公开(公告)号：US20210118852A1

公开(公告)日：2021-04-22

申请号：US16939756

申请日：2020-07-27

Applicant: Micron Technology, Inc.

Inventor： Owen R. Fay ,  Randon K. Richards ,  Aparna U. Limaye ,  Dong Soon Lim ,  Chan H. Yoo ,  Bret K. Street ,  Eiichi Nakano ,  Shijian Luo

IPC: H01L25/065 ,  H01L25/18 ,  H01L23/00 ,  H01L23/552 ,  H01L23/66 ,  H01L21/78 ,  H01L21/66 ,  H01L25/00 ,  H01Q1/48 ,  H01Q1/22

Abstract: Disclosed is a microelectronic device assembly comprising a substrate having conductors exposed on a surface thereof. Two or more microelectronic devices are stacked on the substrate, each microelectronic device comprising an active surface having bond pads operably coupled to conductive traces extending over a dielectric material to via locations beyond at least one side of the stack, and vias extending through the dielectric materials at the via locations and comprising conductive material in contact with at least some of the conductive traces of each of the two or more electronic devices and extending to exposed conductors of the substrate. Methods of fabrication and related electronic systems are also disclosed.

公开(公告)号：US20210118850A1

公开(公告)日：2021-04-22

申请号：US16939678

申请日：2020-07-27

Applicant: Micron Technology, Inc.

Inventor： Randon K. Richards ,  Aparna U. Limaye ,  Owen R. Fay ,  Dong Soon Lim

IPC: H01L25/065 ,  H01L25/18 ,  H01L23/00 ,  H01L23/552 ,  H01L23/64 ,  H01L21/78 ,  H01L21/66 ,  H01L25/00

Abstract: Disclosed is a microelectronic device assembly comprising a substrate having conductors exposed on a surface thereof. Two or more microelectronic devices are stacked on the substrate and the components are connected with conductive material in preformed holes in dielectric material in the bond lines aligned with TSVs of the devices and the exposed conductors of the substrate. Methods of fabrication are also disclosed.

公开(公告)号：US20210035917A1

公开(公告)日：2021-02-04

申请号：US16524989

申请日：2019-07-29

Applicant: Micron Technology, Inc.

Inventor： Owen R. Fay ,  Dong Soon Lim ,  Randon K. Richards ,  Aparna U. Limaye

IPC: H01L23/552 ,  H01L23/66 ,  H01Q1/22 ,  H01L23/31 ,  H01L21/56

Abstract: Semiconductor devices with antennas and electromagnetic interference (EMI) shielding, and associated systems and methods, are described herein. In one embodiment, a semiconductor device includes a semiconductor die coupled to a package substrate. An antenna structure is disposed over and/or adjacent the semiconductor die. An electromagnetic interference (EMI) shield is disposed between the semiconductor die and the antenna structure to shield at least the semiconductor die from electromagnetic radiation generated by the antenna structure and/or to shield the antenna structure from interference generated by the semiconductor die. A first dielectric material and/or a thermal interface material can be positioned between the semiconductor die and the EMI shield, and a second dielectric material can be positioned between the EMI shield and the antenna structure. In some embodiments, the semiconductor device includes a package molding over at least a portion of the antenna, the EMI shield, and/or the second dielectric material.

公开(公告)号：US20200075548A1

公开(公告)日：2020-03-05

申请号：US16120991

申请日：2018-09-04

Applicant: Micron Technology, Inc.

Inventor： Kang-Yong Kim ,  Chan Yoo ,  Dong Soon Lim ,  Jaekyu Song

IPC: H01L25/065 ,  H01L23/00 ,  H01L23/498

Abstract: Systems, devices, and methods for interconnects for a multi-die package are described. A multi-die package may include a set of conductive pillars and two or more semiconductor dice that each include a bond pad. In some cases, the multi-die package may include a plurality of pillar-wire combinations, and a bond wire may couple a corresponding conductive pillar with a corresponding bond pad. Pillar-wire combinations may each collectively have a matched impedance, or pillar-wire combinations in different groups may have different collective impedances. In other cases, a conductive pillar may be directly coupled with a corresponding bond pad without a bond wire. Different pillar-wire combinations or directly-coupled pillars may carry different signals. In some cases, pillars may be individually impedance-matched to a desired impedance.