摘要:
A rotary substrate holder of a molecular beam epitaxy apparatus including leads-cum-posts serving both as leads for passing a current to a heater for heating a substrate and as posts for supporting the heater. By this arrangement, heat transferred from the heater to a bearing disposed in the vicinity of the heater is minimized in amount, thereby prolonging the service life of the holder and minimizing a heat loss thereof.
摘要:
A binding apparatus to bind sheets includes a binding device, a non-volatile memory, and control circuitry. The binding device is configured to bind a plurality of stacked sheets with a binding member. The non-volatile memory is configured to store a quantity of binding members in the binding device. The control circuitry is configured to control operation of the binding device. The control circuitry outputs an alert when the quantity of binding members stored in the non-volatile memory is equal to or less than a first predetermined value and cancels the alert when the quantity of binding members is equal to or less than a second predetermined value.
摘要:
Disclosed is a vehicle chassis side structure comprising a side sill (15) whereupon a closed section is formed from a side sill outer (37) and a side sill inner (38). The side sill outer (37) comprises an upper wall portion (44) and a lower wall portion (45). The closed section is formed in a polygonal shape by forming an upper bead (47) from the leading end of the side sill (15) to the trailing end thereof, upon at least the upper wall portion (44) from among the upper and lower wall portions (44, 45). The vehicle chassis side structure further comprises a reinforcement member (64) upon a central joining portion (56) whereat a center pillar (17) is joined, which closes an opening (61) of the upper bead (47) and an opening (62) of a lower bead (48), forming the closed section.
摘要:
Vehicle front body structure includes, in each of its left and right sections, a damper housing having mounted thereon an upper portion of a suspension damper; a front side frame having the housing attached thereto; a damper housing connection bracket inserted in an opening of the frame; a welding section formed on the housing and fixed to the bracket; a lid fitted in the opening to form the frame as a closed-sectional-shape structure. The body structure also includes a collar nut provided within the side frame and supporting a sub frame, and each of the housings has a lower section connected to the collar nut.
摘要:
A method for compressing a semiconductor integrated circuit, comprising dividing a design region, in which a semiconductor integrated circuit is to be designed, into a plurality of blocks, assigning semiconductor devices to each of the blocks, determining a device density of each block, compressing any block, and connecting the blocks by wiring. In the compressing of the block, the block that is determined to have a low device density is compressed.
摘要:
According to the present invention, there is provided a semiconductor integrated circuit layout design method of laying out standard cells by using a layout apparatus including an input unit, an arithmetic unit, and a storage unit, comprising, causing the arithmetic unit to calculate an area necessary for layout of each standard cell by using data about a plurality of kinds of standard cells having different heights in a row direction, which is stored in the storage unit in advance, causing the arithmetic unit to calculate the numbers of stages of row regions having heights corresponding to the standard cells on the basis of the calculated area, and causing the arithmetic unit to lay out the standard cells in the corresponding row regions.
摘要:
There is provided a plasmar processing apparatus capable of positively controlling the temperature distribution of a semiconductor wafer during etching processing in a clear state, wherein an electrode block is provided with independent slits as coolant flow paths on the inner and outer peripheries and, at the same time, between these slits is formed a slit for suppressing heat transfer between the inner and outer peripheries, and owing to this slit for suppressing heat transfer, a uniform temperature in the electrode block is suppressed and thus it is possible to obtain an arbitrary independent temperature in the plane of the electrode block and positive and clear control of temperature distribution patterns can be performed.
摘要:
A method and system of holding a substrate where foreign substances on the back surface can be decreased. The substrate holding system comprises a ring-shaped leakage-proof surface having a smooth surface on the specimen table corresponding to the periphery of the substrate, a plurality of contact holding portions within the periphery of the substrate, and electrostatic attraction means for fixing the substrate by contacting the back surface of the substrate to the ring-shaped leakage-proof surface and the contact holding portions. The substrate contacts to the cooling surface at the ring-shaped leakage-proof surface and the contact holding portion placed on a position inside the ring-shaped leakage-proof surface. The back surface of the substrate and the cooling surface do not contact to each other in the large portion of the remaining area.
摘要:
Upon execution of four sets of m/2 bit×n/2 bit multiplication, four multiplicand selectors select m/2-bit multiplicands respectively and four multiplicator selectors select corresponding n/2-bit multiplicators respectively, then the selected m/2-bit multiplicands and n/2-bit multiplicators are input into four multipliers, and then four sets of m/2 bit×n/2 bit multiplication are executed in parallel. Upon execution of m bit×n bit multiplication, the four multiplicand selectors select upper or lower m/2-bit multiplicands respectively and the four multiplicator selectors select upper or lower n/2-bit multiplicators respectively, then the selected m/2-bit multiplicands and n/2-bit multiplicators are input into the four multipliers respectively, then multiplication results of (lower m/2 bits of m bits)×(lower n/2 bits of n bits) and (upper m/2 bits of m bits)×(upper n/2 bits of n bits) out of four multiplication results of the four multipliers are connected by a connector, and then the connected multiplication results and the other two multiplication results are added by an adder with arranging in a predetermined bit location each other respectively.
摘要:
To improve an actual exhaust speed, in a vacuum processing device for processing a work located in a vacuum processing chamber by using a processing gas introduced into the vacuum processing chamber, the vacuum processing device having means for introducing the processing gas into the vacuum processing chamber, means for controlling a gas flow of the processing gas, and means for exhausting the processing gas after the work is processed by the processing gas; the exhausting means comprises an exhaust pump, a buffer space extended in a direction substantially perpendicular to a center of the work with an extended area larger than a size of a suction port of the exhaust pump, and a gas outlet formed on a back side of a surface of the work to be processed, the gas outlet having a size substantially equal to or larger than the size of the suction port of the exhaust pump. Further, the exhaust arrangement can be provided at a shifted position so as to allow a work space beneath a work table.