BUILT-IN-COIL SUBSTRATE AND METHOD FOR MANUFACTURING THE SAME

    公开(公告)号:US20170294258A1

    公开(公告)日:2017-10-12

    申请号:US15632415

    申请日:2017-06-26

    Abstract: In a built-in coil substrate, coil conductor patterns are provided on insulating base materials. Coil interlayer connection conductors, which provide interlayer connection between the coil conductor patterns, are provided on the insulating base materials and made of conductive paste. First and second external electrodes are provided on a first principal surface of a multilayer body. One of the coil conductor patterns is connected to the first external electrode by first-external-electrode connection conductors made of the conductive paste. Another one of the coil conductor patterns is connected to the second external electrode by a second-external-electrode connection conductor. The second-external-electrode connection conductor is a metal film provided in a through hole that extends through the multilayer body in a stacking direction in which the insulating base materials are stacked.

    TRANSMISSION LINE
    2.
    发明申请

    公开(公告)号:US20230100141A1

    公开(公告)日:2023-03-30

    申请号:US18071673

    申请日:2022-11-30

    Abstract: A transmission line includes an element body and a signal conductor layer in the element body and having a linear shape. The transmission line includes a first, second, and third impedance sections, an impedance conversion section, and a reflection section. The second impedance section, the reflection section, the first impedance section, the impedance conversion section, and the third impedance section are positioned in this order along the signal conductor layer. Characteristic impedance of the first impedance section is lower than characteristic impedance in the second impedance section and characteristic impedance in the third impedance section. A change amount of characteristic impedance per unit length in the reflection section is larger than a change amount of characteristic impedance per unit length in the impedance conversion section.

    MULTILAYER SUBSTRATE, ELECTRONIC DEVICE, AND A METHOD FOR MANUFACTURING A MULTILAYER SUBSTRATE

    公开(公告)号:US20180302977A1

    公开(公告)日:2018-10-18

    申请号:US16011708

    申请日:2018-06-19

    Abstract: A multilayer substrate includes a base including insulating layers stacked on one another, a first principal surface, and a second principal surface, a heat transfer member extending through a first insulating layer nearest to the first principal surface, a second coefficient of thermal conductivity of a material of the heat transfer member is higher than a first coefficient of thermal conductivity of a material of the insulating layers, a first metal film adhered to the first principal surface, the first metal film overlapping the heat transfer member when viewed from the layer stacking direction, and a first joining member disposed between the heat transfer member and the first metal film and being made of a material with a coefficient of thermal conductivity which is higher than the first coefficient of thermal conductivity of the material of the insulating layers.

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