公开(公告)号：US20150001564A1

公开(公告)日：2015-01-01

申请号：US14317008

申请日：2014-06-27

Applicant: NICHIA CORPORATION

Inventor： Hiroki OGURO ,  Motokazu YAMADA ,  Yasuo FUJIKAWA

IPC: H01L33/60 ,  H01L33/50

CPC classification number: H01L33/60 ,  H01L33/48 ,  H01L33/50 ,  H01L33/505 ,  H01L2224/73204

Abstract: Provided is a light emitting device in which deterioration of the substrate member can be reduced. The light emitting device includes a base member mainly made of a resin, a plurality of wiring portions and arranged on the base member via an adhesive agent, a groove portion defined between adjacent wiring portions, and at least one light emitting element which is disposed straddling at least a part of the groove portion. The adhesive agent is applied covering the base member from the groove portion, and contains a light-shielding member. The light-shielding member shields the base member from light, for example at a specific wavelength, emitted from the at least one light emitting element.

Abstract translation: 提供了能够降低基板部件的劣化的发光装置。 发光装置包括主要由树脂制成的基底构件，多个布线部分，并且经由粘合剂布置在基底构件上，限定在相邻布线部分之间的凹槽部分和至少一个跨越的布置的发光元件 凹槽部分的至少一部分。 涂敷粘合剂从凹槽部分覆盖基底构件，并且包含遮光构件。 光屏蔽构件将基体部件从例如从至少一个发光元件发射的特定波长的光屏蔽。

公开(公告)号：US20140091333A1

公开(公告)日：2014-04-03

申请号：US14036505

申请日：2013-09-25

Applicant: NICHIA CORPORATION

Inventor： Takeshi TAMURA ,  Tomonori OZAKI ,  Yasuo FUJIKAWA

IPC: H01L33/52

CPC classification number: H01L33/52 ,  H01L25/167 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A light emitting device includes a light emitting device body and a protective member. The light emitting device body has a flexible base member, at least one light emitting element arranged on the base member, and a sealing resin member sealing the light emitting element. The protective member is disposed adjacent to the sealing resin member on the base member. The protective member has a height greater than a height of the sealing resin member.

Abstract translation: 发光器件包括发光器件本体和保护元件。 发光器件本体具有柔性基底构件，布置在基底构件上的至少一个发光元件和密封发光元件的密封树脂构件。 保护构件与基体上的密封树脂构件相邻设置。 保护构件的高度大于密封树脂构件的高度。

公开(公告)号：US20140084781A1

公开(公告)日：2014-03-27

申请号：US14036444

申请日：2013-09-25

Applicant: Nichia Corporation

Inventor： Takeshi TAMURA ,  Hiroaki SHOZUI ,  Yasuo FUJIKAWA

IPC: H01L33/50

CPC classification number: H01L33/50 ,  H01L25/0753 ,  H01L33/502 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A light emitting device includes a substrate including a base member, a plurality of wiring portions disposed on a surface of the base member, a covering portion having openings respectively exposing a part of the wiring portions, a plurality of light emitting elements respectively electrically connected to the wiring portions exposed from the covering portion, and sealing members respectively sealing the light emitting elements. At least a part of the covering portion contains a light-storing material.

Abstract translation: 发光装置包括基板，其包括基体部件，设置在基体部件的表面上的多个布线部分，具有分别暴露一部分布线部分的开口的覆盖部分，多个发光元件，分别电连接到 从覆盖部露出的布线部分和分别密封发光元件的密封件。 覆盖部分的至少一部分包含光存储材料。