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公开(公告)号：US20200376257A1
公开(公告)日：2020-12-03
申请号：US16947948
申请日：2020-08-25
Applicant: Medtronic, Inc.
Inventor： Anthony M. Chasensky , Bernard Q. Li , Brad C. Tischendorf , Chris J. Paidosh , Christian S. Nielsen , Craig L. Schmidt , Eric H. Bonde , Erik R. Scott , Gabriela C. Molnar , Gordon O. Munns , John E. Kast , Joseph J. Viavattine , Markus W. Reiterer , Michael J. Ebert , Phillip C. Falkner , Prabhakar A. Tamirisa , Randy S. Roles , Reginald D. Robinson , Richard T. Stone , Shawn C. Kelley , Thomas P. Miltich , Todd V. Smith , Xuan K. Wei
Abstract: A neuromodulation therapy is delivered via at least one electrode implanted subcutaneously and superficially to a fascia layer superficial to a nerve of a patient. In one example, an implantable medical device is deployed along a superficial surface of a deep fascia tissue layer superficial to a nerve of a patient. Electrical stimulation energy is delivered to the nerve through the deep fascia tissue layer via implantable medical device electrodes.
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Patent Agency Ranking
公开(公告)号：US20190201709A1
公开(公告)日：2019-07-04
申请号：US16291170
申请日：2019-03-04
Applicant: Medtronic, Inc.
Inventor： Brad C. Tischendorf , Gordon O. Munns , Christian S. Nielsen , John D. Norton , Markus W. Reiterer , Andrew J. Thom , Kunal J. Paralikar
CPC classification number: A61N5/0601 , A61N1/05 , A61N1/36 , A61N2005/0626 , A61N2005/0651
Abstract: An implantable active medical device system includes an active medical device and a lead extending between a proximal portion electrically coupled to the active medical device and a distal end portion configured to emit light. The distal end portion includes a solid state light source disposed within a light transmissive ring element. The light transmissive ring element forms an exterior segment of the distal end portion. The light transmissive ring element defines at least a portion of a hermetic cavity.
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公开(公告)号：US20190126028A1
公开(公告)日：2019-05-02
申请号：US16232724
申请日：2018-12-26
Applicant: Medtronic, Inc.
Inventor： Brad C. Tischendorf , John E. Kast , Thomas P. Miltich , Gordon O. Munns , Randy S. Roles , Craig L. Schmidt , Joseph J. Viavattine , Christian S. Nielsen , Prabhakar A. Tamirisa , Anthony M. Chasensky , Markus W. Reiterer , Chris J. Paidosh , Reginald D. Robinson , Bernard Q. Li , Erik R. Scott , Phillip C. Falkner , Xuan K. Wei , Eric H. Bonde
Abstract: An implantable medical device (IMD) has a housing enclosing an electronic circuit. The housing includes a first housing portion, a second housing portion and a joint coupling the first housing portion to the second housing portion. A polymer seal is positioned in the joint in various embodiments. Other embodiments of an IMD housing are disclosed.
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公开(公告)号：US10245441B2
公开(公告)日：2019-04-02
申请号：US14694134
申请日：2015-04-23
Applicant: Medtronic, Inc.
Inventor： Brad C. Tischendorf , Gordon O. Munns , Christian S. Nielsen , John D. Norton , Markus W. Reiterer , Andrew J. Thom , Kunal J. Paralikar
Abstract: An implantable active medical device system includes an active medical device and a lead extending between a proximal portion electrically coupled to the active medical device and a distal end portion configured to emit light. The distal end portion includes a solid state light source disposed within a light transmissive ring element. The light transmissive ring element forms an exterior segment of the distal end portion. The light transmissive ring element defines at least a portion of a hermetic cavity.
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公开(公告)号：US10201335B2
公开(公告)日：2019-02-12
申请号：US15218855
申请日：2016-07-25
Applicant: Medtronic, Inc.
Inventor： Brad C. Tischendorf , John E. Kast , Thomas P. Miltich , Gordon O. Munns , Randy S. Roles , Craig L. Schmidt , Joseph J. Viavattine , Christian S. Nielsen , Prabhakar A. Tamirisa , Anthony M. Chasensky , Markus W. Reiterer , Chris J. Paidosh , Reginald D. Robinson , Bernard Q. Li , Erik R. Scott , Phillip C. Falkner , Xuan K. Wei , Eric H. Bonde
Abstract: An implantable medical device (IMD) has a housing enclosing an electronic circuit. The housing includes a first housing portion, a second housing portion and a joint coupling the first housing portion to the second housing portion. A polymer seal is positioned in the joint in various embodiments. Other embodiments of an IMD housing are disclosed.
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公开(公告)号：US20140163646A1
公开(公告)日：2014-06-12
申请号：US14099462
申请日：2013-12-06
Applicant: Medtronic, Inc.
Inventor： Brad C. Tischendorf , John E. Kast , Thomas P. Miltich , Gordon O. Munns , Randy S. Roles , Craig L. Schmidt , Joseph J. Viavattine , Christian S. Nielsen , Prabhakar A. Tamirisa , Anthony M. Chasensky , Markus W. Reiterer , Chris J. Paidosh , Reginald D. Robinson , Bernard Q. Li , Erik R. Scott , Phillip C. Falkner , Xuan K. Wei , Eric H. Bonde
CPC classification number: A61B17/00234 , A61N1/02 , A61N1/05 , A61N1/0551 , A61N1/36 , A61N1/36007 , A61N1/36021 , A61N1/3605 , A61N1/36053 , A61N1/36057 , A61N1/36067 , A61N1/36071 , A61N1/36139 , A61N1/37205 , A61N1/37211 , A61N1/37223 , A61N1/37235 , A61N1/37247 , A61N1/37252 , A61N1/3727 , A61N1/375 , A61N1/3754 , A61N1/3756 , A61N1/3787 , F04C2270/0421
Abstract: An implantable medical device (IMD) has a housing enclosing an electronic circuit. The housing includes a first housing portion, a second housing portion and a joint coupling the first housing portion to the second housing portion. A polymer enclosure member surrounds the joint and circumscribes the housing in various embodiments. Other embodiments of an IMD housing are disclosed.
Abstract translation: 可植入医疗装置（IMD）具有包围电子电路的外壳。 壳体包括第一壳体部分，第二壳体部分和将第一壳体部分联接到第二壳体部分的接合部。 在各种实施例中，聚合物外壳构件围绕接头并围绕外壳。 公开了IMD外壳的其它实施例。
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