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    MULTILAYERED CERAMIC COMPONENT
    21.
    发明申请
    MULTILAYERED CERAMIC COMPONENT 审中-公开
    多层陶瓷组件

    公开(公告)号：US20130321977A1

    公开(公告)日：2013-12-05

    申请号：US13900533

    申请日：2013-05-23

    Applicant: Samsung Electro-Mechanics Co., Ltd.

    Inventor： Seung Ho LEE ,  Jong Han KIM ,  Eung Soo KIM

    IPC: H01G4/008 ,  H01G4/30

    CPC classification number: H01G4/008 ,  B32B18/00 ,  C04B2237/346 ,  H01G4/0085 ,  H01G4/1227 ,  H01G4/30

    Abstract: Disclosed herein is a multilayered ceramic component having a structure in which internal electrode layers and dielectric layers are alternately multilayered, wherein the internal electrode layer includes 0.01 to 12 wt % of common material based on weight of metal powders, and an average particle size of the common material is within 30% of an average particle size of the metal powders. According to the first exemplary embodiment of the present invention, the particle size and the added amount of common material squeezed out from the internal electrode layer at the time of firing at a high temperature are controlled, thereby making it possible to improve the connectivity of the internal electrode.

    Abstract translation: 本发明公开了具有内部电极层和电介质层交替层叠的结构的多层陶瓷部件，其中，内部电极层包含基于金属粉末重量的0.01〜12重量％的普通材料，平均粒径为 普通材料在金属粉末的平均粒径的30％以内。 根据本发明的第一示例性实施例，控制在高温烧制时从内部电极层挤出的普通材料的粒度和添加量，从而可以提高 内部电极

    MULTILAYER CERAMIC ELECTRONIC COMPONENT AND METHOD OF MANUFACTURING THE SAME
    27.
    发明申请
    MULTILAYER CERAMIC ELECTRONIC COMPONENT AND METHOD OF MANUFACTURING THE SAME 有权
    多层陶瓷电子元件及其制造方法

    公开(公告)号：US20140355177A1

    公开(公告)日：2014-12-04

    申请号：US13962563

    申请日：2013-08-08

    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

    Inventor： Seung Ho LEE ,  Jong Han KIM ,  Min Gon LEE ,  Yoon Hee LEE ,  Sung Hwan LEE

    IPC: H01G4/012

    CPC classification number: H01G4/012 ,  H01G4/005 ,  H01G4/008 ,  H01G4/0085 ,  H01G4/1209 ,  H01G4/30 ,  Y10T29/417

    Abstract: There is provided a multilayer ceramic electronic component including a ceramic body including a plurality dielectric layers stacked thereon, a plurality of internal electrodes formed to be exposed to both end surface of the ceramic body, having the dielectric layer interposed therebetween, and external electrodes formed on the end surfaces of the ceramic body and electrically connected to the internal electrodes, respectively, wherein connectivity of the internal electrode is equal to or greater than 87%.

    Abstract translation: 提供了一种多层陶瓷电子部件，其包括：陶瓷体，其包括堆叠在其上的多个电介质层，形成为暴露于陶瓷体的两端面的多个内部电极，其间具有电介质层，形成在外部电极 陶瓷体的端面分别电连接到内部电极，其中内部电极的连接性等于或大于87％。

    MULTILAYER CERAMIC ELECTRONIC COMPONENT AND MOUNTING BOARD THEREFOR
    28.
    发明申请
    MULTILAYER CERAMIC ELECTRONIC COMPONENT AND MOUNTING BOARD THEREFOR 有权
    多层陶瓷电子元件及其安装板

    公开(公告)号：US20140326494A1

    公开(公告)日：2014-11-06

    申请号：US13968614

    申请日：2013-08-16

    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

    Inventor： Eun Sun CHUNG ,  Dae Bok OH ,  Jae Man PARK ,  Seung Ho LEE

    IPC: H01G4/018 ,  H01G4/01 ,  H05K1/18 ,  H01G4/30

    CPC classification number: H01G4/018 ,  H01G2/06 ,  H01G4/01 ,  H01G4/012 ,  H01G4/12 ,  H01G4/30 ,  H05K1/181

    Abstract: There is provided a multilayer ceramic electronic component comprising a ceramic body having a hexahedral shape, including dielectric layers, and satisfying T/W>1.0 when a length of the ceramic body is defined as L, a width of a lower surface thereof is defined as W, and a thickness thereof is defined as T, and first and second internal electrodes stacked in the ceramic body to face each other, having the respective dielectric layers therebetween, wherein the ceramic body includes an active layer and cover layers and in a case in which the active layer is divided into three regions in a thickness direction of the ceramic body, when an average thickness of the internal electrodes in an upper region and an average thickness of the internal electrodes in a lower region, based on a central region, are defined as to and tb, respectively, 0.751≦ta/tb≦0.913 is satisfied.

    Abstract translation: 提供了一种多层陶瓷电子部件，其包括具有六面体形状的陶瓷体，包括电介质层，并且当陶瓷体的长度被定义为L时，满足T / W> 1.0，其下表面的宽度被定义为 W，其厚度定义为T，并且第一和第二内部电极堆叠在陶瓷体中以彼此面对，其间具有各自的电介质层，其中陶瓷体包括有源层和覆盖层，并且在 其中当所述陶瓷体的厚度方向上的有源层被分成三个区域时，当在上部区域中的内部电极的平均厚度和基于中心区域的下部区域中的内部电极的平均厚度为 定义为和tb，分别满足0.751＆nlE; ta / tb＆nlE; 0.913。

    MULTILAYERED CERAMIC COMPONENT
    29.
    发明申请
    MULTILAYERED CERAMIC COMPONENT 有权
    多层陶瓷组件

    公开(公告)号：US20130321978A1

    公开(公告)日：2013-12-05

    申请号：US13910932

    申请日：2013-06-05

    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

    Inventor： Seung Ho LEE ,  Jong Han KIM ,  Eung Soo KIM

    IPC: H01G4/30

    CPC classification number: H01G4/30 ,  C04B35/468 ,  C04B2235/3224 ,  C04B2235/3225 ,  C04B2235/3227 ,  C04B2235/3229 ,  C04B2235/75 ,  C04B2235/78 ,  C04B2235/781 ,  C04B2235/785 ,  H01G4/0085 ,  H01G4/1227

    Abstract: Disclosed herein is a multilayered ceramic component having a structure in which internal electrode layers and dielectric layers are alternately multilayered, wherein the internal electrode layer includes 0.01 to 12 wt % of common material based on weight of metal powders, and an average particle size of the common material is 30 to 50% of an average particle size of a dielectric base material included in the dielectric layer. According to the first exemplary embodiment of the present invention, the particle size and the added amount of the common material squeezed out from the internal electrode layers at the time of firing thereof at a high temperature are controlled, thereby making it possible to improve the capacity and the reliability of the internal electrode.

    Abstract translation: 本发明公开了具有内部电极层和电介质层交替层叠的结构的多层陶瓷部件，其中，内部电极层包含基于金属粉末重量的0.01〜12重量％的普通材料，平均粒径为 普通材料是包含在电介质层中的电介质基材的平均粒径的30〜50％。 根据本发明的第一示例性实施例，控制在高温烧制时从内部电极层挤出的共同材料的粒径和添加量，从而可以提高容量 和内部电极的可靠性。

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