公开(公告)号：US11908828B2

公开(公告)日：2024-02-20

申请号：US17845635

申请日：2022-06-21

Applicant: Micron Technology, Inc.

Inventor： Brandon P. Wirz ,  Jaekyu Song ,  Sui Chi Huang

IPC: H01L21/67 ,  H01L21/50 ,  H01L21/60 ,  H01L23/00

CPC classification number: H01L24/80 ,  H01L21/50 ,  H01L21/67098 ,  H01L2021/60195 ,  H01L2224/75251 ,  H01L2224/81203 ,  H01L2224/94

Abstract: Systems and methods for controlling contamination during thermocompression bonding are provided herein. The tool generally includes a bondhead having a first channel extending in a lateral direction from a first port along a second side toward a perimeter of the bondhead. In several examples, the bondhead includes a second channel fluidly coupled to a second port and extending in a lateral direction along an inset surface of the bondhead, where the second channel at least partially surrounds the first channel. In other examples, the tool includes a vacuum manifold having a vacuum opening positioned laterally outward from the bondhead. A first flow unit is coupled to the first channel and is configured to withdraw air. A second flow unit is coupled to the second port or the manifold to withdraw fluid and prevent outgassing bonding materials from entering the first channel, depositing on the bondhead, and/or contaminating neighboring semiconductor components.

公开(公告)号：US20240063068A1

公开(公告)日：2024-02-22

申请号：US17892036

申请日：2022-08-19

Applicant: Micron Technology, Inc.

Inventor： Kunal R. Parekh ,  Bret K. Street ,  Terrence B. McDaniel ,  Jaekyu Song

IPC: H01L23/13 ,  H01L25/065 ,  H01L25/00 ,  H01L23/498 ,  H01L23/538

CPC classification number: H01L23/13 ,  H01L25/0652 ,  H01L25/50 ,  H01L23/49816 ,  H01L23/49833 ,  H01L23/5382 ,  H01L23/5385 ,  H01L23/5386 ,  H01L24/73

Abstract: A semiconductor device assembly comprises a package substrate including (i) an upper surface having a plurality of internal contacts, (ii) a lower surface having a plurality of external contacts coupled to the plurality of internal contacts, and (iii) a cavity extending into the package substrate. The assembly further comprises a stack of first semiconductor devices disposed in the cavity, an uppermost first semiconductor device of the stack having a plurality of stack contacts, and an interposer including (i) a bottom surface having a first plurality of lower contacts coupled to the plurality of stack contacts and a second plurality of lower contacts coupled to the plurality of internal contacts, and (ii) a top surface having a plurality of upper contacts coupled to the first and second pluralities of lower contacts. The assembly further comprises a second semiconductor device including a plurality of die contacts coupled to the plurality of upper contacts.

公开(公告)号：US20220320037A1

公开(公告)日：2022-10-06

申请号：US17845635

申请日：2022-06-21

Applicant: Micron Technology, Inc.

Inventor： Brandon P. Wirz ,  Jaekyu Song ,  Sui Chi Huang

IPC: H01L23/00 ,  H01L21/67 ,  H01L21/50

Abstract: Systems and methods for controlling contamination during thermocompression bonding are provided herein. The tool generally includes a bondhead having a first channel extending in a lateral direction from a first port along a second side toward a perimeter of the bondhead. In several examples, the bondhead includes a second channel fluidly coupled to a second port and extending in a lateral direction along an inset surface of the bondhead, where the second channel at least partially surrounds the first channel. In other examples, the tool includes a vacuum manifold having a vacuum opening positioned laterally outward from the bondhead. A first flow unit is coupled to the first channel and is configured to withdraw air. A second flow unit is coupled to the second port or the manifold to withdraw fluid and prevent outgassing bonding materials from entering the first channel, depositing on the bondhead, and/or contaminating neighboring semiconductor components.

公开(公告)号：US20200075548A1

公开(公告)日：2020-03-05

申请号：US16120991

申请日：2018-09-04

Applicant: Micron Technology, Inc.

Inventor： Kang-Yong Kim ,  Chan Yoo ,  Dong Soon Lim ,  Jaekyu Song

IPC: H01L25/065 ,  H01L23/00 ,  H01L23/498

Abstract: Systems, devices, and methods for interconnects for a multi-die package are described. A multi-die package may include a set of conductive pillars and two or more semiconductor dice that each include a bond pad. In some cases, the multi-die package may include a plurality of pillar-wire combinations, and a bond wire may couple a corresponding conductive pillar with a corresponding bond pad. Pillar-wire combinations may each collectively have a matched impedance, or pillar-wire combinations in different groups may have different collective impedances. In other cases, a conductive pillar may be directly coupled with a corresponding bond pad without a bond wire. Different pillar-wire combinations or directly-coupled pillars may carry different signals. In some cases, pillars may be individually impedance-matched to a desired impedance.

公开(公告)号：US20240079369A1

公开(公告)日：2024-03-07

申请号：US17938917

申请日：2022-09-06

Applicant: Micron Technology, Inc.

Inventor： Terrence B. McDaniel ,  Bret K. Street ,  Wei Zhou ,  Kyle K. Kirby ,  Amy R. Griffin ,  Thiagarajan Raman ,  Jaekyu Song

IPC: H01L23/00 ,  H01L25/00

CPC classification number: H01L24/48 ,  H01L24/16 ,  H01L24/32 ,  H01L24/49 ,  H01L24/73 ,  H01L24/97 ,  H01L25/50 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/48011 ,  H01L2224/4809 ,  H01L2224/48145 ,  H01L2224/4903 ,  H01L2224/49052 ,  H01L2224/73204 ,  H01L2924/1431 ,  H01L2924/1436 ,  H01L2924/1438

Abstract: This document discloses techniques, apparatuses, and systems for connecting semiconductor dies through traces. A semiconductor assembly is described that includes two semiconductor dies. The first semiconductor die includes a first dielectric layer at which first circuitry is disposed. The second semiconductor die includes a second dielectric layer at which second circuitry is disposed. One or more traces extend from a side surface of the first dielectric layer and at a side surface of the second dielectric layer to electrically couple the first circuitry and the second circuitry. In doing so, rigid connective structures may not be needed to couple the first semiconductor die and the second semiconductor die.

公开(公告)号：US11410964B2

公开(公告)日：2022-08-09

申请号：US16693192

申请日：2019-11-22

Applicant: Micron Technology, Inc.

Inventor： Brandon P. Wirz ,  Jaekyu Song ,  Sui Chi Huang

IPC: H01L21/67 ,  H01L21/50 ,  H01L23/00 ,  H01L21/60

Abstract: Systems and methods for controlling contamination during thermocompression bonding are provided herein. The tool generally includes a bondhead having a first channel extending in a lateral direction from a first port along a second side toward a perimeter of the bondhead. In several examples, the bondhead includes a second channel fluidly coupled to a second port and extending in a lateral direction along an inset surface of the bondhead, where the second channel at least partially surrounds the first channel. In other examples, the tool includes a vacuum manifold having a vacuum opening positioned laterally outward from the bondhead. A first flow unit is coupled to the first channel and is configured to withdraw air. A second flow unit is coupled to the second port or the manifold to withdraw fluid and prevent outgas sing bonding materials from entering the first channel, depositing on the bondhead, and/or contaminating neighboring semiconductor components.

公开(公告)号：US20210159206A1

公开(公告)日：2021-05-27

申请号：US16693192

申请日：2019-11-22

Applicant: Micron Technology, Inc.

Inventor： Brandon P. Wirz ,  Jaekyu Song ,  Sui Chi Huang

IPC: H01L23/00 ,  H01L21/67 ,  H01L21/50

Abstract: Systems and methods for controlling contamination during thermocompression bonding are provided herein. The tool generally includes a bondhead having a first channel extending in a lateral direction from a first port along a second side toward a perimeter of the bondhead. In several examples, the bondhead includes a second channel fluidly coupled to a second port and extending in a lateral direction along an inset surface of the bondhead, where the second channel at least partially surrounds the first channel. In other examples, the tool includes a vacuum manifold having a vacuum opening positioned laterally outward from the bondhead. A first flow unit is coupled to the first channel and is configured to withdraw air. A second flow unit is coupled to the second port or the manifold to withdraw fluid and prevent outgas sing bonding materials from entering the first channel, depositing on the bondhead, and/or contaminating neighboring semiconductor components.