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公开(公告)号：US12176241B2
公开(公告)日：2024-12-24
申请号：US17183862
申请日：2021-02-24
Inventor： Manuel Sohn , Rolf Bremensdorfer , Silke Hamm , Alex Wansidler
IPC: H01L21/687 , C23C14/30 , C23C14/50 , H01L21/67
Abstract: Support plates and support structures for thermal processing systems to heat workpieces are provided. In one example, a thermal processing apparatus is provided that includes a plurality of heat sources, a rotatable support plate, and a support structure having a flexibility in the radial direction of the rotatable support plate that is greater than a flexibility in the azimuthal direction of the rotatable support plate. Also provided are support plates for supporting a workpiece in a thermal processing apparatus. The support plate can include a base defining a radial direction and an azimuthal direction and at least one support structure extending from the base having a flexibility in the radial direction of the base that is greater than a flexibility in the azimuthal direction of the base.
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公开(公告)号：US12120780B2
公开(公告)日：2024-10-15
申请号：US17215369
申请日：2021-03-29
Inventor： Rolf Bremensdorfer , Dave Camm , Pete Lembesis , Joseph Cibere
IPC: H05B3/00 , H01J61/073 , H01J61/52 , H01L21/67 , H05B31/00
CPC classification number: H05B3/0047 , H01J61/0732 , H01J61/526 , H01L21/67109 , H01L21/67115 , H01L21/6719 , H01L21/67248 , H05B31/0057
Abstract: Systems and methods for reducing contamination of one or more arc lamps are provided. One example implementation is directed to a millisecond anneal system. The millisecond anneal system includes a processing chamber for thermally treating a substrate using a millisecond anneal process. The system further includes one or more arc lamps. Each of the one or more arc lamps is coupled to a water loop for circulating water through the arc lamp during operation of the arc lamp. The system includes a reagent injection source configured to introduce a reagent, such as nitrogen gas, into water circulating through the arc lamp during operation of the arc lamp.
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23.发明公开公开(公告)号：US20240290664A1
公开(公告)日：2024-08-29
申请号：US18597421
申请日：2024-03-06
Inventor： Michael Storek , Rolf Bremensdorfer , Markus Lieberer , Michael Yang
CPC classification number: H01L22/12 , G01J5/042 , H01L21/67115 , H01L22/34
Abstract: A thermal processing system for performing thermal processing can include a workpiece support plate configured to support a workpiece and heat source(s) configured to heat the workpiece. The thermal processing system can include window(s) having transparent region(s) that are transparent to electromagnetic radiation within a measurement wavelength range and opaque region(s) that are opaque to electromagnetic radiation within a portion of the measurement wavelength range. A temperature measurement system can include a plurality of infrared emitters configured to emit infrared radiation and a plurality of infrared sensors configured to measure infrared radiation within the measurement wavelength range where the transparent region(s) are at least partially within a field of view the infrared sensors. A controller can be configured to perform operations including obtaining transmittance and reflectance measurements associated with the workpiece and determining, based on the measurements, a temperature of the workpiece less than about 600° C.
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公开(公告)号：US12068177B2
公开(公告)日：2024-08-20
申请号：US17405150
申请日：2021-08-18
Inventor： Manuel Sohn , Rolf Bremensdorfer , Silke Hamm , Dieter Hezler
IPC: H01L21/67
CPC classification number: H01L21/67109 , H01L21/67207 , H01L21/67248
Abstract: Apparatus, systems, and methods for processing workpieces are provided. In one example, such a method for performing a spike anneal rapid thermal process may include controlling a heat source to begin heating a workpiece supported on a workpiece support in a processing chamber. The method may further include receiving data indicative of a temperature of the workpiece. Furthermore, the method may include monitoring the temperature of the workpiece relative to a temperature setpoint. Moreover, the method may include controlling the heat source to stop heating the workpiece based at least in part on the workpiece reaching the temperature setpoint. Additionally, the method may include controlling a cooling system to begin flowing a cooling gas at a rate of about 300 slm or greater over the workpiece based at least in part on the workpiece reaching the temperature setpoint to reduce a t50 peak width of the workpiece.
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25.发明授权公开(公告)号：US11955388B2
公开(公告)日：2024-04-09
申请号：US18185970
申请日：2023-03-17
Inventor： Michael Storek , Rolf Bremensdorfer , Markus Lieberer , Michael Yang
CPC classification number: H01L22/12 , G01J5/042 , H01L21/67115 , H01L22/34
Abstract: A thermal processing system for performing thermal processing can include a workpiece support plate configured to support a workpiece and heat source(s) configured to heat the workpiece. The thermal processing system can include window(s) having transparent region(s) that are transparent to electromagnetic radiation within a measurement wavelength range and opaque region(s) that are opaque to electromagnetic radiation within a portion of the measurement wavelength range. A temperature measurement system can include a plurality of infrared emitters configured to emit infrared radiation and a plurality of infrared sensors configured to measure infrared radiation within the measurement wavelength range where the transparent region(s) are at least partially within a field of view the infrared sensors. A controller can be configured to perform operations including obtaining transmittance and reflectance measurements associated with the workpiece and determining, based on the measurements, a temperature of the workpiece less than about 600° C.
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Patent Agency Ranking
公开(公告)号：US20220195601A1
公开(公告)日：2022-06-23
申请号：US17549102
申请日：2021-12-13
Inventor： Michael Yang , Yun Yang , Manuel Sohn , Silke Hamm , Alex Wansidler , DIeter Hezler , Rolf Bremensdorfer
IPC: C23C16/455 , C23C16/48 , C23C16/458
Abstract: A processing apparatus for a thermal treatment of a workpiece is presented. The processing apparatus includes a processing chamber, a workpiece support disposed within the processing chamber, a gas delivery system, and radiative heat sources for heating the workpiece. The gas delivery system includes a gas showerhead assembly that is transparent to electromagnetic radiation emitted from the one or more radiative heat sources. The gas showerhead assembly includes one or more gas diffusion mechanisms to distribute gas within the enclosure.
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公开(公告)号：US11193178B2
公开(公告)日：2021-12-07
申请号：US16059148
申请日：2018-08-09
Inventor： Rolf Bremensdorfer , Johannes Keppler , Michael Yang
Abstract: Systems and methods for heat treating closed shape workpieces are provided. In one example implementation, a method can include imparting relative motion of the closed shape workpiece such that the perimeter surface of the closed shape workpiece is moved relative to the lamp heat source from a first position where a first portion of the closed shape workpiece is presented to the lamp heat source to a second position where a second portion of the closed shape workpiece is presented to the lamp heat source. The method can include emitting lamp heat onto the perimeter surface of the closed shape workpiece from the lamp heat source during imparting of relative motion of the closed shape workpiece. The method can include implementing a flux control procedure during emitting of lamp heat onto the perimeter surface of the closed shape workpiece.
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公开(公告)号：US20210307115A1
公开(公告)日：2021-09-30
申请号：US17215369
申请日：2021-03-29
Inventor： Rolf Bremensdorfer , Dave Camm , Pete Lembesis , Joseph Cibere
IPC: H05B3/00 , H01L21/67 , H01J61/52 , H01J61/073
Abstract: Systems and methods for reducing contamination of one or more arc lamps are provided. One example implementation is directed to a millisecond anneal system. The millisecond anneal system includes a processing chamber for thermally treating a substrate using a millisecond anneal process. The system further includes one or more arc lamps. Each of the one or more arc lamps is coupled to a water loop for circulating water through the arc lamp during operation of the arc lamp. The system includes a reagent injection source configured to introduce a reagent, such as nitrogen gas, into water circulating through the arc lamp during operation of the arc lamp.
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29.发明申请公开(公告)号：US20210272858A1
公开(公告)日：2021-09-02
申请号：US17183992
申请日：2021-02-24
Inventor： Michael Storek , Rolf Bremensdorfer , Markus Lieberer , Michael Yang
Abstract: A thermal processing system for performing thermal processing can include a workpiece support plate configured to support a workpiece and heat source(s) configured to heat the workpiece. The thermal processing system can include window(s) having transparent region(s) that are transparent to electromagnetic radiation within a measurement wavelength range and opaque region(s) that are opaque to electromagnetic radiation within a portion of the measurement wavelength range. A temperature measurement system can include a plurality of infrared emitters configured to emit infrared radiation and a plurality of infrared sensors configured to measure infrared radiation within the measurement wavelength range where the transparent region(s) are at least partially within a field of view the infrared sensors. A controller can be configured to perform operations including obtaining transmittance and reflectance measurements associated with the workpiece and determining, based on the measurements, a temperature of the workpiece less than about 600° C.
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30.发明申请公开(公告)号：US20200064198A1
公开(公告)日：2020-02-27
申请号：US16508429
申请日：2019-07-11
Applicant: Mattson Technology, Inc.
Inventor： Rolf Bremensdorfer , Markus Lieberer , Paul J. Timans , Michael X. Yang
IPC: G01J5/00 , G01J5/06 , B23K26/03 , H01L21/324
Abstract: Systems and methods for thermal processing of a workpiece at low temperatures are disclosed. In one example implementation, a thermal processing apparatus includes a processing chamber having a workpiece support. The workpiece support can be configured to support a workpiece. The apparatus can include one or more heat sources configured to emit electromagnetic radiation in a first wavelength range to heat the workpiece to a processing temperature. The processing temperature can be in the range of about 50° C. to 150° C. The apparatus can include one or more sensors configured to obtain a measurement of electromagnetic radiation in a second wavelength range when the workpiece is at the processing temperature. The second wavelength range can be different from the first wavelength range.
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