Method of manufacturing semiconductor device
    21.
    发明授权
    Method of manufacturing semiconductor device 失效
    制造半导体器件的方法

    公开(公告)号:US5068704A

    公开(公告)日:1991-11-26

    申请号:US520446

    申请日:1990-05-08

    摘要: A method of manufacturing a semiconductor device comprising the steps of bringing a mirror-polished surface of a first semiconductor substrate of a first conductivity type into contact with a mirror-polished surface of a second semiconductor substrate of a second conductivity type having an impurity concentration which is lower than that of said first conductivity type, in a clean atmosphere, and thermally heating said first and second semiconductor substrates so that they unite. Impurity is diffused from said first semiconductor substrate into said second semiconductor substrate, thereby forming a diffusion layer of a first conductivity type in said second semiconductor substrate. A total amount of impurity of said diffusion layer is 1.times.10.sup.13 /cm.sup.2 to 2.times.10.sup.15 /cm.sup.2, to form a pn junction in said second semiconductor substrate.

    摘要翻译: 一种制造半导体器件的方法,包括以下步骤:将具有第一导电类型的第一半导体衬底的镜面抛光表面与具有杂质浓度的第二导电类型的第二半导体衬底的镜面抛光表面接触, 在清洁的气氛中低于所述第一导电类型,并且热加热所述第一和第二半导体衬底以使它们团结起来。 杂质从所述第一半导体衬底扩散到所述第二半导体衬底中,从而在所述第二半导体衬底中形成第一导电类型的扩散层。 所述扩散层的杂质的总量为1×10 13 / cm 2至2×10 15 / cm 2,以在所述第二半导体衬底中形成pn结。

    Benzothiazolones, and their production and use

    公开(公告)号:US4888428A

    公开(公告)日:1989-12-19

    申请号:US110882

    申请日:1987-10-21

    摘要: A compound of the formula: ##STR1## wherein R is a hydrogen atom, a C.sub.1 -C.sub.5 alkyl group, a C.sub.3 -C.sub.4 alkenyl group, a C.sub.3 -C.sub.4 alkynyl group, a halo(C.sub.1 -C.sub.4)alkyl group, a halo(C.sub.3 -C.sub.4)alkenyl group, a halo(C.sub.3 -C.sub.4)alkynyl group, a C.sub.1 -C.sub.2 alkoxy(C.sub.1 -C.sub.2) alkyl group, a C.sub.1 -C.sub.2 alkoxy(C.sub.1 -C.sub.2)alkoxy(C.sub.1 -C.sub.2)alkyl group, a cinnamyl group, a cyano(C.sub.1 -C.sub.3)alkyl group, a carboxy(C.sub.1 -C.sub.3)alkyl group, a C.sub.1 -C.sub.5 alkoxycarbonyl(C.sub.1 -C.sub.3)alkyl group, a halo(C.sub.1 -C.sub.5)alkoxycarbonyl(C.sub.1 -C.sub.3)alkyl group, a C.sub.1 -C.sub.2 alkoxyalkoxycarbonyl(C.sub. 1 -C.sub.3)alkyl group, a C.sub.1 -C.sub.2 alkoxy (C.sub.1 -C.sub.2)alkoxycarbonyl(C.sub.1 -C.sub.3)alkyl group, a C.sub.1 -C.sub.5 alkoxycarbonyl(C.sub.1 -C.sub.2)-alkoxycarbonyl(C.sub.1 -C.sub.3)alkyl group, a cyclo(C.sub.3 -C.sub.6)alkoxycarbonyl(C.sub.1 -C.sub.3)alkyl group, a C.sub.1 -C.sub.5 alkylaminocarbonyl(C.sub.1 -C.sub.3)alkyl group or a di-(C.sub.1 -C.sub.5)alkylaminocarbonyl(C.sub.1 -C.sub.3)alkyl group and A is an amino group or a nitro group, is disclosed. These compounds are useful as intermediates in the synthetic of benzothiazolone herbicides.

    Mirror
    26.
    发明授权
    Mirror 失效
    镜子

    公开(公告)号:US4499451A

    公开(公告)日:1985-02-12

    申请号:US364633

    申请日:1982-04-02

    摘要: A mirror arrangement including a transparent glass member, a translucent film behind the glass member, a light generating element having a configuration for conveying information when activated, the mirror arrangement functioning as an ordinary mirror when no voltage is applied to the light generating element such as an electroluminescent element while functioning as a light source or display panel when the voltage is applied to the light generating element, since the element energized emits light through the translucent aluminum film and the glass in front.

    摘要翻译: 包括透明玻璃构件,玻璃构件后面的半透明膜的反射镜装置,具有用于在激活时传送信息的构造的发光元件,当没有电压施加到发光元件例如 当电压施加到发光元件时,由于被激发的元件通过半透明铝膜和前面的玻璃发光,所以电场发光元件同时用作光源或显示面板。

    Shaping machine system and computer program for controlling a shaping device
    27.
    发明授权
    Shaping machine system and computer program for controlling a shaping device 有权
    整形机系统和计算机程序,用于控制整形装置

    公开(公告)号:US08740522B2

    公开(公告)日:2014-06-03

    申请号:US13457355

    申请日:2012-04-26

    IPC分类号: G05B19/402

    摘要: A shaping machine system including a shaping device and a computer is provided. The shaping device includes at least one jig mount body configured for mounting a jig; a shaping tool support body configured for supporting a shaping tool; a first drive device configured for rotating the shaping tool; and a second drive device configured for driving the shaping tool support body or the at least one jig mount body or changing a posture of the shaping tool relative to the workpiece. The computer is configured for controlling the first and second drive devices according to predetermined shaping data. The computer includes a jig position measuring unit configured for measuring a position of the jig; a position error detecting unit configured for detecting a position error of the jig, and a shaping data correcting unit configured for correcting the predetermined shaping data according to a jig position error.

    摘要翻译: 提供了一种包括成形装置和计算机的成形机系统。 成形装置包括至少一个构造成用于安装夹具的夹具安装体; 成形工具支撑体,其构造成用于支撑成形工具; 构造成旋转成形工具的第一驱动装置; 以及构造成用于驱动成形工具支撑体或至少一个夹具安装体或改变成形工具相对于工件的姿势的第二驱动装置。 计算机被配置为根据预定的成形数据来控制第一和第二驱动装置。 该计算机包括夹具位置测量单元,其被配置为测量夹具的位置; 位置误差检测单元,被配置为检测夹具的位置误差;以及整形数据校正单元,被配置为根据夹具位置误差校正预定的成形数据。

    Copper-based sliding material
    28.
    发明授权
    Copper-based sliding material 有权
    铜基滑动材料

    公开(公告)号:US08623517B2

    公开(公告)日:2014-01-07

    申请号:US13572915

    申请日:2012-08-13

    摘要: In a copper-based sliding material in which a Cu alloy layer contains 5% to 30% by mass of Bi, and the balance consisting of Cu and an unavoidable impurity, Bi is dispersed as particles of a Bi phase in the Cu alloy layer, and the mass ratio of the particles having a particle size of 2 to 50 μm and a circularity of 0.1 to 0.7 is 30% or more in the entire Bi phase in the Cu alloy layer, so that the particles of the Bi phase are uniformly dispersed in the Cu alloy layer. Therefore, the particles of the Bi phase in the Cu alloy layer are sequentially exposed to a sliding surface as wear of the sliding material progresses while excessive flow-out of molten Bi is prevented, so that improved seizure resistance is achieved.

    摘要翻译: 在Cu合金层含有5质量%〜30质量%的Bi的铜基滑动材料中,余量由Cu和不可避免的杂质构成,Bi作为Bi相的粒子分散在Cu合金层中, 在Cu合金层的整个Bi相中,粒径为2〜50μm,圆形度为0.1〜0.7的粒子的质量比为30%以上,使得Bi相的粒子均匀分散 在Cu合金层中。 因此,随着滑动材料的磨损进行而Cu合金层中的Bi相的颗粒依次暴露于滑动表面,同时防止熔融Bi的过量流出,从而获得改善的耐咬合性。

    Electronic component, electronic device, and manufacturing method for the electronic component
    29.
    发明授权
    Electronic component, electronic device, and manufacturing method for the electronic component 有权
    电子部件,电子设备和电子部件的制造方法

    公开(公告)号:US08553392B2

    公开(公告)日:2013-10-08

    申请号:US13184032

    申请日:2011-07-15

    IPC分类号: H01G9/00 H01G2/10

    摘要: Provided is an electric double-layer capacitor and the like, which may be easily manufactured. In a recessed container (2) constituting a package of an electric double-layer capacitor (1), a step portion (4) is formed. With this, the recessed container (2) has two parallel bottom surfaces which are not provided in the same plane, that is, a first bottom surface constituting a bottom portion of a recessed portion (13) and a second bottom surface constituting an upper surface of the step portion (4). The first bottom surface and the second bottom surface respectively have metallic layers (11, 9) formed thereon, which pass through the recessed container (2) toward an outside to respectively connect to terminals (12, 10). Electrodes (6, 5) are respectively connected to the upper surfaces of the metallic layers (11, 9).

    摘要翻译: 提供可以容易地制造的双电层电容器等。 在构成双电层电容器(1)的封装的凹形容器(2)中形成台阶部(4)。 由此,凹部容器(2)具有两个平行的底面,其并不设置在同一平面内,即构成凹部(13)底面的第一底面和构成上表面 的阶梯部(4)。 第一底表面和第二底表面分别具有形成在其上的金属层(11,9),其穿过凹陷容器(2)朝向外部分别连接到端子(12,10)。 电极(5,6)分别连接到金属层(11,9)的上表面。

    ANTENNA DEVICE
    30.
    发明申请
    ANTENNA DEVICE 有权
    天线设备

    公开(公告)号:US20130249742A1

    公开(公告)日:2013-09-26

    申请号:US13989734

    申请日:2011-11-21

    IPC分类号: H01Q1/38

    摘要: Provided is an antenna device that is capable of ensuring sufficient antenna performance by maximally utilizing a limited antenna occupied area. The antenna device is provided with a substrate main body (2); a ground plane (GND) that is formed on the substrate main body; an antenna-occupied area (AOA) that is provided in contact with one side (2a) of the substrate main body; a slit section (S) that is bored in the ground plane so as to extend from this area in the direction opposite to the one side (2a) of the substrate main body; a power feeding pattern (3) that is formed so as to extend into the slit section, provided with a power feeding point at the base end side, and connected with a first passive element (P1) halfway while the tip end side extends into the antenna-occupied area toward the one side of the substrate main body; an antenna element (AT) of a dielectric antenna that is connected to the tip end of the power feeding pattern and positioned along the one side of the substrate main body; a second passive element (P2) that is connected between the antenna element (AT) and the adjoining ground plane; and a ground connection pattern (5) for connecting the tip end of the power feeding pattern with the ground plane.

    摘要翻译: 提供了一种能够通过最大限度地利用有限的天线占用面积来确保足够的天线性能的天线装置。 天线装置设置有基板主体(2); 形成在基板主体上的接地面(GND); 天线占用区域(AOA),其设置成与所述基板主体的一侧(2a)接触; 在所述接地平面中以与所述基板主体的一侧(2a)相反的方向从所述区域延伸的狭缝部(S); 形成为延伸到狭缝部的供电图案(3),在所述基端侧设置有供电点,并且在所述前端侧延伸到所述第一无源元件(P1)的中途,与所述第一无源元件 天线占据区域朝向基板主体的一侧; 电介质天线的天线元件(AT),其连接到所述供电图案的前端并且沿着所述基板主体的一侧定位; 连接在所述天线元件(AT)和相邻的接地平面之间的第二无源元件(P2); 以及用于将馈电图案的末端与接地面连接的接地连接图案(5)。