摘要:
A method for manufacturing a semiconductor device is provided. The method includes successively forming a first silicon film and a mask film above a semiconductor substrate through a gate insulating film, forming a plurality of trenches in the first silicon film and in the mask film to a depth to reach the semiconductor substrate, filling the plurality of trenches with the silicon oxide film, removing the mask film to expose the first silicon film existing between the silicon oxide films, selectively growing a second silicon film on the first silicon film, planarizing the second silicon film using an alkaline slurry exhibiting a pH of 13 or less and containing abrasive grains and a cationic surfactant, thereby obtaining a floating gate electrode film comprising the first and second silicon films, forming an interelectrode insulating film on the entire surface, and forming a control gate electrode film on the interelectrode insulating film.
摘要:
A method for manufacturing a semiconductor device comprises forming a first silicon layer above a semiconductor substrate; forming a stopper layer on said first silicon layer; partially removing said stopper layer and said first silicon layer above said semiconductor substrate to form a plurality of trenches; forming an insulating layer on said stopper layer with inside of said trenches; partially removing said insulating layer to expose said stopper layer; after partially removing said insulating layer, removing said stopper layer to expose said first silicon layer; selectively growing second silicon layer on said exposed first silicon layer; nonselectively growing a third silicon layer on said second silicon layer; and polishing at least a surface of said third silicon layer by performing chemical mechanical polishing.
摘要:
In an ink jet recording method using an ink jet recording head of an on-demand type, ink droplets are discharged at an interval which is 1/N (N is a natural number of 2 or more) of the pitch of the recording units. One recording unit is formed of a number of ink droplets equal to N.sup.2.
摘要:
A method of fabricating a semiconductor device according to one embodiment includes: forming a plurality of Si-based pattern portions above a semiconductor substrate, the plurality of Si-based pattern portions being adjacent in a direction substantially parallel to a surface of the semiconductor substrate via insulating films; forming a metal film above the plurality of Si-based pattern portions and the insulating films so as to contact with the plurality of Si-based pattern portions; processing whole areas or upper portions of the plurality of Si-based pattern portions into a plurality of silicide layers by a silicidation reaction between the plurality of Si-based pattern portions and the metal film by heat treatment; and removing the plurality of silicide layers formed above the insulating films by applying planarizing treatment to the plurality of silicide layers.
摘要:
A chemical mechanical polishing aqueous dispersion is used to polish a polishing target that includes an interconnect layer that contains tungsten. The chemical mechanical polishing aqueous dispersion includes: (A) a cationic water-soluble polymer; (B) an iron (III) compound; and (C) colloidal silica particles. The content (MA) (mass %) of the cationic water-soluble polymer (A) and the content (MB) (mass %) of the iron (III) compound (B) satisfy the relationship “MA/MB=0.004 to 0.1”. The chemical mechanical polishing aqueous dispersion has a pH of 1 to 3.
摘要:
A chemical mechanical polishing method comprises polishing an organic film using a slurry including polymer particles having a surface functional group and a water-soluble polymer.
摘要:
A recording head includes a liquid ejecting outlet, a liquid passage communicating with the ejection outlet, and a heat generating resistor for supplying heat to the liquid in a heat acting portion in the liquid to create a bubble in the liquid passage to eject the liquid through the ejection outlet. A cross-sectional area of the liquid passage increases from the heat acting zone toward the ejection outlet, and this improves performance while also improving head durability.
摘要:
A recovery process for an ink jet recording head of a recording apparatus and a device for performing the recovery process are disclosed. The ink jet recording apparatus includes a recording head with a plurality of discharge ports and a liquid chamber common to the discharge ports. The liquid chamber is supplied with ink through an ink supply path from an ink tank. The recovery device includes a device for introducing air into the liquid chamber of the recording head, a cap unit for covering the discharge ports of the recording head, and a pumping device for applying suction to the cap unit to suck the introduced air and ink through the discharge ports.
摘要:
A liquid jet recording head having orifices for discharging liquid droplets therefrom, a liquid chamber for retaining liquid therein, and liquid flow paths connecting the orifices to the liquid chamber. The cross-sectional area of the flow paths gradually decreases from the liquid chamber toward the orifices. Also provided are an energy generating portion in the liquid flow paths and generating energy to be impared to the liquid, and small walls provided upstream of the energy generating portion, whereby the flow of the liquid from the liquid chamber to the energy generating portion is suppressed.