公开(公告)号：US20190088403A1

公开(公告)日：2019-03-21

申请号：US16195917

申请日：2018-11-20

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Shingo ITO

IPC: H01F27/28 ,  H01F27/29 ,  H05K1/16 ,  H01F27/06 ,  H01F41/04 ,  H01F7/08

Abstract: An electronic component includes an insulating base material substrate including a first main surface defining a mounting surface, a coil on the insulating base material substrate, and a mounting electrode on the first main surface and connected to the coil. The insulating base material substrate includes insulating base material layers laminated in a lamination direction. The coil includes a coil conductor provided on one of the insulating base material layers and a winding axis extending in the lamination direction. An area of the first main surface is smaller than an area of a section different in area from the first main surface and is closest to the first main surface, among sections parallel or substantially parallel to the first main surface.

公开(公告)号：US20180374623A1

公开(公告)日：2018-12-27

申请号：US16116963

申请日：2018-08-30

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Shingo ITO ,  Kuniaki YOSUI

IPC: H01F17/00 ,  H01F27/28 ,  H05K1/02 ,  H01F27/29 ,  H05K1/16 ,  H05K1/18 ,  H05K3/46

Abstract: A multilayer substrate includes at least three coil conductors respectively patterned on different surfaces of a first main surface of a laminated body, a second main surface of the laminated body, and laminated interfaces of insulating base materials and that are arranged in a lamination direction. The at least three coil conductors include first and second coil conductors, and are connected in series between first and second external electrodes. A surface at which another coil conductor is provided is not interposed between two surfaces at which the first and second coil conductors are provided, respectively. Further, the first and second coil conductors are directly connected to the first and second external electrodes, respectively, without another coil conductor interposed therebetween.

公开(公告)号：US20170365389A1

公开(公告)日：2017-12-21

申请号：US15695037

申请日：2017-09-05

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Kuniaki YOSUI ,  Shingo ITO

IPC: H01F17/00 ,  H01F41/071 ,  H01F27/28

CPC classification number: H01F17/0013 ,  H01F27/2852 ,  H01F27/292 ,  H01F41/042 ,  H01F41/071 ,  H01F2017/0073 ,  H01F2017/0086 ,  H01F2027/2809 ,  H01F2027/2857

Abstract: A coil-incorporated multilayer substrate includes base materials and a coil portion including conductor patterns that are wound a plurality of times on at least one of the base materials, and, in a predetermined direction along the surface of the base material of the coil portion, the width of outermost conductor patterns is larger than the widths of the conductor patterns between an innermost conductor pattern and an outermost conductor pattern, the width of the innermost conductor pattern is larger than the widths of the conductor patterns between the outermost conductor pattern and the innermost conductor pattern, and the width of the innermost conductor pattern is larger than the distance between the innermost conductor pattern and the conductor pattern adjacent to the innermost conductor pattern.

公开(公告)号：US20170194686A1

公开(公告)日：2017-07-06

申请号：US15465635

申请日：2017-03-22

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Shingo ITO ,  Kuniaki YOSUI

IPC: H01P3/02

CPC classification number: H01P3/026 ,  H01P1/02 ,  H01P1/047 ,  H01P3/082 ,  H01P3/085 ,  H01P5/028 ,  H05K1/0245 ,  H05K1/142 ,  H05K2201/0919 ,  H05K2201/09845

Abstract: A first signal conductor pattern, a first ground conductor pattern, and a second ground conductor pattern define a first transmission line with a strip line structure. A second signal conductor pattern, a third ground conductor pattern, and a fourth ground conductor pattern define a second transmission line with a strip line structure. A first connecting portion at an end of the first transmission line and a second connecting portion at an end of the second transmission line are stacked together so that the first ground conductor pattern is electrically connected to the third ground conductor pattern, the second ground conductor pattern is electrically connected to the fourth ground conductor pattern, and the first signal conductor pattern is electrically connected to the second signal conductor pattern.

公开(公告)号：US20170194076A1

公开(公告)日：2017-07-06

申请号：US15465633

申请日：2017-03-22

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Kuniaki YOSUI ,  Shingo ITO ,  Shuichi KEZUKA ,  Takahiro BABA

IPC: H01B7/08 ,  H01P3/02

CPC classification number: H01B7/08 ,  H01P3/026 ,  H01P3/082 ,  H05K1/0219 ,  H05K1/0225 ,  H05K1/147 ,  H05K2201/052 ,  H05K2201/10037 ,  H05K2201/10189

Abstract: A transmission line includes, in a stacked insulator in which insulator layers are stacked, a first transmission line portion including a first ground conductor pattern, a second ground conductor pattern, and a first signal conductor pattern, and a second transmission line portion including a third ground conductor pattern, a fourth ground conductor pattern, and a second signal conductor pattern. The first signal conductor pattern extends along the second signal conductor pattern. The first ground conductor pattern and the third ground conductor pattern are provided on different insulator layers and at least partially overlap each other in a plan view.

公开(公告)号：US20130083502A1

公开(公告)日：2013-04-04

申请号：US13689794

申请日：2012-11-30

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Atsuyoshi MAEDA ,  Shingo ITO ,  Satoru NODA

IPC: H05K7/02

CPC classification number: H05K7/026 ,  H01G4/232 ,  H01G4/40 ,  H01L23/49816 ,  H01L23/49838 ,  H01L23/50 ,  H01L23/5389 ,  H01L2224/05001 ,  H01L2224/05026 ,  H01L2224/05568 ,  H01L2224/16 ,  H01L2924/00014 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/15159 ,  H01L2924/15311 ,  H01L2924/19106 ,  H01L2224/05599 ,  H01L2224/05099

Abstract: A package substrate includes a main package body including a first principal surface on which an IC is mounted, and a second principal surface, opposed to the first principal surface, on which first bonding materials for mounting are provided. An internal circuit is provided within the main package body and connected to the first bonding materials. A sub-package is arranged on the second principal surface and includes electronic components embedded therein. A thickness direction dimension being the distance from the second principal surface to a portion of the sub-package most distant from the second principal surface, is not more than a thickness direction dimension being the distance from the second principal surface to an edge of the first bonding material at the second principal surface.

Abstract translation: 封装基板包括：主封装主体，包括安装有IC的第一主表面;以及与第一主表面相对的第二主表面，在其上设置用于安装的第一粘合材料。 内部电路设置在主包装体内并连接到第一接合材料。 子包装被布置在第二主表面上并且包括嵌入其中的电子部件。 厚度方向尺寸是从第二主表面到最远离第二主表面的子组件的一部分的距离的厚度方向尺寸不大于从第二主表面到第一主表面的边缘的距离的厚度方向尺寸 在第二主表面处接合材料。