公开(公告)号：US11107804B1

公开(公告)日：2021-08-31

申请号：US16458095

申请日：2019-06-30

Applicant: PDF Solutions, Inc.

Inventor： Stephen Lam ,  Dennis Ciplickas ,  Tomasz Brozek ,  Jeremy Cheng ,  Simone Comensoli ,  Indranil De ,  Kelvin Doong ,  Hans Eisenmann ,  Timothy Fiscus ,  Jonathan Haigh ,  Christopher Hess ,  John Kibarian ,  Sherry Lee ,  Marci Liao ,  Sheng-Che Lin ,  Hideki Matsuhashi ,  Kimon Michaels ,  Conor O'Sullivan ,  Markus Rauscher ,  Vyacheslav Rovner ,  Andrzej Strojwas ,  Marcin Strojwas ,  Carl Taylor ,  Rakesh Vallishayee ,  Larg Weiland ,  Nobuharu Yokoyama ,  Matthew Moe

IPC: H01L21/66 ,  H01L27/02 ,  H01L23/528 ,  H01L27/088 ,  H01L23/522 ,  H01L21/3213 ,  H01L29/08 ,  H01L29/45 ,  H01L21/8234 ,  H01J37/26 ,  H03K19/0944 ,  G01R31/28 ,  G06F30/39

Abstract: An IC that includes a contiguous standard cell area with a 4x3 e-beam pad that is compatible with advanced manufacturing processes and an associated e-beam testable structure.

公开(公告)号：US11081477B1

公开(公告)日：2021-08-03

申请号：US16458087

申请日：2019-06-30

Applicant: PDF Solutions, Inc.

Inventor： Stephen Lam ,  Dennis Ciplickas ,  Tomasz Brozek ,  Jeremy Cheng ,  Simone Comensoli ,  Indranil De ,  Kelvin Doong ,  Hans Eisenmann ,  Timothy Fiscus ,  Jonathan Haigh ,  Christopher Hess ,  John Kibarian ,  Sherry Lee ,  Marci Liao ,  Sheng-Che Lin ,  Hideki Matsuhashi ,  Kimon Michaels ,  Conor O'Sullivan ,  Markus Rauscher ,  Vyacheslav Rovner ,  Andrzej Strojwas ,  Marcin Strojwas ,  Carl Taylor ,  Rakesh Vallishayee ,  Larg Weiland ,  Nobuharu Yokoyama ,  Matthew Moe

IPC: H01L21/26 ,  H01L21/66 ,  H01L29/00 ,  H01L27/02 ,  H01L23/528 ,  H01L27/088 ,  H01L23/522 ,  H01L21/3213 ,  H01L29/08 ,  H01L29/45 ,  H01L21/8234 ,  H01J37/26 ,  H03K19/0944 ,  G01R31/28 ,  G06F30/39

Abstract: An IC that includes a contiguous standard cell area with a 4×3 e-beam pad that is compatible with advanced manufacturing processes and an associated e-beam testable structure.

公开(公告)号：US11075194B1

公开(公告)日：2021-07-27

申请号：US16458088

申请日：2019-06-30

Applicant: PDF Solutions, Inc.

Inventor： Stephen Lam ,  Dennis Ciplickas ,  Tomasz Brozek ,  Jeremy Cheng ,  Simone Comensoli ,  Indranil De ,  Kelvin Doong ,  Hans Eisenmann ,  Timothy Fiscus ,  Jonathan Haigh ,  Christopher Hess ,  John Kibarian ,  Sherry Lee ,  Marci Liao ,  Sheng-Che Lin ,  Hideki Matsuhashi ,  Kimon Michaels ,  Conor O'Sullivan ,  Markus Rauscher ,  Vyacheslav Rovner ,  Andrzej Strojwas ,  Marcin Strojwas ,  Carl Taylor ,  Rakesh Vallishayee ,  Larg Weiland ,  Nobuharu Yokoyama ,  Matthew Moe

IPC: H01L21/66 ,  H01L27/02 ,  H01L23/528 ,  H01L27/088 ,  H01L23/522 ,  H01L21/3213 ,  H01L29/08 ,  H01L29/45 ,  H01L21/8234 ,  H01J37/26 ,  H03K19/0944 ,  G01R31/28 ,  G06F30/39

Abstract: An IC that includes a contiguous standard cell area with a 4×3 e-beam pad that is compatible with advanced manufacturing processes and an associated e-beam testable structure.

公开(公告)号：US11081476B1

公开(公告)日：2021-08-03

申请号：US16458085

申请日：2019-06-30

Applicant: PDF Solutions, Inc.

Inventor： Stephen Lam ,  Dennis Ciplickas ,  Tomasz Brozek ,  Jeremy Cheng ,  Simone Comensoli ,  Indranil De ,  Kelvin Doong ,  Hans Eisenmann ,  Timothy Fiscus ,  Jonathan Haigh ,  Christopher Hess ,  John Kibarian ,  Sherry Lee ,  Marci Liao ,  Sheng-Che Lin ,  Hideki Matsuhashi ,  Kimon Michaels ,  Conor O'Sullivan ,  Markus Rauscher ,  Vyacheslav Rovner ,  Andrzej Strojwas ,  Marcin Strojwas ,  Carl Taylor ,  Rakesh Vallishayee ,  Larg Weiland ,  Nobuharu Yokoyama ,  Matthew Moe

IPC: H01L27/02 ,  H01L21/66 ,  G01R31/303 ,  H01L21/8234 ,  H01L23/522 ,  H01L27/088 ,  H01L27/118 ,  G06F30/392 ,  G06F30/398

Abstract: An IC that includes a contiguous standard cell area with a 4×3 e-beam pad that is compatible with advanced manufacturing processes and an associated e-beam testable structure.

公开(公告)号：US11018126B1

公开(公告)日：2021-05-25

申请号：US16458082

申请日：2019-06-30

Applicant: PDF Solutions, Inc.

Inventor： Stephen Lam ,  Dennis Ciplickas ,  Tomasz Brozek ,  Jeremy Cheng ,  Simone Comensoli ,  Indranil De ,  Kelvin Doong ,  Hans Eisenmann ,  Timothy Fiscus ,  Jonathan Haigh ,  Christopher Hess ,  John Kibarian ,  Sherry Lee ,  Marci Liao ,  Sheng-Che Lin ,  Hideki Matsuhashi ,  Kimon Michaels ,  Conor O'Sullivan ,  Markus Rauscher ,  Vyacheslav Rovner ,  Andrzej Strojwas ,  Marcin Strojwas ,  Carl Taylor ,  Rakesh Vallishayee ,  Larg Weiland ,  Nobuharu Yokoyama ,  Matthew Moe

IPC: H01L27/02 ,  H01J37/26 ,  H01L21/66 ,  H03K19/0944 ,  H01L23/528 ,  H01L27/088 ,  H01L23/522 ,  H01L21/3213 ,  H01L29/08 ,  H01L29/45 ,  G01R31/28 ,  H01L21/8234 ,  G06F30/39

Abstract: An IC that includes a contiguous standard cell area with a 4×3 e-beam pad that is compatible with advanced manufacturing processes and an associated e-beam testable structure.

公开(公告)号：US10978438B1

公开(公告)日：2021-04-13

申请号：US16458042

申请日：2019-06-29

Applicant: PDF Solutions, Inc.

Inventor： Stephen Lam ,  Dennis Ciplickas ,  Tomasz Brozek ,  Jeremy Cheng ,  Simone Comensoli ,  Indranil De ,  Kelvin Doong ,  Hans Eisenmann ,  Timothy Fiscus ,  Jonathan Haigh ,  Christopher Hess ,  John Kibarian ,  Sherry Lee ,  Marci Liao ,  Sheng-Che Lin ,  Hideki Matsuhashi ,  Kimon Michaels ,  Conor O'Sullivan ,  Markus Rauscher ,  Vyacheslav Rovner ,  Andrzej Strojwas ,  Marcin Strojwas ,  Carl Taylor ,  Rakesh Vallishayee ,  Larg Weiland ,  Nobuharu Yokoyama ,  Matthew Moe

IPC: H01L21/66 ,  H01L27/02 ,  H01L23/528 ,  H01L23/522 ,  H01L29/417 ,  H01L21/8234 ,  H01L21/3213 ,  G01R31/28 ,  H01L27/088 ,  H01L29/45 ,  H01L29/08

Abstract: An IC that includes a contiguous standard cell area with a 4×3 e-beam pad that is compatible with advanced manufacturing processes and an associated e-beam testable structure.