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    MULTI-ELECTRODE IMPLANTABLE SYSTEMS AND ASSEMBLIES THEREFOR
    5.
    发明申请
    MULTI-ELECTRODE IMPLANTABLE SYSTEMS AND ASSEMBLIES THEREFOR 有权
    多电极可植入系统及其组合

    公开(公告)号：US20130325086A1

    公开(公告)日：2013-12-05

    申请号：US13962987

    申请日：2013-08-09

    Applicant: Medtronic, Inc.

    Inventor： John Louis Sommer ,  Joseph Michael D'Sa ,  Joyce K. Yamamoto ,  Brad C. Tischendorf ,  James D. Reinke ,  Andrew J. Thom ,  Thomas P. Miltich ,  William John Taylor ,  Kenneth C. Gardeski ,  Larry Earl Tyler ,  Jeffrey O. York ,  Gordon O. Munns

    IPC: A61N1/05 ,  A61N1/372

    CPC classification number: A61N1/362 ,  A61N1/05 ,  A61N1/056 ,  A61N1/372

    Abstract: Hermetically sealed assemblies, for example, that include IC chips, are configured for incorporation within a connector terminal of an implantable medical electrical lead, preferably within a contact member of the terminal. An assembly may include two feedthrough subassemblies, welded to either end of the contact member, to form an hermetic capsule, in which an IC chip is enclosed, and a tubular member, which allows a lumen to extend therethrough, along a length of the terminal. A multi-electrode lead may include multiplexer circuitry, preferably a switch matrix element and a communications, control and power supply element that are electrically coupled to the contact member and to another contact member of the terminal. Each pair of switch matrix switches allows for any two of the electrodes to be selected, in order to deliver a stimulation vector, via stimulation pulses from a device/pulse generator, to which the connector terminal is connected.

    Abstract translation: 例如，包括IC芯片的密封组件被配置为并入可植入医疗电线的连接器端子内，优选地在端子的接触构件内。 组件可以包括焊接到接触构件的任一端的两个馈通子组件，以形成封闭IC芯片的密封胶囊，以及允许内腔沿着端子的长度延伸穿过的管状构件 。 多电极引线可以包括多路复用器电路，优选地是开关矩阵元件和通信，控制和电源元件，其电耦合到接触构件和终端的另一接触构件。 每对开关矩阵开关允许选择任何两个电极，以便通过来自连接器端子连接到的装置/脉冲发生器的刺激脉冲传送刺激矢量。

    FEEDTHROUGH ASSEMBLY INCLUDING A CAPACITIVE FILTER ARRAY
    9.
    发明申请
    FEEDTHROUGH ASSEMBLY INCLUDING A CAPACITIVE FILTER ARRAY 审中-公开
    包括电容滤波器阵列在内的组装

    公开(公告)号：US20140360748A1

    公开(公告)日：2014-12-11

    申请号：US14465879

    申请日：2014-08-22

    Applicant: Medtronic, Inc.

    Inventor： Rajesh V. Iyer ,  Simon E. Goldman ,  Thomas P. Miltich

    IPC: A61N1/375 ,  A61N1/39

    CPC classification number: A61N1/3754 ,  A61N1/3968 ,  H03H7/0138 ,  H03H2001/0042 ,  H05K13/00 ,  Y10T29/43 ,  Y10T29/435 ,  Y10T29/49002 ,  Y10T29/49165 ,  Y10T29/49171 ,  Y10T29/49208

    Abstract: A feedthrough assembly may include a ferrule defining a ferrule opening, a feedthrough at least partially disposed within the ferrule opening, and a capacitive filter array at least partially disposed within the ferrule opening. The feedthrough may include at least one feedthrough conductive pathway and the capacitive filter array may include at least one filter array conductive pathway. In some examples, the feedthrough assembly includes a thick film conductive paste electrically connecting the at least one feedthrough conductive pathway and the at least one filter array conductive pathway. In some examples, the capacitive feedthrough array includes a perimeter conductive contact and a capacitive filter electrically coupling the at least one filter array conductive pathway and the perimeter conductive contact. In some of these examples, the feedthrough assembly includes a thick film conductive paste electrically connecting the perimeter conductive contact and the ferrule.

    Abstract translation: 馈通组件可以包括限定套圈开口的套圈，至少部分地设置在套圈开口内的馈通，以及至少部分地设置在套圈开口内的电容式过滤器阵列。 馈通可以包括至少一个馈通导电路径，并且电容滤波器阵列可以包括至少一个滤波器阵列导电路径。 在一些示例中，馈通组件包括电连接至少一个馈通导电路径和至少一个滤波器阵列导电路径的厚膜导电糊。 在一些示例中，电容馈通阵列包括周边导电触点和电耦合至少一个滤波器阵列导电路径和周边导电触点的电容滤波器。 在这些示例中的一些示例中，馈通组件包括电连接周边导电触点和套圈的厚膜导电膏。

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