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公开(公告)号：US20220117121A1
公开(公告)日：2022-04-14
申请号：US17069676
申请日：2020-10-13
Applicant: Nvidia Corporation
Inventor： Ali Heydari , Jeremy Rodriguez
Abstract: Systems and methods for cooling a datacenter are disclosed. In at least one embodiment, an integrated power and coolant distribution unit (PCDU) comprises control logic to cause at least one power controller to provide a power response or to cause at least one flow controller to provide a coolant response from the PCDU upon a determined change in a power state or coolant state.
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公开(公告)号：US20220087075A1
公开(公告)日：2022-03-17
申请号：US17023695
申请日：2020-09-17
Applicant: Nvidia Corporation
Inventor： Ali Heydari , Vladimir Troy
Abstract: Systems and methods for cooling a computer environment are disclosed. In at least one embodiment, one or more neural networks can be used to determine one or more temperature control settings associated with one or more servers.
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公开(公告)号：US20220015270A1
公开(公告)日：2022-01-13
申请号：US16923920
申请日：2020-07-08
Applicant: Nvidia Corporation
Inventor： Harold Miyamura , Jeremy Rodriguez , Ali Heydari
Abstract: An adapter plate and a fastening system for fastening a manifold to a rack in a datacenter is disclosed. The adapter plate is associated with the manifold and has holes to receive buttons in configurable positions. The configurable positions enable the buttons to mate with keyholes of a bracket of the rack in order to fasten the manifold to the bracket.
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24.发明授权公开(公告)号：US12238895B2
公开(公告)日：2025-02-25
申请号：US17224814
申请日：2021-04-07
Applicant: Nvidia Corporation
Inventor： Ali Heydari
IPC: H05K7/20
Abstract: Systems and methods for cooling a datacenter are disclosed. In at least one embodiment, a cold plate includes an evaporator to remove heat from at least one computing device using a two-phase fluid and using a buffer to perform flow stabilization represented by different volumes or different flow rates of a two-phase fluid that is enabled to flow between an evaporator and a condensing or compressor unit located external to a cold plate.
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公开(公告)号：US12213281B2
公开(公告)日：2025-01-28
申请号：US17729787
申请日：2022-04-26
Applicant: Nvidia Corporation
Inventor： Ali Heydari
Abstract: A cold plate that is configurable and for a datacenter liquid cooling system is disclosed. The cold plate includes a first section, a second section, and an intermediate layer, which is changeable and has first channels to enable flow of a coolant through the intermediate layer, and has second channels or at least one adapted second channel to concentrate the coolant or the flow of the coolant to at least one area within the configurable cold plate corresponding to at least a heat generating feature of an associated computing device.
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Patent Agency Ranking
公开(公告)号：US12200913B2
公开(公告)日：2025-01-14
申请号：US16798216
申请日：2020-02-21
Applicant: Nvidia Corporation
Inventor： Ali Heydari
Abstract: A cooling system for a datacenter is disclosed. The datacenter cooling system includes a cooling manifold having a first controllable fluid coupler to receive a coolant from a cooling loop external to the rack and one or more second controllable fluid couplers to distribute the coolant to one or more server cooling manifolds within server trays of a rack within the datacenter.
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公开(公告)号：US12193194B2
公开(公告)日：2025-01-07
申请号：US17840413
申请日：2022-06-14
Applicant: Nvidia Corporation
Inventor： Ali Heydari
IPC: H05K7/20
Abstract: Systems and methods for a datacenter cooling system are disclosed. In at least one embodiment, a thermal test vehicle (TTV) includes an air-cooled heat element associated with a plurality of fins to enable air cooling of a TTV and includes a liquid-cooled heat trace associated with a cold plate to enable liquid cooling of a TTV, where an air-cooled heat element and a liquid-cooled heat trace generate heat to enable separate or concurrent testing of air cooling and liquid cooling in a datacenter cooling system.
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28.发明授权公开(公告)号：US12160981B2
公开(公告)日：2024-12-03
申请号：US17582568
申请日：2022-01-24
Applicant: Nvidia Corporation
Inventor： Ali Heydari
IPC: H05K7/20
Abstract: Systems and methods for cooling a datacenter are disclosed. In at least one embodiment, a first three-way flow controller is associated with a single-phase fluid and a second three-way flow controller is associated with a two-phase fluid, with a first three-way flow controller to enable a first flow path of a single-phase fluid from a coolant distribution unit to a cold plate or to enable a second flow path to a heat exchanger to cool a two-phase fluid to be used in a cold plate, and with a second three-way flow controller to enable a third flow path of a two-phase fluid to a cold plate or to enable a fourth flow path to a heat exchanger.
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公开(公告)号：US11991865B2
公开(公告)日：2024-05-21
申请号：US17066293
申请日：2020-10-08
Applicant: Nvidia Corporation
Inventor： Ali Heydari
CPC classification number: H05K7/20745 , A61L2/10 , C02F1/32 , H05K7/2079 , H05K7/20836 , C02F2209/008 , C02F2209/06 , C02F2209/07
Abstract: Systems and methods for cooling a computer environment are disclosed. In at least one embodiment, a cooling assembly can be used to monitor and control fluid quality associated with one or more servers.
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公开(公告)号：US11963339B2
公开(公告)日：2024-04-16
申请号：US17020145
申请日：2020-09-14
Applicant: Nvidia Corporation
Inventor： Ali Heydari
IPC: H05K7/20
CPC classification number: H05K7/2079 , H05K7/20263 , H05K7/2039 , H05K7/20836
Abstract: Systems and methods for cooling a data center are disclosed. In at least one embodiment, a radiator is associated with one or more racks of a datacenter and has a first portion to function as an air-to-liquid heat exchanger having a primary cooling loop to absorb first heat away from the one or more racks and has a second portion to function as a liquid-to-liquid heat exchanger to enable at least one secondary cooling loop to exchange second heat with the primary cooling loop.
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