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公开(公告)号：US20220181078A1
公开(公告)日：2022-06-09
申请号：US17469164
申请日：2021-09-08
发明人： Sang Yeop Kim , Beom Joon Cho , Gyeong Ju Song
摘要： An electronic component includes a multilayer capacitor including a body and an external electrode disposed externally on the body; a metal frame coupled to the multilayer capacitor; and an adhesive layer disposed between the external electrode and the metal frame and including a solder layer and a conductive resin layer.
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公开(公告)号：US11302481B2
公开(公告)日：2022-04-12
申请号：US16867849
申请日：2020-05-06
发明人： Beom Joon Cho , Jae Young Na , Ki Young Kim , Ji Hong Jo , Woo Chul Shin
摘要： An electronic component and a mounting substrate thereof provide metal frames that reduce stress transmission while occupying only a limited mounting area. The electronic component includes a body, and first and second external electrodes respectively disposed on opposite ends of the body. A first metal frame includes a first support portion bonded to the first external electrode and a first mounting portion extending from a lower end of the first support portion toward the second external electrode. A second metal frame includes a second support portion bonded to the second external electrode and a second mounting portion extending form a lower end of the second support portion away from the first external electrode.
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公开(公告)号：US20220102074A1
公开(公告)日：2022-03-31
申请号：US17327941
申请日：2021-05-24
发明人： Mi Na Hyun , Beom Joon Cho , Ki Young Kim
摘要： An electronic component includes: a capacitor body; a pair of external electrodes disposed on opposite end surfaces of the capacitor body, respectively; and a pair of metal frames connected to the pair of external electrodes, respectively. A coefficient of thermal expansion of the pair of metal frames has a value between a coefficient of thermal expansion of the capacitor body and a coefficient of thermal expansion of a solder.
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公开(公告)号：US11276529B2
公开(公告)日：2022-03-15
申请号：US16850768
申请日：2020-04-16
发明人： Jae Young Na , Ki Young Kim , Beom Joon Cho , Ji Hong Jo , Woo Chul Shin
摘要： An electronic component and a board having the same mounted thereon are provided. The electronic component includes: a body; an electrode disposed on an end of the body in a first direction; a metal frame including a support layer bonded to the external electrode, a mounting portion extending in the first direction in a lower end of the support layer and having a protruding portion on a lower surface, and a coating film formed to cover an upper surface of the protruding portion on an upper surface of the mounting portion and including titanium (Ti).
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公开(公告)号：US20220013290A1
公开(公告)日：2022-01-13
申请号：US17487323
申请日：2021-09-28
发明人： Beom Joon Cho , Ki Young Kim , Woo Chul Shin , Sang Soo Park
摘要： An electronic component includes a body, a pair of external electrodes, disposed on both ends of the body in a first direction, respectively, containing at least one of copper and nickel, while not containing a noble metal, a pair of metal frames connected to the pair of external electrodes, respectively, and a pair of conductive bonding layers, disposed between the external electrode and the metal frame, respectively, containing the same metal component as the external electrode.
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公开(公告)号：US11164699B2
公开(公告)日：2021-11-02
申请号：US16401583
申请日：2019-05-02
发明人： Beom Joon Cho , Ki Young Kim , Woo Chul Shin , Sang Soo Park
摘要： An electronic component includes a body, a pair of external electrodes, disposed on both ends of the body in a first direction, respectively, containing at least one of copper and nickel, while not containing a noble metal, a pair of metal frames connected to the pair of external electrodes, respectively, and a pair of conductive bonding layers, disposed between the external electrode and the metal frame, respectively, containing the same metal component as the external electrode.
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公开(公告)号：US10854389B2
公开(公告)日：2020-12-01
申请号：US16821042
申请日：2020-03-17
发明人： Beom Joon Cho , Woo Chul Shin , Ki Young Kim , Sang Soo Park
摘要： An electronic component includes a capacitor array including a plurality of multilayer capacitors; and first and second metal frames disposed on a side surface and another side surface of the capacitor array and electrically connected to first and second external electrodes, respectively, wherein the first metal frame includes a first support portion; a first mounting portion; and a first connection portion, the second metal frame includes a second support portion; a second mounting portion; and a second connection portion, and lengths of the first and second mounting portions in the first direction are smaller than a length of the capacitor array in the first direction.
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公开(公告)号：US10650975B2
公开(公告)日：2020-05-12
申请号：US15988817
申请日：2018-05-24
发明人： Beom Joon Cho
摘要： A multilayer electronic component includes: a first frame terminal including a first side frame, a first bottom frame and a first top frame; a second frame terminal including a second side frame, a second bottom frame and a second top frame; an electronic component including first and second external electrodes, and disposed between the first and second side frames; a first conductive adhesive disposed between the first external electrode and an upper portion of the first frame terminal; and a second conductive adhesive disposed between the second external electrode and an upper portion of the second frame terminal, wherein space portions are provided between the first and second external electrodes and lower portions of the first and second side frames and between the first and second external electrodes and the first and second bottom frames, respectively.
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公开(公告)号：US12087512B2
公开(公告)日：2024-09-10
申请号：US18196257
申请日：2023-05-11
发明人： Gyeong Ju Song , Beom Joon Cho , Seung Min Ahn
CPC分类号： H01G4/30 , H01G2/065 , H01G4/012 , H01G4/1209 , H01G4/232
摘要： There are provided an electronic component and a board including the same. The electronic component includes: a capacitor body; a pair of external electrodes respectively disposed on both ends of the capacitor body; and a pair of metal frames including a pair of connection portions connected to the pair of external electrodes, respectively, and a pair of mounting portions connected to the pair of connection portions, respectively. A bottom surface of one of the pair of mounting portions has roughness.
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公开(公告)号：US11837404B2
公开(公告)日：2023-12-05
申请号：US18098280
申请日：2023-01-18
发明人： Sang Yeop Kim , Beom Joon Cho , Gyeong Ju Song
CPC分类号： H01G2/06 , H01G4/2325 , H01G4/30
摘要： An electronic component includes a multilayer capacitor including a body and an external electrode disposed externally on the body; a metal frame coupled to the multilayer capacitor; and an adhesive layer disposed between the external electrode and the metal frame and including a solder layer and a conductive resin layer.
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