公开(公告)号：US09958726B2

公开(公告)日：2018-05-01

申请号：US14631390

申请日：2015-02-25

Applicant: OmniVision Technologies, Inc.

Inventor： Chun-Sheng Fan

IPC: G02F1/1335 ,  G02F1/1343 ,  G02F1/1362

CPC classification number: G02F1/133553 ,  G02F1/13439 ,  G02F1/136277

Abstract: A highly-reflective liquid crystal on silicon (LCOS) panel includes pixel electrodes on a substrate, each pixel electrode having a top surface with a first reflectivity. A continuous reflective coating covers the pixel electrodes and substrate surfaces therebetween, forming a plurality of coated pixel electrodes having an enhanced reflectivity that exceeds the first reflectivity. A method for increasing pixel reflectivity in a LCOS panel includes depositing a continuous reflective coating covering both (1) a plurality of pixel electrodes on a substrate and (2) a plurality of inter-pixel substrate surfaces, and depositing a layer on the continuous reflective coating.

公开(公告)号：US09653504B1

公开(公告)日：2017-05-16

申请号：US14930912

申请日：2015-11-03

Applicant: OmniVision Technologies, Inc.

Inventor： Wei-Feng Lin ,  Chun-Sheng Fan

IPC: H01L27/146 ,  H01L31/18

CPC classification number: H01L27/14623 ,  H01L27/14618 ,  H01L27/14625 ,  H01L27/14632 ,  H01L27/14685 ,  H01L27/14687 ,  H01L2224/11 ,  H01L2924/16235

Abstract: A chip-scale image sensor packaging method with black masking includes (a) cutting a composite wafer having a plurality of image sensors bonded to a common glass substrate to form slots in the common glass substrate, wherein the slots define a cover glass for each of the image sensors, respectively, (b) forming black mask in the slots such that the black mask, for each of the image sensors, spans perimeter of the cover glass as viewed cross-sectionally along optical axis of the image sensors, and (c) dicing through the black mask in the slots to singulate a plurality of chip-scale packaged image sensors each including one of the image sensors and the cover glass bonded thereto, with sides of the cover glass facing away from the optical axis being at least partly covered by the black mask.

公开(公告)号：US20160246115A1

公开(公告)日：2016-08-25

申请号：US14631390

申请日：2015-02-25

Applicant: OmniVision Technologies, Inc.

Inventor： Chun-Sheng Fan

IPC: G02F1/1335 ,  G02F1/1337 ,  G02F1/1343

CPC classification number: G02F1/133553 ,  G02F1/13439 ,  G02F1/136277

Abstract: A highly-reflective liquid crystal on silicon (LCOS) panel includes pixel electrodes on a substrate, each pixel electrode having a top surface with a first reflectivity. A continuous reflective coating covers the pixel electrodes and substrate surfaces therebetween, forming a plurality of coated pixel electrodes having an enhanced reflectivity that exceeds the first reflectivity. A method for increasing pixel reflectivity in a LCOS panel includes depositing a continuous reflective coating covering both (1) a plurality of pixel electrodes on a substrate and (2) a plurality of inter-pixel substrate surfaces, and depositing a layer on the continuous reflective coating.

Abstract translation: 硅反射型液晶（LCOS）面板包括衬底上的像素电极，每个像素电极具有具有第一反射率的顶表面。 连续反射涂层覆盖其间的像素电极和衬底表面，形成多个具有超过第一反射率的增强反射率的涂覆像素电极。 一种用于增加LCOS面板中的像素反射率的方法包括沉积覆盖（1）衬底上的多个像素电极的连续反射涂层和（2）多个像素间衬底表面，以及在连续反射 涂层。

公开(公告)号：US09406716B2

公开(公告)日：2016-08-02

申请号：US14876296

申请日：2015-10-06

Applicant: OmniVision Technologies, Inc.

Inventor： Wei-Feng Lin ,  Yeh-An Chien ,  Chun-Sheng Fan

IPC: H01L27/00 ,  H01L27/146

CPC classification number: H01L27/14649 ,  H01L27/146 ,  H01L27/14607 ,  H01L27/14621 ,  H01L27/14623 ,  H01L27/14627 ,  H01L27/14629 ,  H01L27/14636 ,  H01L27/14669 ,  H01L2224/11

Abstract: An image sensor includes a photosensing element for receiving infrared (IR) radiation and detecting the IR radiation and generating an electrical signal indicative of the IR radiation. A redistribution layer (RDL) is disposed under the photosensing element, the RDL comprising pattern of conductors for receiving the electrical signal. An IR reflection layer, an IR absorption layer or an isolation layer is disposed between the photosensing element and the RDL. The IR reflection layer, IR absorption layer or isolation layer provides a barrier to IR radiation such that the IR radiation does not impinge upon the RDL. As a result, a ghost image of the RDL is not generated, resulting in reduced noise and improved sensitivity and performance of the image sensor.

公开(公告)号：US20160139446A1

公开(公告)日：2016-05-19

申请号：US14547986

申请日：2014-11-19

Applicant: OmniVision Technologies, Inc.

Inventor： Wei-Feng Li ,  Chun-Sheng Fan

IPC: G02F1/1345 ,  H05K3/36 ,  G02F1/1333

CPC classification number: G02F1/13458 ,  G02F1/133308 ,  G02F1/13452 ,  G02F1/136277 ,  H05K3/323 ,  H05K2201/10136

Abstract: A liquid-crystal-on-silicon (LCOS) panel includes a wafer having bond pads thereon, a liquid crystal layer, and a conductive layer. The panel carrier for the LCOS panel includes a conductive-layer electrode for electrically connecting the conductive layer to a printed circuit assembly (PCA), address electrodes for electrically connecting the bond pads to the PCA, and a cavity for holding the LCOS panel. The cavity includes a conductive pad for electrically connecting the conductive layer to the conductive-layer electrode, and bond-pad electrodes for electrically connecting each bond pad to a respective address electrode. A method for electrically connecting an LCOS panel to a panel carrier includes a step of electrically connecting each bond pad to a respective address electrode, and a step of electrically connecting the conductive layer to the conductive pad.

Abstract translation: 液晶硅（LCOS）面板包括其上具有接合焊盘的晶片，液晶层和导电层。 用于LCOS面板的面板载体包括用于将导电层电连接到印刷电路组件（PCA）的导电层电极，用于将接合焊盘电连接到PCA的寻址电极和用于保持LCOS面板的空腔。 空腔包括用于将导电层电连接到导电层电极的导电焊盘和用于将每个接合焊盘电连接到相应寻址电极的焊盘电极。 将LCOS面板电连接到面板载体的方法包括将每个接合焊盘电连接到相应的寻址电极的步骤，以及将导电层电连接到导电焊盘的步骤。

公开(公告)号：US20150228680A1

公开(公告)日：2015-08-13

申请号：US14696630

申请日：2015-04-27

Applicant: OmniVision Technologies, Inc.,

Inventor： Wei-Feng Lin ,  Yeh-An Chien ,  Chun-Sheng Fan

IPC: H01L27/146

CPC classification number: H01L27/14649 ,  H01L27/146 ,  H01L27/14607 ,  H01L27/14621 ,  H01L27/14623 ,  H01L27/14627 ,  H01L27/14629 ,  H01L27/14636 ,  H01L27/14669 ,  H01L2224/11

Abstract: An image sensor includes a photosensing element for receiving infrared (IR) radiation and detecting the IR radiation and generating an electrical signal indicative of the IR radiation. A redistribution layer (RDL) is disposed under the photosensing element, the RDL comprising pattern of conductors for receiving the electrical signal. An IR reflection layer, an IR absorption layer or an isolation layer is disposed between the photosensing element and the RDL. The IR reflection layer, IR absorption layer or isolation layer provides a barrier to IR radiation such that the IR radiation does not impinge upon the RDL. As a result, a ghost image of the RDL is not generated, resulting in reduced noise and improved sensitivity and performance of the image sensor.

Abstract translation: 图像传感器包括用于接收红外（IR）辐射和检测IR辐射并产生指示IR辐射的电信号的光敏元件。 再分配层（RDL）设置在光敏元件下方，RDL包括用于接收电信号的导体图案。 在感光元件和RDL之间设置IR反射层，IR吸收层或隔离层。 IR反射层，IR吸收层或隔离层为IR辐射提供了屏障，使得IR辐射不会撞击RDL。 结果，不产生RDL的重影，导致图像传感器的噪音降低和灵敏度和性能的提高。

公开(公告)号：US12064090B2

公开(公告)日：2024-08-20

申请号：US17504105

申请日：2021-10-18

Applicant: OmniVision Technologies, Inc.

Inventor： Teng-Sheng Chen ,  Wei-Ping Chen ,  Jau-Jan Deng ,  Wei-Feng Lin ,  Chun-Sheng Fan

IPC: A61B1/00 ,  A61B1/05 ,  A61B1/06

CPC classification number: A61B1/051 ,  A61B1/00096 ,  A61B1/0638 ,  A61B1/0684

Abstract: A cavity interposer has a cavity, first bondpads adapted to couple to a chip-type camera cube disposed within a base of the cavity at a first level, the first bondpads coupled through feedthroughs to second bondpads at a base of the interposer at a second level; and third bondpads adapted to couple to a light-emitting diode (LED), the third bondpads at a third level. The third bondpads coupled to fourth bondpads at the base of the interposer at the second level; and the second and fourth bondpads couple to conductors of a cable with the first, second, and third level different. An endoscope optical includes the cavity interposer an LED, and a chip-type camera cube electrically bonded to the first bondpads; the LED is bonded to the third bondpads; and a top of the chip-type camera cube and a top of the LED are at a same level.

公开(公告)号：US11073709B2

公开(公告)日：2021-07-27

申请号：US16164469

申请日：2018-10-18

Applicant: OmniVision Technologies, Inc.

Inventor： Pei-Wen Ko ,  Chun-Sheng Fan

IPC: G02F1/1333 ,  G02F1/1362 ,  G02F1/1335 ,  G02F1/1343 ,  G02F1/135

Abstract: An example liquid crystal display device includes a circuit substrate, an array of conductive mirrors formed on the substrate, a light absorbing material disposed between the conductive mirrors, a transparent plate disposed over the array of conductive mirrors, and liquid crystal material disposed between the conductive mirrors and the transparent plate. The light absorbing material can also be disposed around the peripheral region of the array of the conductive mirrors. In an example display, the light absorbing material is black and/or has a light absorbing efficiency of at least fifty percent.

公开(公告)号：US10750061B2

公开(公告)日：2020-08-18

申请号：US15705523

申请日：2017-09-15

Applicant: OmniVision Technologies, Inc.

Inventor： Chun-Sheng Fan

IPC: H04N5/225 ,  G02B23/24 ,  F21V19/00 ,  H01L33/62 ,  A61B1/05 ,  A61B1/005 ,  A61B1/06 ,  A61B1/00 ,  F21Y115/10

Abstract: An endoscope comprises a FPC (flexible printed circuit) having a first side and a second side, where the FPC comprises a first head part, a body part, and tail part. At least one solder pad is on the first side of the first head part, and at least one solder pad is on the first side of the body part. The endoscope further comprises a camera module mounted on the first side of the body part and a first LED (light emitting diode). A first side of the first LED is mounted on the first side of the first head part and a second side of the first LED is mounted on a first side of the camera module, while the first head part is bent. The second side of the body part is mounted on an end of a flexible fiber, and the tail part of the FPC is bent to mount on the flexible fiber.

公开(公告)号：US20200050044A1

公开(公告)日：2020-02-13

申请号：US16658338

申请日：2019-10-21

Applicant: OmniVision Technologies, Inc.

Inventor： Chun-Sheng Fan

IPC: G02F1/1345 ,  G02F1/1362

Abstract: A method of fanning an electrical connection in a liquid crystal on silicon (LCOS) device, comprising: providing a silicon substrate including a first surface and a second surface, wherein the silicon substrate includes an conductive pad at the first surface; providing a cover glass panel that includes a cover glass, a transparent electrode layer formed upon the cover glass, and a first sealing material layer formed upon the transparent electrode layer; forming a second sealing material layer upon the first surface of the silicon substrate, wherein the second sealing material layer covers the conductive pad; forming a display layer, comprising a liquid crystal portion, a first seal portion, and a second seal portion, upon the second sealing material layer; wherein the first seal portion and the second seal portion are situated to form a space between them; and wherein the space is situated on top of the conductive pad; placing the cover glass panel upon the display layer, wherein the first sealing material layer is placed directly in contact with the display layer; singulating the cover glass panel, the display layer, and the silicon substrate, through the space between the first seal portion and the second seal portion, wherein the first seal portion is separated from the second seal portion; subsequently dispensing a conductive adhesive to the cover glass panel and the silicon substrate, wherein the conductive adhesive forms an electrical connection between transparent electrode layer and the conductive pad.