公开(公告)号：US10939934B2

公开(公告)日：2021-03-09

申请号：US15718734

申请日：2017-09-28

Applicant: Microfabrica Inc.

Inventor： Michael S. Lockard ,  Uri Frodis ,  Adam L. Cohen ,  Richard T. Chen ,  Gregory P. Schmitz ,  Eric C. Miller ,  Ming Ting Wu ,  Arun S. Veeramani ,  Juan Diego Perea

IPC: A61B17/3205 ,  A61B17/14 ,  A61B17/32 ,  A61B17/16 ,  A61B17/3207 ,  A61B17/221 ,  A61B10/02 ,  B33Y80/00 ,  A61B90/00 ,  F16H55/18 ,  F16H55/06 ,  A61B17/00 ,  A61B17/29 ,  F16H55/56

Abstract: The present disclosure relates generally to the field of tissue removal and more particularly to methods and devices for use in medical applications involving selective tissue removal. One exemplary method includes the steps of providing a tissue cutting instrument capable of distinguishing between target tissue to be removed and non-target tissue, urging the instrument against the target tissue and the non-target tissue, and allowing the instrument to cut the target tissue while automatically avoiding cutting of non-target tissue. Various tools for carrying out this method are also described.

公开(公告)号：US12255123B2

公开(公告)日：2025-03-18

申请号：US17699049

申请日：2022-03-18

Applicant: Microfabrica Inc.

Inventor： Onnik Yaglioglu ,  Richard T. Chen ,  Will J. Tan ,  Jia Li ,  Uri Frodis ,  Nina C. Levy ,  Dennis R. Smalley

IPC: H01L23/473 ,  F28F3/12 ,  F28F13/06 ,  H01L21/48 ,  H05K7/20

Abstract: Embodiments of the present invention are directed to heat transfer arrays, cold plates including heat transfer arrays along with inlets and outlets, and thermal management systems including cold-plates, pumps and heat exchangers. These devices and systems may be used to provide cooling of semiconductor devices or other devices and particularly such devices that produce high heat concentrations. The heat transfer arrays may include microjets, multi-stage microjets, microchannels, fins, wells, wells with flow passages, well with stress relief or stress propagation inhibitors, and integrated microjets and fins.

公开(公告)号：US10806557B1

公开(公告)日：2020-10-20

申请号：US15647243

申请日：2017-07-11

Applicant: Microfabrica Inc.

Inventor： Richard T. Chen ,  Eric C. Miller

IPC: A61F2/00 ,  C12N5/00

Abstract: Embodiments of the present invention are directed to microscale and millimeter scale tissue scaffolding structures that may be static or expandable and which may be formed of biocompatible metals or other materials that may be coated to become biocompatible. Scaffold structures may include features for holding desired biological or physiological materials to enhance selected tissue growth. Scaffolding devices may be formed by multi-layer, multi-material electrochemical fabrication methods.

公开(公告)号：US10788512B2

公开(公告)日：2020-09-29

申请号：US16373500

申请日：2019-04-02

Applicant: Microfabrica Inc.

Inventor： Richard T. Chen ,  Ezekiel J. J. Kruglick ,  Christopher A. Bang ,  Dennis R. Smalley ,  Pavel B. Lembrikov

IPC: G01R1/067 ,  G01R31/00

Abstract: Embodiments disclosed herein are directed to compliant probe structures for making temporary or permanent contact with electronic circuits and the like. In particular, embodiments are directed to various designs of cantilever-like probe structures. Some embodiments are directed to methods for fabricating such probe or cantilever structures. In some embodiments, for example, cantilever probes have extended base structures, slide in mounting structures, multi-beam configurations, offset bonding locations to allow closer positioning of adjacent probes, compliant elements with tensional configurations, improved over travel, improved compliance, improved scrubbing capability, and/or the like.

公开(公告)号：US10665530B2

公开(公告)日：2020-05-26

申请号：US16373569

申请日：2019-04-02

Applicant: Microfabrica Inc.

Inventor： Richard T. Chen ,  Will J. Tan

IPC: H01L23/473 ,  F28F3/12 ,  F28F13/06 ,  H01L21/48 ,  H05K7/20

Abstract: Embodiments of the present invention are directed to heat transfer arrays, cold plates including heat transfer arrays along with inlets and outlets, and thermal management systems including cold-plates, pumps and heat exchangers. These devices and systems may be used to provide cooling of semiconductor devices and particularly such devices that produce high heat concentrations. The heat transfer arrays may include microjets, microchannels, fins, and even integrated microjets and fins.

公开(公告)号：US10416192B2

公开(公告)日：2019-09-17

申请号：US14927350

申请日：2015-10-29

Applicant: Microfabrica Inc.

Inventor： Richard T. Chen ,  Ezekiel J. J. Kruglick ,  Christopher A. Bang ,  Dennis R. Smalley ,  Pavel B. Lembrikov

IPC: G01R1/067 ,  G01R31/00

Abstract: Embodiments disclosed herein are directed to compliant probe structures for making temporary or permanent contact with electronic circuits and the like. In particular, embodiments are directed to various designs of cantilever-like probe structures. Some embodiments are directed to methods for fabricating such probe or cantilever structures. In some embodiments, for example, cantilever probes have extended base structures, slide in mounting structures, multi-beam configurations, offset bonding locations to allow closer positioning of adjacent probes, compliant elements with tensional configurations, improved over travel, improved compliance, improved scrubbing capability, and/or the like.

公开(公告)号：US20190227099A1

公开(公告)日：2019-07-25

申请号：US16373500

申请日：2019-04-02

Applicant: Microfabrica Inc.

Inventor： Richard T. Chen ,  Ezekiel J. J. Kruglick ,  Christopher A. Bang ,  Dennis R. Smalley ,  Pavel B. Lembrikov

IPC: G01R1/067

Abstract: Embodiments disclosed herein are directed to compliant probe structures for making temporary or permanent contact with electronic circuits and the like. In particular, embodiments are directed to various designs of cantilever-like probe structures. Some embodiments are directed to methods for fabricating such probe or cantilever structures. In some embodiments, for example, cantilever probes have extended base structures, slide in mounting structures, multi-beam configurations, offset bonding locations to allow closer positioning of adjacent probes, compliant elements with tensional configurations, improved over travel, improved compliance, improved scrubbing capability, and/or the like.

公开(公告)号：US20190204354A1

公开(公告)日：2019-07-04

申请号：US16172354

申请日：2018-10-26

Applicant: Microfabrica Inc.

Inventor： Richard T. Chen ,  Ezekiel J. J. Kruglick ,  Vacit Arat ,  Daniel I. Feinberg

IPC: G01R1/067

CPC classification number: G01R1/06727 ,  G01R1/06738

Abstract: Pin probes and pin probe arrays are provided that allow electric contact to be made with selected electronic circuit components. Some embodiments include one or more compliant pin elements located within a sheath. Some embodiments include pin probes that include locking or latching elements that may be used to fix pin portions of probes into sheaths. Some embodiments provide for fabrication of probes using multi-layer electrochemical fabrication methods.

公开(公告)号：US09933578B1

公开(公告)日：2018-04-03

申请号：US15180017

申请日：2016-06-11

Applicant: Microfabrica Inc.

Inventor： Richard T. Chen

IPC: G02B6/00 ,  G02B6/36

CPC classification number: G02B6/3652 ,  G02B6/3644 ,  G02B6/3684

Abstract: Embodiments of the present invention are directed to fiber optic element devices, methods for aligning fiber optic elements, and batch formation methods for creating such fiber optic alignment devices.

公开(公告)号：US09878401B1

公开(公告)日：2018-01-30

申请号：US14720719

申请日：2015-05-22

Applicant: Microfabrica Inc.

Inventor： Arun S. Veeramani ,  Heath A. Jensen ,  Uri Frodis ,  Christopher G. Wiita ,  Michael S. Lockard ,  Irina Boguslavsky ,  Pavel Lembrikov ,  Dennis R. Smalley ,  Richard T. Chen

IPC: B23K26/362 ,  B23K26/364 ,  B23K26/38 ,  C25D5/02 ,  B23K26/382

CPC classification number: B23K26/38 ,  B23K26/382 ,  C25D5/48 ,  C25D7/00 ,  G01R1/00

Abstract: Embodiments are directed to the formation micro-scale or millimeter scale structures or methods of making such structures wherein the structures are formed from at least one sheet structural material and may include additional sheet structural materials or deposited structural materials wherein all or a portion of the patterning of the structural materials occurs via laser cutting. In some embodiments, selective deposition is used to provide a portion of the patterning. In some embodiments the structural material or structural materials are bounded from below by a sacrificial bridging material (e.g. a metal) and possibly from above by a sacrificial capping material (e.g. a metal).