公开(公告)号：US06465276B2

公开(公告)日：2002-10-15

申请号：US09879367

申请日：2001-06-12

申请人： Frank Kuo

发明人： Frank Kuo

IPC分类号： H01L2144

CPC分类号： H01L24/40 ,  H01L23/051 ,  H01L23/49562 ,  H01L24/41 ,  H01L24/45 ,  H01L24/48 ,  H01L2224/0603 ,  H01L2224/32245 ,  H01L2224/40095 ,  H01L2224/40245 ,  H01L2224/4103 ,  H01L2224/45144 ,  H01L2224/48247 ,  H01L2224/73221 ,  H01L2224/8385 ,  H01L2224/84385 ,  H01L2224/8485 ,  H01L2924/00014 ,  H01L2924/01023 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/12042 ,  H01L2924/13091 ,  H01L2924/00015 ,  H01L2924/00 ,  H01L2224/37099

摘要： A power semiconductor die has a drain contact, a source contact, and a gate contact. A lead frame has first, second, and third terminals. A metal sheet has first and second contacting portions and a bridging portion interconnecting the first and second contacting portions. The power semiconductor die is mounted on the lead frame such that the drain contact is connected to the first terminal. The metal sheet is attached to the top surface of the power semiconductor die and the second and third terminals of the lead frame such that the source contact and the second terminal are connected to the first contacting portion, and such that the gate contact and the third terminal are connected to the second contacting portion. The bridging portion is subsequently cut for disconnecting electrically the first and second contacting portions.

摘要翻译： 功率半导体管芯具有漏极接触，源极接触和栅极接触。 引线框架具有第一，第二和第三端子。 金属片具有第一和第二接触部分和互连第一和第二接触部分的桥接部分。 功率半导体管芯安装在引线框架上，使得漏极触点连接到第一端子。 金属片附接到功率半导体管芯的顶表面和引线框架的第二和第三端子，使得源极触点和第二端子连接到第一接触部分，并且使得栅极接触和第三 端子连接到第二接触部分。 随后切割桥接部分以电连接第一和第二接触部分。

公开(公告)号：US09126647B2

公开(公告)日：2015-09-08

申请号：US13753594

申请日：2013-01-30

申请人： Frank Kuo

发明人： Frank Kuo

IPC分类号： B62J1/08 ,  F16F9/00

CPC分类号： B62J1/08 ,  B62J2001/085 ,  F16F9/00 ,  F16F9/064 ,  F16F9/22 ,  F16F9/3221 ,  F16F9/466

摘要： The present invention relates to a bicycle seat post structure, and more particularly, to a structure provided with a hydraulic actuator within which is configured with an upper oil compartment, an intermediate oil compartment, and a lower oil compartment; the three oil compartments intercommunicate. It is characterized in that the bicycle seat post structure provides an upper valve moving simultaneously with the pin and configured between the upper oil compartment and the intermediate oil compartment; the upper valve will be closed to disconnect the upper oil compartment from the intermediate oil compartment when the pin is in a state of locking. Thus, the valve will stop moving up because it is positioned above the upper and the intermediate oil compartments and consequently controlled by the oil within the compartments, so as to stop the seat sliding upward and further to be combined with the bicycle frame as a whole.

摘要翻译： 本发明涉及一种自行车座椅支柱结构，更具体地说，涉及一种具有液压致动器的结构，其中配置有上油室，中间油室和下油室; 三个油室相互沟通。 其特征在于，自行车座柱结构提供与销同时移动的上阀，并且构造在上油室和中间油室之间; 当销处于锁定状态时，上阀将关闭以将上油室与中间油室隔开。 因此，阀门将停止向上移动，因为它位于上部和中间油室之上，因此由隔室内的油控制，以便阻止座椅向上滑动并进一步与自行车车架整体结合 。

公开(公告)号：US07501086B2

公开(公告)日：2009-03-10

申请号：US10789799

申请日：2004-02-27

申请人： Frank Kuo

发明人： Frank Kuo

IPC分类号： B29C45/14 ,  B29C70/68

CPC分类号： H01L21/565 ,  H01L23/3107 ,  H01L2924/0002 ,  H01L2924/00

摘要： An encapsulation technique for leadless semiconductor packages entails: (a) attaching a plurality of dice (411) to die pads in cavities (41-45, 51-55) of a leadframe, the cavities arranged in a matrix of columns and rows; (b) electrically connecting the dice to a plurality of conducting portions (412-414) of the leadframe; and (c) longitudinally injecting molding material into the cavities along the columns via a plurality of longitudinal gates (46-49, 56-59) of the leadframe to package the dice in the cavities, the longitudinal gates situated between the cavities along the columns.

摘要翻译： 用于无引线半导体封装的封装技术包括：（a）将多个管芯（411）附接到引线框架的空腔（41-45,51-55）中的管芯焊盘，所述空腔布置成列和列的矩阵; （b）将所述裸片电连接到所述引线框的多个导电部分（412-414）; 以及（c）通过所述引线框架的多个纵向门（46-49,56-59）沿着所述列将模制材料纵向注射到所述空腔中，以将所述模具封装在所述空腔中，所述纵向浇口位于所述空腔之间， 。

公开(公告)号：US09595503B2

公开(公告)日：2017-03-14

申请号：US14474420

申请日：2014-09-02

申请人： Frank Kuo ,  Suresh Belani

发明人： Frank Kuo ,  Suresh Belani

IPC分类号： H01L23/00 ,  H01L23/495 ,  H01L21/48 ,  H01L21/56 ,  H01L21/78

CPC分类号： H01L24/90 ,  H01L21/4825 ,  H01L21/56 ,  H01L21/78 ,  H01L23/4952 ,  H01L23/49524 ,  H01L23/49562 ,  H01L23/49575 ,  H01L24/32 ,  H01L24/33 ,  H01L24/34 ,  H01L24/36 ,  H01L24/38 ,  H01L24/40 ,  H01L24/41 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/83 ,  H01L24/84 ,  H01L24/97 ,  H01L2224/32245 ,  H01L2224/40095 ,  H01L2224/40245 ,  H01L2224/40247 ,  H01L2224/4103 ,  H01L2224/45144 ,  H01L2224/48247 ,  H01L2224/49111 ,  H01L2224/83 ,  H01L2224/83801 ,  H01L2224/84801 ,  H01L2224/97 ,  H01L2924/00012 ,  H01L2924/00014 ,  H01L2924/00015 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/1306 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2224/84 ,  H01L2924/00 ,  H01L2224/37099

摘要： A semiconductor package and a method for making the same are provided. In the method, a clip is used to conduct a lead frame and at least one chip. The clip has at least one second connection segment, at least one third connection segment, and at least one intermediate connection segment. The second connection segment is electrically connected to a second conduction region of the chip and a second pin of the lead frame respectively, and the third connection segment is electrically connected to a third conduction region of the chip and a third pin of the lead frame respectively. The intermediate connection segment connects the at least one second connection segment and the at least one third connection segment, and is removed in a subsequent process. Thereby, the present invention does not need to use any gold wire, which effectively saves the material cost and the processing time.

摘要翻译： 提供半导体封装及其制造方法。 在该方法中，使用夹子来引导引线框架和至少一个芯片。 夹具具有至少一个第二连接段，至少一个第三连接段和至少一个中间连接段。 第二连接段分别电连接到芯片的第二导电区域和引线框架的第二引脚，并且第三连接段分别电连接到芯片的第三导电区域和引线框架的第三引脚 。 中间连接段连接至少一个第二连接段和至少一个第三连接段，并在随后的过程中被移除。 因此，本发明不需要使用任何金线，其有效地节省了材料成本和处理时间。

公开(公告)号：US20140208933A1

公开(公告)日：2014-07-31

申请号：US13753594

申请日：2013-01-30

申请人： Frank Kuo

发明人： Frank Kuo

IPC分类号： B62J1/08

CPC分类号： B62J1/08 ,  B62J2001/085 ,  F16F9/00 ,  F16F9/064 ,  F16F9/22 ,  F16F9/3221 ,  F16F9/466

摘要： The present invention relates to a bicycle seat post structure, and more particularly, to a structure provided with a hydraulic actuator within which is configured with an upper oil compartment, an intermediate oil compartment, and a lower oil compartment; the three oil compartments intercommunicate. It is characterized in that the bicycle seat post structure provides an upper valve moving simultaneously with the pin and configured between the upper oil compartment and the intermediate oil compartment; the upper valve will be closed to disconnect the upper oil compartment from the intermediate oil compartment when the pin is in a state of locking. Thus, the valve will stop moving up because it is positioned above the upper and the intermediate oil compartments and consequently controlled by the oil within the compartments, so as to stop the seat sliding upward and further to be combined with the bicycle frame as a whole.

摘要翻译： 本发明涉及一种自行车座椅支柱结构，更具体地说，涉及一种具有液压致动器的结构，其中配置有上油室，中间油室和下油室; 三个油室相互沟通。 其特征在于，自行车座柱结构提供与销同时移动的上阀，并且构造在上油室和中间油室之间; 当销处于锁定状态时，上阀将关闭以将上油室与中间油室隔开。 因此，阀门将停止向上移动，因为它位于上部和中间油室之上，因此由隔室内的油控制，以便阻止座椅向上滑动并进一步与自行车车架整体结合 。

公开(公告)号：US20090174055A1

公开(公告)日：2009-07-09

申请号：US12401549

申请日：2009-03-10

申请人： Frank Kuo

发明人： Frank Kuo

IPC分类号： H01L23/52

CPC分类号： H01L21/565 ,  H01L23/3107 ,  H01L2924/0002 ,  H01L2924/00

摘要： An encapsulation technique for leadless semiconductor packages entails: (a) attaching a plurality of dice (411) to die pads in cavities (41-45, 51-55) of a leadframe, the cavities arranged in a matrix of columns and rows; (b) electrically connecting the dice to a plurality of conducting portions (412-414) of the leadframe; and (c) longitudinally injecting molding material into the cavities along the columns via a plurality of longitudinal gates (46-49, 56-59) of the leadframe to package the dice in the cavities, the longitudinal gates situated between the cavities along the columns.

摘要翻译： 用于无引线半导体封装的封装技术包括：（a）将多个管芯（411）附接到引线框架的空腔（41-45,51-55）中的管芯焊盘，所述空腔布置成列和列的矩阵; （b）将所述裸片电连接到所述引线框架的多个导电部分（412-414）; 以及（c）通过所述引线框架的多个纵向门（46-49,56-59）沿着所述列将模制材料纵向注射到所述空腔中，以将所述模具封装在所述空腔中，所述纵向浇口位于所述空腔之间， 。

公开(公告)号：US06856006B2

公开(公告)日：2005-02-15

申请号：US10113526

申请日：2002-03-28

申请人： Frank Kuo

发明人： Frank Kuo

IPC分类号： H01L21/56 ,  H01L23/31 ,  H01L23/495 ,  H01L21/44 ,  H01L21/48 ,  H01L21/50

CPC分类号： H01L21/565 ,  H01L23/3107 ,  H01L2924/0002 ,  H01L2924/00

摘要： An encapsulation technique for leadless semiconductor packages entails: (a) attaching a plurality of dice (411) to die pads in cavities (41-45, 51-55) of a leadframe, the cavities arranged in a matrix of columns and rows; (b) electrically connecting the dice to a plurality of conducting portions (412-414) of the leadframe; and (c) longitudinally injecting molding material into the cavities along the columns via a plurality of longitudinal gates (46-49, 56-59) of the leadframe to package the dice in the cavities, the longitudinal gates situated between the cavities along the columns.

摘要翻译： 用于无引线半导体封装的封装技术包括：（a）将多个管芯（411）附接到引线框架的空腔（41-45,51-55）中的管芯焊盘，所述空腔布置成列和列的矩阵; （b）将所述裸片电连接到所述引线框架的多个导电部分（412-414）; 以及（c）通过所述引线框架的多个纵向门（46-49,56-59）沿着所述列将模制材料纵向注射到所述空腔中，以将所述模具封装在所述空腔中，所述纵向浇口位于所述空腔之间， 。

公开(公告)号：US08928157B2

公开(公告)日：2015-01-06

申请号：US12401549

申请日：2009-03-10

申请人： Frank Kuo

发明人： Frank Kuo

IPC分类号： H01L33/00 ,  H01L23/495 ,  H01L23/28 ,  H01L21/56 ,  H01L23/31

CPC分类号： H01L21/565 ,  H01L23/3107 ,  H01L2924/0002 ,  H01L2924/00

摘要： An encapsulation technique for leadless semiconductor packages entails: (a) attaching a plurality of dice (411) to die pads in cavities (41-45, 51-55) of a leadframe, the cavities arranged in a matrix of columns and rows; (b) electrically connecting the dice to a plurality of conducting portions (412-414) of the leadframe; and (c) longitudinally injecting molding material into the cavities along the columns via a plurality of longitudinal gates (46-49, 56-59) of the leadframe to package the dice in the cavities, the longitudinal gates situated between the cavities along the columns.

摘要翻译： 用于无引线半导体封装的封装技术包括：（a）将多个管芯（411）附接到引线框架的空腔（41-45,51-55）中的管芯焊盘，所述空腔布置成列和列的矩阵; （b）将所述裸片电连接到所述引线框架的多个导电部分（412-414）; 以及（c）通过所述引线框架的多个纵向门（46-49,56-59）沿着所述列将模制材料纵向注射到所述空腔中，以将所述模具封装在所述空腔中，所述纵向浇口位于所述空腔之间， 。

公开(公告)号：US20140332939A1

公开(公告)日：2014-11-13

申请号：US14341772

申请日：2014-07-26

申请人： Frank Kuo ,  Suresh Belani

发明人： Frank Kuo ,  Suresh Belani

IPC分类号： H01L21/48 ,  H01L23/495

CPC分类号： H01L24/90 ,  H01L21/4825 ,  H01L21/56 ,  H01L21/78 ,  H01L23/4952 ,  H01L23/49524 ,  H01L23/49562 ,  H01L23/49575 ,  H01L24/32 ,  H01L24/33 ,  H01L24/34 ,  H01L24/36 ,  H01L24/38 ,  H01L24/40 ,  H01L24/41 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/83 ,  H01L24/84 ,  H01L24/97 ,  H01L2224/32245 ,  H01L2224/40095 ,  H01L2224/40245 ,  H01L2224/40247 ,  H01L2224/4103 ,  H01L2224/45144 ,  H01L2224/48247 ,  H01L2224/49111 ,  H01L2224/83 ,  H01L2224/83801 ,  H01L2224/84801 ,  H01L2224/97 ,  H01L2924/00012 ,  H01L2924/00014 ,  H01L2924/00015 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/1306 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2224/84 ,  H01L2924/00 ,  H01L2224/37099

摘要： A semiconductor package and a method for making the same are provided. In the method, a clip is used to conduct a lead frame and at least one chip. The clip has at least one second connection segment, at least one third connection segment, and at least one intermediate connection segment. The second connection segment is electrically connected to a second conduction region of the chip and a second pin of the lead frame respectively, and the third connection segment is electrically connected to a third conduction region of the chip and a third pin of the lead frame respectively. The intermediate connection segment connects the at least one second connection segment and the at least one third connection segment, and is removed in a subsequent process. Thereby, the present invention does not need to use any gold wire, which effectively saves the material cost and the processing dine.

摘要翻译： 提供半导体封装及其制造方法。 在该方法中，使用夹子来引导引线框架和至少一个芯片。 夹具具有至少一个第二连接段，至少一个第三连接段和至少一个中间连接段。 第二连接段分别电连接到芯片的第二导电区域和引线框架的第二引脚，并且第三连接段分别电连接到芯片的第三导电区域和引线框架的第三引脚 。 中间连接段连接至少一个第二连接段和至少一个第三连接段，并在随后的过程中被移除。 因此，本发明不需要使用任何金线，其有效地节省了材料成本和处理用餐。