SUBSLOT BUNDLING AND ACKNOWLEDGEMENT
    26.
    发明申请

    公开(公告)号:US20180176922A1

    公开(公告)日:2018-06-21

    申请号:US15789489

    申请日:2017-10-20

    Abstract: A first apparatus may puncture, in at least two subslots, a first type of data or control information with a second type of data or control information. The first apparatus may bundle the least two subslots within a subframe, and the subframe may include a portion for carrying acknowledgment (ACK)/negative acknowledgment (NACK) information associated with the second type of data or control information. The first apparatus may communicate with a user equipment (UE) during the at least two subslots within the subframe. A second apparatus may receive ACK/NACK information associated with a second type of data or control information. The second apparatus may reduce a transmission power for a first type of data or control information during a subsequent subframe when the ACK/NACK information indicates a negative acknowledgement.

    TECHNIQUES AND APPARATUSES FOR USING MINI-SLOTS FOR HYBRID AUTOMATIC REPEAT REQUEST (HARQ) TRANSMISSIONS

    公开(公告)号:US20200374090A1

    公开(公告)日:2020-11-26

    申请号:US16947751

    申请日:2020-08-14

    Abstract: Certain aspects of the present disclosure generally relate to wireless communication. In some aspects, a user equipment may receive, from a base station, an indicator associated with a hybrid automatic repeat request (HARQ) process, wherein the indicator indicates a number of mini-slots to be bundled for a HARQ transmission of the HARQ process; and decode the HARQ transmission based at least in part on the mini-slots. In some aspects, a base station may transmit an indicator, associated with a HARQ process, to a user equipment, wherein the indicator indicates a number of mini-slots to be bundled for a HARQ transmission of the HARQ process; and transmit the HARQ transmission to the user equipment using the mini-slots. Numerous other aspects are provided.

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