摘要:
In an aspect, a method is provided for forming a silicon-on-insulator (SOI) layer. The method includes the steps of (1) providing a silicon substrate; (2) selectively implanting the silicon substrate with oxygen using a low implant energy to form an ultra-thin patterned seed layer; and (3) employing the ultra-thin patterned seed layer to form a patterned SOI layer on the silicon substrate. Numerous other aspects are provided.
摘要:
A semiconductor structure including at least one e-fuse embedded within a trench that is located in a semiconductor substrate (bulk or semiconductor-on-insulator) is provided. In accordance with the present invention, the e-fuse is in electrical contact with a dopant region that is located within the semiconductor substrate. The present invention also provides a method of fabricating such a semiconductor structure in which the embedded e-fuse is formed substantially at the same time with the trench isolation regions.
摘要:
In a first aspect, a first apparatus is provided. The first apparatus is an element of an integrated circuit (IC) having (1) a metal-oxide-semiconductor field-effect transistor (MOSFET) having source/drain diffusion regions; (2) an electrical fuse (eFuse) coupled to the MOSFET such that a portion of the eFuse serves as a gate region of the MOSFET; and (3) an implanted region coupled to the source/drain diffusion regions of the MOSFET such that a path between the source/drain diffusion regions functions as a short circuit or an open circuit. Numerous other aspects are provided.
摘要:
An integrated circuit chip is provided having both a conventional DRAM vertical transfer device and an integrated vertical storage capacitor or anti-fuse that can be accessed directly without having to turn on a transfer gate. The mechanism for accessing the integrated capacitor or anti-fuse directly can be a modified doping profile within the vertical cell that provides a low resistance punch-through FET. Alternatively, the mechanism can be a pair of overlapping or nearly overlapping diffusions within the vertical cell.
摘要:
A method and structure for selectively growing epitaxial silicon in a trench formed within a silicon-on-insulator (SOI) structure. The SOI structure includes a buried oxide layer (BOX) on a bulk silicon substrate, and a silicon layer on the BOX. A pad layer is formed on the silicon layer. The pad layer includes a pad nitride (e.g., silicon nitride) on a pad oxide (e.g., silicon dioxide), and the pad oxide has been formed on the silicon layer. A trench is formed by anisotropically etching through the pad layer, the silicon layer, the BOX, and to a depth within the bulk silicon substrate. Insulative spacers are formed on sidewalls of the trench. An epitaxial silicon layer is grown in the trench from a bottom of the trench to above the pad layer. The pad layer and portions of the epitaxial layer are removed (e.g., by chemical mechanical polishing), resulting in a planarized top surface of the epitaxial layer that is about coplanar with a top surface of the silicon layer. Electronic devices may be formed within the epitaxial silicon of the trench. Such electronic devices may include dynamic random access memory (DRAM), bipolar transistors, Complementary Metal Oxide Semiconductor (CMOS) circuits which are sensitive to floating body effects, and devices requiring threshold voltage matching. Semiconductor devices (e.g., field effect transistors) may be coupled to the SOI structure outside the trench.
摘要:
A method and structure for a field effect transistor structure for dynamic random access memory integrated circuit devices has a gate conductor, salicide regions positioned along sides of the gate conductor, a gate cap positioned above the gate conductor and at least one self-aligned contact adjacent the gate conductor.
摘要:
A structure and method for simultaneously forming array structures and support structures on a substrate comprises forming the array structures to have a V-groove, forming the support structures to have a planar surface, and simultaneously forming a first oxide in the V-groove and a second oxide in the planar surface, wherein the first oxide is thicker than the second oxide.
摘要:
A first, “known good” reference off-chip driver circuit actuated by an initial logic program (IPL) input signal has an output lead connected as one of the inputs to a comparator circuit for providing a reference off-chip driver output signal. A second off-chip driver circuit including a plurality of “n” separate driver circuit paths connected to input signal and produces output signals connected to a common node to provide output driver signals to the common node. The common node is connected to the second input of the comparator circuit for comparison with the reference off-chip driver output signal from the first off-chip driver circuit to determine the operating state of the second off-chip driver circuit with respect to the operating state of the first off-chip driver circuit.
摘要:
A method and structure for a field effect transistor structure for dynamic random access memory integrated circuit devices has a gate conductor, salicide regions positioned along sides of the gate conductor, a gate cap positioned above the gate conductor and at least one self-aligned contact adjacent the gate conductor.
摘要:
A semiconductor device having areas that are semiconductor on insulator ("SOI") and areas that are bulk, single crystalline semiconductive areas is provided in which conductive spacers may be formed to electrically connect the SOI areas to ground in order to overcome floating body effects that can occur with SOI. Additionally, insulative spacers may be formed on the surface of the conductive spacers to electrically isolate the SOI regions from the bulk regions. A novel method for making both of these products is provided in which the epitaxially grown, single crystalline bulk regions need not be selectively grown, because a sacrificial polishing layer is deposited, is also provided.