公开(公告)号：US09768156B1

公开(公告)日：2017-09-19

申请号：US15473547

申请日：2017-03-29

申请人： PDF Solutions, Inc.

发明人： Stephen Lam ,  Dennis Ciplickas ,  Tomasz Brozek ,  Jeremy Cheng ,  Simone Comensoli ,  Indranil De ,  Kelvin Doong ,  Hans Eisenmann ,  Timothy Fiscus ,  Jonathan Haigh ,  Christopher Hess ,  John Kibarian ,  Sherry Lee ,  Marci Liao ,  Sheng-Che Lin ,  Hideki Matsuhashi ,  Kimon Michaels ,  Conor O'Sullivan ,  Markus Rauscher ,  Vyacheslav Rovner ,  Andrzej Strojwas ,  Marcin Strojwas ,  Carl Taylor ,  Rakesh Vallishayee ,  Larg Weiland ,  Nobuharu Yokoyama

IPC分类号： H01L23/58 ,  H01L29/10 ,  H01L27/02 ,  H01L29/45 ,  H01L23/522 ,  H01L23/528 ,  H01L21/66 ,  H01L21/8234 ,  H01L27/088

CPC分类号： H01L22/20 ,  G01R31/303 ,  G06F11/079 ,  G06F17/5045 ,  G06F17/5068 ,  G06F17/5072 ,  G06F17/5081 ,  G06F2217/06 ,  H01L21/823437 ,  H01L21/823475 ,  H01L22/26 ,  H01L22/32 ,  H01L22/34 ,  H01L23/5226 ,  H01L23/528 ,  H01L27/0207 ,  H01L27/088 ,  H01L27/11803 ,  H01L27/11807 ,  H01L28/00 ,  H01L29/0649 ,  H01L29/0684 ,  H01L29/0847 ,  H01L29/41725 ,  H01L29/45 ,  H01L2027/11866 ,  H01L2027/11875 ,  H01L2027/11888

摘要： An IC includes first and second designs of experiments (DOES), each comprised of at least two fill cells. The fill cells contain structures configured to obtain in-line data via non-contact electrical measurements (“NCEM”). The first DOE contains fill cells configured to enable non-contact (NC) detection of side-to-side shorts, and the second DOE contains fill cells configured to enable NC detection of chamfer shorts.

公开(公告)号：US09768083B1

公开(公告)日：2017-09-19

申请号：US15634915

申请日：2017-06-27

申请人： PDF Solutions, Inc.

发明人： Stephen Lam ,  Dennis Ciplickas ,  Tomasz Brozek ,  Jeremy Cheng ,  Simone Comensoli ,  Indranil De ,  Kelvin Doong ,  Hans Eisenmann ,  Timothy Fiscus ,  Jonathan Haigh ,  Christopher Hess ,  John Kibarian ,  Sherry Lee ,  Marci Liao ,  Sheng-Che Lin ,  Hideki Matsuhashi ,  Kimon Michaels ,  Conor O'Sullivan ,  Markus Rauscher ,  Vyacheslav Rovner ,  Andrzej Strojwas ,  Marcin Strojwas ,  Carl Taylor ,  Rakesh Vallishayee ,  Larg Weiland ,  Nobuharu Yokoyama

IPC分类号： H01L29/00 ,  H01L21/66 ,  H01L29/417 ,  H01L29/06 ,  G06F17/50 ,  H01L27/02 ,  G06F11/07

CPC分类号： H01L22/26 ,  G06F11/079 ,  G06F17/5045 ,  G06F17/5072 ,  G06F17/5081 ,  H01L22/34 ,  H01L23/485 ,  H01L23/522 ,  H01L27/0207 ,  H01L29/0649 ,  H01L29/0684 ,  H01L29/41725

摘要： A process for making and using a semiconductor wafer includes instantiating first and second designs of experiments (DOEs), each comprised of at least two fill cells. The fill cells contain structures configured to obtain in-line data via non-contact electrical measurements (“NCEM”). The first DOE contains fill cells configured to enable non-contact (NC) detection of merged-via opens, and the second DOE contains fill cells configured to enable NC detection of snake opens. The process may further include obtaining NC measurements from the first and/or second DOE(s) and using such measurements, at least in part, to selectively perform additional processing, metrology or inspection steps on the wafer, and/or on other wafer(s) currently being manufactured.

公开(公告)号：US09691672B1

公开(公告)日：2017-06-27

申请号：US15433329

申请日：2017-02-15

申请人： PDF Solutions, Inc.

发明人： Stephen Lam ,  Dennis Ciplickas ,  Tomasz Brozek ,  Jeremy Cheng ,  Simone Comensoli ,  Indranil De ,  Kelvin Doong ,  Hans Eisenmann ,  Timothy Fiscus ,  Jonathan Haigh ,  Christopher Hess ,  John Kibarian ,  Sherry Lee ,  Marci Liao ,  Sheng-Che Lin ,  Hideki Matsuhashi ,  Kimon Michaels ,  Conor O'Sullivan ,  Markus Rauscher ,  Vyacheslav Rovner ,  Andrzej Strojwas ,  Marcin Strojwas ,  Carl Taylor ,  Rakesh Vallishayee ,  Larg Weiland ,  Nobuharu Yokoyama

IPC分类号： H01L21/66 ,  H01L27/02 ,  H01L27/118 ,  H01L23/528 ,  H01L29/417 ,  G06F17/50

CPC分类号： H01L22/26 ,  G01R31/2884 ,  G06F11/079 ,  G06F17/5045 ,  G06F17/5068 ,  G06F17/5072 ,  G06F17/5081 ,  H01L22/20 ,  H01L22/34 ,  H01L23/5226 ,  H01L23/528 ,  H01L27/0207 ,  H01L27/11803 ,  H01L27/11807 ,  H01L29/0649 ,  H01L29/0684 ,  H01L29/41725 ,  H01L29/45 ,  H01L2027/11866 ,  H01L2027/11875 ,  H01L2027/11885 ,  H01L2027/11887

摘要： An IC includes logic cells, selected from a standard cell library, and fill cells, configured for compatibility with the standard logic cells. The fill cells contain structures configured to obtain in-line data via non-contact electrical measurements (“NCEM”). The IC includes such NCEM-enabled fill cells configured to enable detection and/or measurement of a variety of open-circuit and short-circuit failure modes, including at least one via-open-related failure mode, one GATE-short-related failure mode, one GATECNT-short-related failure mode, and one metal-short-related failure mode.

公开(公告)号：US20170178981A1

公开(公告)日：2017-06-22

申请号：US15090256

申请日：2016-04-04

申请人： PDF Solutions, Inc.

发明人： Stephen Lam ,  Dennis Ciplickas ,  Tomasz Brozek ,  Jeremy Cheng ,  Simone Comensoli ,  Indranil De ,  Kelvin Doong ,  Hans Eisenmann ,  Timothy Fiscus ,  Jonathan Haigh ,  Christopher Hess ,  John Kibarian ,  Sherry Lee ,  Marci Liao ,  Sheng-Che Lin ,  Hideki Matsuhashi ,  Kimon Michaels ,  Conor O'Sullivan ,  Markus Rauscher ,  Vyacheslav Rovner ,  Andrzej Strojwas ,  Marcin Strojwas ,  Carl Taylor ,  Rakesh Vallishayee ,  Larg Weiland ,  Nobuharu Yokoyama

IPC分类号： H01L21/66

CPC分类号： H01L22/26 ,  G01R31/2884 ,  G06F11/079 ,  G06F17/5045 ,  G06F17/5068 ,  G06F17/5072 ,  G06F17/5081 ,  H01L22/20 ,  H01L22/34 ,  H01L23/5226 ,  H01L23/528 ,  H01L27/0207 ,  H01L27/11803 ,  H01L27/11807 ,  H01L29/0649 ,  H01L29/0684 ,  H01L29/41725 ,  H01L29/45 ,  H01L2027/11866 ,  H01L2027/11875 ,  H01L2027/11885 ,  H01L2027/11887

摘要： Wafers, chips, or dies that contain fill cells with structures configured to obtain in-line data via non-contact electrical measurements (“NCEM”). Such NCEM-enabled fill cells may target/expose a variety of open-circuit, short-circuit, leakage, or excessive resistance failure modes. Such wafers, chips, or dies may include Designs of Experiments (“DOEs”), comprised of multiple NCEM-enabled fill cells, in at least two variants, all targeted to the same failure mode(s).

公开(公告)号：US09653446B1

公开(公告)日：2017-05-16

申请号：US15390966

申请日：2016-12-27

申请人： PDF Solutions, Inc.

发明人： Stephen Lam ,  Dennis Ciplickas ,  Tomasz Brozek ,  Jeremy Cheng ,  Simone Comensoli ,  Indranil De ,  Kelvin Doong ,  Hans Eisenmann ,  Timothy Fiscus ,  Jonathan Haigh ,  Christopher Hess ,  John Kibarian ,  Sherry Lee ,  Marci Liao ,  Sheng-Che Lin ,  Hideki Matsuhashi ,  Kimon Michaels ,  Conor O'Sullivan ,  Markus Rauscher ,  Vyacheslav Rovner ,  Andrzej Strojwas ,  Marcin Strojwas ,  Carl Taylor ,  Rakesh Vallishayee ,  Larg Weiland ,  Nobuharu Yokoyama

IPC分类号： H01L29/00 ,  H01L27/02 ,  H01L21/66 ,  H01L29/417 ,  H01L29/06 ,  H01L23/528 ,  G06F11/07 ,  G06F17/50

CPC分类号： G06F11/079 ,  G06F17/5045 ,  G06F17/5068 ,  G06F17/5072 ,  G06F17/5081 ,  H01L21/823437 ,  H01L21/823475 ,  H01L22/20 ,  H01L22/26 ,  H01L22/32 ,  H01L22/34 ,  H01L23/5226 ,  H01L23/528 ,  H01L27/0207 ,  H01L27/088 ,  H01L27/092 ,  H01L29/0649 ,  H01L29/0684 ,  H01L29/41725 ,  H01L29/45

摘要： An IC includes logic cells, selected from a standard cell library, and fill cells, configured for compatibility with the standard logic cells. The fill cells contain structures configured to obtain in-line data via non-contact electrical measurements (“NCEM”). The IC includes such NCEM-enabled fill cells configured to enable detection and/or measurement of a variety of open-circuit and short-circuit failure modes, including at least one via-open-related failure mode, one AACNT-short-related failure mode, one TS-short-related failure mode, and one AA-short-related failure mode.

公开(公告)号：US11075194B1

公开(公告)日：2021-07-27

申请号：US16458088

申请日：2019-06-30

申请人： PDF Solutions, Inc.

发明人： Stephen Lam ,  Dennis Ciplickas ,  Tomasz Brozek ,  Jeremy Cheng ,  Simone Comensoli ,  Indranil De ,  Kelvin Doong ,  Hans Eisenmann ,  Timothy Fiscus ,  Jonathan Haigh ,  Christopher Hess ,  John Kibarian ,  Sherry Lee ,  Marci Liao ,  Sheng-Che Lin ,  Hideki Matsuhashi ,  Kimon Michaels ,  Conor O'Sullivan ,  Markus Rauscher ,  Vyacheslav Rovner ,  Andrzej Strojwas ,  Marcin Strojwas ,  Carl Taylor ,  Rakesh Vallishayee ,  Larg Weiland ,  Nobuharu Yokoyama ,  Matthew Moe

IPC分类号： H01L21/66 ,  H01L27/02 ,  H01L23/528 ,  H01L27/088 ,  H01L23/522 ,  H01L21/3213 ,  H01L29/08 ,  H01L29/45 ,  H01L21/8234 ,  H01J37/26 ,  H03K19/0944 ,  G01R31/28 ,  G06F30/39

摘要： An IC that includes a contiguous standard cell area with a 4×3 e-beam pad that is compatible with advanced manufacturing processes and an associated e-beam testable structure.

公开(公告)号：US10768222B1

公开(公告)日：2020-09-08

申请号：US15997411

申请日：2018-06-04

申请人： PDF Solutions, Inc.

发明人： Tomasz Brozek

IPC分类号： G01R31/28

摘要： Described here is an apparatus and method of testing a vertical (3D) semiconductor memory structure coupled between word lines and bit lines, by means of a direct connections of a plurality of test pads to word lines and bit lines of the memory structure on memory product wafer. Such connections are created by modified patterns of metal lines through contacts and vias created on the memory product wafer. The described apparatus and method are used for detecting electrical continuity (opens and shorts) in the memory structure, calculating resistance of selected word lines or bit cell strings, or performing more complex tests of memory bit cell transistors. The result of this detection can then be used to find defective regions or memory cells in the semiconductor memory structure. Such a testing device may be referred to as a direct testing system.

公开(公告)号：US10290552B1

公开(公告)日：2019-05-14

申请号：US16024054

申请日：2018-06-29

申请人： PDF Solutions, Inc.

发明人： Stephen Lam ,  Dennis Ciplickas ,  Tomasz Brozek ,  Jeremy Cheng ,  Simone Comensoli ,  Indranil De ,  Kelvin Doong ,  Hans Eisenmann ,  Timothy Fiscus ,  Jonathan Haigh ,  Christopher Hess ,  John Kibarian ,  Sherry Lee ,  Marci Liao ,  Sheng-Che Lin ,  Hideki Matsuhashi ,  Kimon Michaels ,  Conor O'Sullivan ,  Markus Rauscher ,  Vyacheslav Rovner ,  Andrzej Strojwas ,  Marcin Strojwas ,  Carl Taylor ,  Rakesh Vallishayee ,  Larg Weiland ,  Nobuharu Yokoyama

IPC分类号： H01L21/66 ,  H01L23/58 ,  H01L27/02 ,  H01L29/06

摘要： A method for processing a semiconductor wafer uses non-contact electrical measurements indicative of at least one tip-to-tip short or leakage, at least one via-chamfer short or leakage, and at least one corner short or leakage, where such measurements are obtained from cells with respective tip-to-tip short, via-chamfer short, and corner short test areas, using a charged particle-beam inspector with a moving stage and beam deflection to account for motion of the stage.

公开(公告)号：US10211112B1

公开(公告)日：2019-02-19

申请号：US15936759

申请日：2018-03-27

申请人： PDF Solutions, Inc.

发明人： Stephen Lam ,  Dennis Ciplickas ,  Tomasz Brozek ,  Jeremy Cheng ,  Simone Comensoli ,  Indranil De ,  Kelvin Doong ,  Hans Eisenmann ,  Timothy Fiscus ,  Jonathan Haigh ,  Christopher Hess ,  John Kibarian ,  Sherry Lee ,  Marci Liao ,  Sheng-Che Lin ,  Hideki Matsuhashi ,  Kimon Michaels ,  Conor O'Sullivan ,  Markus Rauscher ,  Vyacheslav Rovner ,  Andrzej Strojwas ,  Marcin Strojwas ,  Carl Taylor ,  Rakesh Vallishayee ,  Larg Weiland ,  Nobuharu Yokoyama

IPC分类号： H01L23/58 ,  H01L21/66 ,  H01L27/02 ,  H01L23/528 ,  H01L29/06

摘要： A method for processing a semiconductor wafer uses non-contact electrical measurements indicative of at least one tip-to-tip short or leakage, at least one tip-to-side short or leakage, and at least one side-to-side short or leakage, where such measurements are obtained from non-contact pads associated with respective tip-to-tip short, tip-to-side short, and side-to-side short test areas.

公开(公告)号：US10199286B1

公开(公告)日：2019-02-05

申请号：US15942470

申请日：2018-03-31

申请人： PDF Solutions, Inc.

发明人： Stephen Lam ,  Dennis Ciplickas ,  Tomasz Brozek ,  Jeremy Cheng ,  Simone Comensoli ,  Indranil De ,  Kelvin Doong ,  Hans Eisenmann ,  Timothy Fiscus ,  Jonathan Haigh ,  Christopher Hess ,  John Kibarian ,  Sherry Lee ,  Marci Liao ,  Sheng-Che Lin ,  Hideki Matsuhashi ,  Kimon Michaels ,  Conor O'Sullivan ,  Markus Rauscher ,  Vyacheslav Rovner ,  Andrzej Strojwas ,  Marcin Strojwas ,  Carl Taylor ,  Rakesh Vallishayee ,  Larg Weiland ,  Nobuharu Yokoyama

IPC分类号： H01L29/00 ,  H01L21/66 ,  H01L27/118 ,  H01L29/417 ,  H01L27/02 ,  H01L23/528 ,  G06F11/07 ,  G06F17/50 ,  H01L29/06

摘要： A method for processing a semiconductor wafer uses non-contact electrical measurements indicative of at least one tip-to-side short or leakage, at least one chamfer short or leakage, and at least one corner short or leakage, where such measurements are obtained from non-contact pads associated with respective tip-to-side short, chamfer short, and corner short test areas.