剂内部的冷却剂接触 冷却液承载通道。 蒸气冷凝器在一个实施例中还包括顶板，以及第一和第二端部歧管，其连接到折叠结构的相对端并与冷却剂承载通道流体连通以便于冷却剂流过冷却剂携带 频道

    Thermally conductive composite interface, cooled electronic assemblies employing the same, and methods of fabrication thereof
    24.
    发明授权
    Thermally conductive composite interface, cooled electronic assemblies employing the same, and methods of fabrication thereof 失效
    导热复合材料界面，使用其的冷却电子组件及其制造方法

    公开(公告)号：US08322029B2

    公开(公告)日：2012-12-04

    申请号：US13087678

    申请日：2011-04-15

    申请人： Levi A. Campbell ,  Richard C. Chu ,  Michael J. Ellsworth, Jr. ,  Keith F. Fogel ,  Madhusudan K. Iyengar ,  Roger R. Schmidt ,  Robert E. Simons

    发明人： Levi A. Campbell ,  Richard C. Chu ,  Michael J. Ellsworth, Jr. ,  Keith F. Fogel ,  Madhusudan K. Iyengar ,  Roger R. Schmidt ,  Robert E. Simons

    IPC分类号： H05K3/20 ,  F28F7/00

    CPC分类号： H01L23/3677 ,  H01L2224/78301 ,  Y10T29/49128 ,  Y10T29/4935 ,  H01L2924/00014

    摘要： A composite interface and methods of fabrication are provided for coupling a cooling assembly to an electronic device. The interface includes a plurality of thermally conductive wires formed of a first material having a first thermal conductivity, and a thermal interface material at least partially surrounding the wires. The interface material, which thermally interfaces the cooling assembly to a surface to be cooled of the electronic device, is a second material having a second thermal conductivity, wherein the first thermal conductivity is greater than the second thermal conductivity. At least some wires reside partially over a first region of higher heat flux and extend partially over a second region of lower heat flux, wherein the first and second regions are different regions of the surface to he cooled. These wires function as thermal spreaders facilitating heat transfer from the surface to be cooled to the cooling assembly.

    摘要翻译： 提供了复合界面和制造方法，用于将冷却组件连接到电子设备。 界面包括由具有第一导热性的第一材料形成的多个导热丝，以及至少部分地围绕线的热界面材料。 将冷却组件与待冷却的电子设备的表面热接合的界面材料是具有第二导热性的第二材料，其中第一热导率大于第二导热系数。 至少一些线部分地位于较高热通量的第一区域上，并且部分地延伸在较低热通量的第二区域上，其中第一和第二区域是要冷却的表面的不同区域。 这些电线作为热扩散器起促进从待冷却表面到冷却组件的热传递。

    Dual-chamber fluid pump for a multi-fluid electronics cooling system and method
    25.
    发明授权
    Dual-chamber fluid pump for a multi-fluid electronics cooling system and method 有权
    双腔流体泵用于多流体电子冷却系统和方法

    公开(公告)号：US08230906B2

    公开(公告)日：2012-07-31

    申请号：US12850104

    申请日：2010-08-04

    申请人： Levi A. Campbell ,  Richard C. Chu ,  Michael J. Ellsworth, Jr. ,  Madhusudan K. Iyengar ,  Roger R. Schmidt ,  Robert E. Simons

    发明人： Levi A. Campbell ,  Richard C. Chu ,  Michael J. Ellsworth, Jr. ,  Madhusudan K. Iyengar ,  Roger R. Schmidt ,  Robert E. Simons

    IPC分类号： F28D15/00 ,  H05K7/20

    CPC分类号： H05K7/20218

    摘要： A dual-chamber fluid pump is provided for a multi-fluid electronics cooling system and method. The pump has a first fluid path for pumping a first fluid coolant and a second fluid path for pumping a second fluid coolant, with the first fluid path including a first pumping chamber and the second fluid path including a second pumping chamber. The first and second pumping chambers are separated by at least one diaphragm, and an actuator is coupled to the diaphragm for transitioning the diaphragm between a first position and a second position. Transitioning of the diaphragm to the first position pumps first fluid coolant from the first pumping chamber while concurrently drawing second fluid coolant into the second pumping chamber, and transitioning of the diaphragm to the second position pumps second fluid coolant from the second pumping chamber while concurrently drawing first fluid coolant into the first pumping chamber.

    摘要翻译： 为多流体电子冷却系统和方法提供双室流体泵。 泵具有用于泵送第一流体冷却剂的第一流体路径和用于泵送第二流体冷却剂的第二流体路径，其中第一流体路径包括第一泵送室，第二流体路径包括第二泵送室。 第一和第二泵送室由至少一个隔膜隔开，并且致动器联接到隔膜，用于在第一位置和第二位置之间转换隔膜。 将隔膜转换到第一位置将第一流体冷却剂从第一泵送室抽出，同时将第二流体冷却剂拉入第二泵送室，并且将膜片转移到第二位置，从第二泵送室泵送第二流体冷却剂，同时拉伸 第一流体冷却剂进入第一泵送室。

    Redundant assembly for a liquid and air cooled module
    26.
    发明授权
    Redundant assembly for a liquid and air cooled module 有权
    液体和空气冷却模块的冗余组件

    公开(公告)号：US08051897B2

    公开(公告)日：2011-11-08

    申请号：US11290899

    申请日：2005-11-30

    申请人： Levi A. Campbell ,  Richard C. Chu ,  Michael J. Ellsworth, Jr. ,  Madhusudan K. Iyengar ,  Roger R. Schmidt ,  Robert E. Simons

    发明人： Levi A. Campbell ,  Richard C. Chu ,  Michael J. Ellsworth, Jr. ,  Madhusudan K. Iyengar ,  Roger R. Schmidt ,  Robert E. Simons

    IPC分类号： F28F7/00 ,  H05K7/20 ,  H05K5/00

    CPC分类号： H05K7/20772

    摘要： A redundant assembly for an air and liquid cooled module is provided. The redundant cooling assembly comprises an air and liquid cooled module having a cold plate in thermal communication with a side attached auxiliary drawer. The auxiliary drawer houses a heat exchanger, a liquid pump with piping such that the heat exchanger, the liquid pump with piping and the cold plate form a closed liquid cooling loop. The auxillary drawer also housing an air moving device such that air can readily pass through the air moving device and the heat exchanger in order to provide air cooling. In one embodiment of the invention, fins are disposed on the cold plate to provide cooling in case the pump or the air moving device or both encounter a failure. In alternate embodiments, multiple pumps and/or multiple air moving devices can be used with or without the cold plate fins to provide redundancies.

    摘要翻译： 提供了一种用于空气和液体冷却模块的冗余组件。 冗余冷却组件包括空气和液体冷却模块，其具有与附接辅助抽屉热连通的冷板。 辅助抽屉装有一个热交换器，一个带有管道的液体泵，使得热交换器，带管道的液体泵和冷板形成一个封闭的液体冷却回路。 辅助抽屉还容纳空气移动装置，使得空气可以容易地通过空气移动装置和热交换器以提供空气冷却。 在本发明的一个实施例中，在泵或空气移动装置或两者都遇到故障的情况下，翅片设置在冷板上以提供冷却。 在替代实施例中，多个泵和/或多个空气移动装置可以使用或不使用冷板翅片来提供冗余。

    Method of assembling a cooling system for a multi-component electronics system
    28.
    发明授权
    Method of assembling a cooling system for a multi-component electronics system 失效
    组装多组件电子系统的冷却系统的方法

    公开(公告)号：US07641101B2

    公开(公告)日：2010-01-05

    申请号：US11539907

    申请日：2006-10-10

    申请人： Levi A. Campbell ,  Richard C. Chu ,  Michael J. Ellsworth, Jr. ,  Madhusudan K. Iyengar ,  Roger R. Schmidt ,  Robert E. Simons

    发明人： Levi A. Campbell ,  Richard C. Chu ,  Michael J. Ellsworth, Jr. ,  Madhusudan K. Iyengar ,  Roger R. Schmidt ,  Robert E. Simons

    IPC分类号： H05K7/20 ,  F28F7/00

    CPC分类号： H05K7/20772 ,  H05K7/20009 ,  Y10T29/4935 ,  Y10T29/49359 ,  Y10T29/49895

    摘要： A cooling system assembly method including: providing a support fixture having a multi-level support surface and multiple positioning dowels extending therefrom; positioning multiple liquid-cooled cold plates on the support surface employing the multiple dowels, the dowels providing relative positioning and alignment of the cold plates for facilitating subsequent coupling thereof to electronic components to be cooled; sealing multiple coolant-carrying tubes in fluid communication with the cold plates; and sealing a header subassembly to the coolant-carrying tubes to provide an assembled liquid-based cooling system. In operation, the support fixture facilitates shipping of the assembled cooling system by maintaining the components in fixed relation. A transfer fixture is employed in removing the cooling system from the support fixture and placing the cooling system in engagement with the electronics system. The transfer fixture includes multiple clips engaging and holding components of cooling system in fixed relation when removed from the support fixture.

    摘要翻译： 一种冷却系统组装方法，包括：提供具有多级支撑表面的支撑夹具和从其延伸的多个定位销; 使用多个销钉将多个液冷冷板定位在支撑表面上，该销钉提供冷板的相对定位和对准，以便于其随后与要冷却的电子部件的耦合; 密封与冷板流体连通的多个冷却剂供给管; 并将集管组件密封到冷却剂供给管以提供组装的基于液体的冷却系统。 在操作中，支撑夹具有助于通过将部件保持固定关系来运输组装的冷却系统。 使用转移夹具来从支撑固定装置移除冷却系统并将冷却系统放置在与电子系统接合的位置。 转移夹具包括多个夹具，当从支撑固定装置移除时，将固定关系的冷却系统的部件接合并保持。

    Method and air-cooling unit with dynamic airflow and heat removal adjustability
    30.
    发明授权
    Method and air-cooling unit with dynamic airflow and heat removal adjustability 有权
    方法和空气冷却装置具有动态气流和散热可调性

    公开(公告)号：US07630795B2

    公开(公告)日：2009-12-08

    申请号：US12031961

    申请日：2008-02-15

    申请人： Levi A. Campbell ,  Richard C. Chu ,  Michael J. Ellsworth, Jr. ,  Madhusudan K. Iyengar ,  Roger R. Schmidt ,  Robert E. Simons

    发明人： Levi A. Campbell ,  Richard C. Chu ,  Michael J. Ellsworth, Jr. ,  Madhusudan K. Iyengar ,  Roger R. Schmidt ,  Robert E. Simons

    IPC分类号： G05D23/00 ,  F25D23/12 ,  H05K7/20

    CPC分类号： F28D15/00 ,  F28F27/00 ,  F28F2250/08 ,  H05K7/20745 ,  H05K7/2079 ,  H05K7/20836

    摘要： Method and air-cooling unit are provided for dynamically adjusting airflow rate through and heat removal rate of the air-cooling unit to facilitate cooling of one or more electronics racks of a data center. The air-cooling unit includes a housing, an air-moving device, and an air-to-liquid heat exchanger. The air-moving device moves air through the housing from the air inlet side to the air outlet side thereof, and the heat exchanger cools the air passing through the housing. A control unit controls the air-moving device and the flow of liquid coolant through the heat exchanger to automatically, dynamically adjust airflow rate and heat removal rate of the air-cooling unit to achieve a current airflow rate target and current heat removal rate target therefore. The current targets are based on airflow rate through and heat load generated by one or more associated electronics racks of the data center.

    摘要翻译： 提供了一种方法和空气冷却装置，用于动态地调节空气冷却装置的气流速率和散热率，以便于冷却数据中心的一个或多个电子机架。 空气冷却单元包括壳体，空气移动装置和空气对液体热交换器。 空气移动装置将空气从空气入口侧移动到其空气出口侧，并且热交换器冷却通过壳体的空气。 控制单元通过热交换器控制空气移动装置和液体冷却剂的流动，自动地动态地调节空气冷却装置的气流速率和排热速率，从而实现目前的气流速度目标和目前的除热率目标 。 目前的目标是基于数据中心的一个或多个相关的电子机架产生的气流速率和热负荷。