公开(公告)号：US20210327839A1

公开(公告)日：2021-10-21

申请号：US17361588

申请日：2021-06-29

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Jung-Hoon HAN ,  Dong-Wan KIM ,  Dongho KIM ,  Jaewon SEO

IPC: H01L23/00 ,  H01L21/66 ,  H01L21/67

Abstract: A semiconductor device includes a semiconductor substrate including a chip region and an edge region around the chip region, a lower insulating layer on the semiconductor substrate, a chip pad on the lower insulating layer on the chip region, an upper insulating layer provided on the lower insulating layer to cover the chip pad, the upper and different insulating layers including different materials, and a redistribution chip pad on the chip region and connected to the chip pad. The upper insulating layer includes a first portion on the chip region having a first thickness, a second portion on the edge region having a second thickness, and a third portion on the edge region, the third portion extending from the second portion, spaced from the first portion, and having a decreasing thickness away from the second portion. The second thickness is smaller than the first thickness.

公开(公告)号：US20210013139A1

公开(公告)日：2021-01-14

申请号：US16739931

申请日：2020-01-10

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Dongho KIM

IPC: H01L23/498 ,  H01L23/31 ,  H01L23/00

Abstract: A semiconductor package is provided. The semiconductor package includes a redistribution layer, a semiconductor chip, solder balls, an interposer, an encapsulant layer, and an underfill layer. The semiconductor chip is electrically connected to the redistribution layer, and disposed on an upper surface of the redistribution layer. The solder balls are disposed on the upper surface of the redistribution layer spaced apart from the semiconductor chip and are electrically connected to the redistribution layer. The interposer is electrically connected to the solder balls, and is disposed on an upper surface of the solder balls. The encapsulant layer encapsulates the semiconductor chip and side surfaces of the redistribution layer under the interposer. The underfill layer fills a space between a lower surface of the interposer and an upper surface of the encapsulant layer. The encapsulant layer includes a side surface encapsulant region surrounding the side surfaces of the redistribution layer.

公开(公告)号：US20250089127A1

公开(公告)日：2025-03-13

申请号：US18957065

申请日：2024-11-22

Applicant: Samsung Electronics Co., Ltd.

Inventor： Sohmann KIM ,  Heedeok KANG ,  Soohong KIM ,  Daewon MOON ,  Dongho KIM

IPC: H04W76/50 ,  H04L65/1016 ,  H04W4/14 ,  H04W4/90 ,  H04W48/16

Abstract: An electronic device is provided. The electronic device includes memory storing one or more computer programs, a communication circuit, and one or more processors communicatively coupled to the memory and the communication circuit, wherein the one or more computer programs include computer-executable instructions that, when executed by the one or more processors individually or collectively, cause the electronic device to detect, based on information related to a network to which the electronic device is connected, movement to a service area supporting an emergency call based on long-term evolution (LTE) communication, identify, based on the detection of the movement to the service area, whether an emergency call profile of the LTE communication, which corresponds to a home network of the electronic device, exists, in response to a determination that the emergency call profile of the LTE communication, which corresponds to the home network of the electronic device, does not exist, identify, based on connection information to the network to which the electronic device is connected, whether the network supports circuit switching (CS) communication, acquire, based on the determination that the network does not support CS communication, the emergency call profile of the LTE communication, which corresponds to the network to which the electronic device is connected, and provide, based on the emergency call profile of the LTE communication, which corresponds to the network, the emergency call based on the LTE communication.

公开(公告)号：US20250054813A1

公开(公告)日：2025-02-13

申请号：US18795805

申请日：2024-08-06

Applicant: SAMSUNG ELECTRONICS CO., LTD. ,  CHUNGBUK NATIONAL UNIVERSITY INDUSTRY-ACADEMIC COOPERATION FOUNDATION

Inventor： Kyungwook HWANG ,  Jaewook JEONG ,  Jonghyun JEONG ,  Minchul YU ,  Sanghoon SONG ,  Dongho KIM ,  Joonyong PARK ,  Youngtek OH ,  Junsik HWANG

IPC: H01L21/78 ,  H01L21/306 ,  H01L21/67 ,  H01L33/00 ,  H01L33/22

Abstract: Provided are a semiconductor chip, a method of preparing a semiconductor chip, and an apparatus for manufacturing a semiconductor chip. The method includes separating a semiconductor chip from a laminate, the laminate including a substrate, a lift-off layer on the substrate, and a semiconductor layer on the lift-off layer. The method further includes removing the lift-off layer with an etchant by applying a magnetic field while contacting the laminate and the etchant, to thereby prepare a semiconductor chip.

公开(公告)号：US20240178342A1

公开(公告)日：2024-05-30

申请号：US18198089

申请日：2023-05-16

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Youngtek OH ,  Kyungwook HWANG ,  Dongkyun KIM ,  Dongho KIM ,  Joonyong PARK ,  Sanghoon SONG ,  Minchul YU ,  Junsik HWANG

IPC: H01L33/00

CPC classification number: H01L33/005

Abstract: A chip wet-transferring device includes a chamber, a support member provided in the chamber and configured to support a transfer substrate, the transfer substrate including a plurality of grooves and on which a plurality of micro-semiconductor chips are disposed, and a magnetic field generator configured to remove a first micro-semiconductor chip from among the plurality of micro-semiconductor chips that is disposed on the transfer substrate and at least partially outside of the plurality of grooves on the transfer substrate by generating a magnetic field that moves the first micro-semiconductor chip in a direction substantially parallel with an upper surface of the transfer substrate.

公开(公告)号：US20240006563A1

公开(公告)日：2024-01-04

申请号：US18084186

申请日：2022-12-19

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Hyunjoon KIM ,  Seogwoo HONG ,  Dongkyun KIM ,  Dongho KIM ,  Joonyong Park ,  Sanghoon SONG ,  Kyungwook Hwang ,  Junsik HWANG

IPC: H01L33/48 ,  H01L33/62 ,  H01L25/075

CPC classification number: H01L33/486 ,  H01L33/62 ,  H01L25/0753 ,  H01L2933/0066

Abstract: Disclosed are a method of transferring semiconductor chips. The method may include providing a first substrate, adhering a support substrate to the first substrate, supplying and aligning a plurality of semiconductor chips, partially adhering a second substrate to a first surface of the first substrate, separating the support substrate from the first substrate, and adhering the plurality of semiconductor chips to the second substrate by supplying a fluid to a periphery of a second surface of the first substrate and applying a pressure to the second surface.

公开(公告)号：US20240006554A1

公开(公告)日：2024-01-04

申请号：US18215377

申请日：2023-06-28

Applicant: SAMSUNG ELECTRONICS CO., LTD. ,  SEOUL NATIONAL UNIVERSITY R&DB FOUNDATION

Inventor： Dongho KIM ,  Ho Won JANG ,  Kyungwook HWANG ,  Junsik HWANG ,  Sohyeon PARK ,  Jehong OH ,  Jungel RYU

IPC: H01L33/24 ,  H01L33/38 ,  H01L33/40 ,  H01L33/42 ,  H01L33/08

CPC classification number: H01L33/24 ,  H01L33/385 ,  H01L33/382 ,  H01L33/405 ,  H01L33/42 ,  H01L33/08

Abstract: A light-emitting device may include a plurality of light-emitting rods. Each of the plurality of light-emitting rods may include a first semiconductor layer having a rod shape, an active layer having a shell shape disposed about a plurality of surfaces of the first semiconductor layer, and a second semiconductor layer having a shell shape disposed about a plurality of surfaces of the active layer. The light emitting device may further include an insulating layer disposed in spaces between the plurality of light-emitting rods; a transparent electrode electrically connected to the first semiconductor layer of each of the plurality of light-emitting rods; and a reflective electrode electrically connected to the second semiconductor layer of each of the plurality of light-emitting rods.

公开(公告)号：US20220359439A1

公开(公告)日：2022-11-10

申请号：US17564689

申请日：2021-12-29

Applicant: Samsung Electronics Co., Ltd.

Inventor： Eunsu LEE ,  Dongho KIM ,  Jiyong PARK ,  Jeonghyun LEE

IPC: H01L23/00 ,  H01L23/48 ,  H01L25/065

Abstract: A semiconductor package includes a first semiconductor chip including a first bonding pad on a first surface of a first substrate, a first through electrode penetrating through the first substrate and electrically connected to the first bonding pad, a first recess with a desired depth in the first substrate from a second surface of the first substrate and exposing an end portion of the first through electrode, and a second bonding pad in the first recess and electrically connected to the first through electrode, a second semiconductor chip stacked on the second surface of the first substrate and including a third bonding pad on a third surface of a second substrate, and a conductive connection member between the second bonding pad and the third bonding pad. At least a portion of the conductive connection member may be in the first recess.

公开(公告)号：US20220262784A1

公开(公告)日：2022-08-18

申请号：US17667241

申请日：2022-02-08

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Kyungwook HWANG ,  Junsik HWANG ,  Dongho KIM ,  Hyunjoon KIM ,  Joonyong PARK ,  Seogwoo HONG

IPC: H01L25/00 ,  H01L27/15 ,  H01L25/16

Abstract: Provided is a method of fabricating a hybrid element, the method including forming a plurality of first elements on a first substrate, separating a plurality of second elements grown on a second substrate from the second substrate, a material of the second substrate being different from a material of the first substrate, and transferring the plurality of second elements, separated from the second substrate, onto the first substrate, wherein, in the transferring, the plurality of second elements are spaced apart from each other by a fluidic self-assembly method, and wherein each of the plurality of second elements includes a shuttle layer grown on the second substrate, an element layer grown on the shuttle layer, and an electrode layer on the element layer.

公开(公告)号：US20220109022A1

公开(公告)日：2022-04-07

申请号：US17227981

申请日：2021-04-12

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Junhee CHOI ,  Kiho KONG ,  Nakhyun KIM ,  Dongho KIM ,  Junghun PARK ,  Jinjoo PARK ,  Eunsung LEE ,  Joohun HAN

IPC: H01L27/15

Abstract: A micro light-emitting display apparatus and a method of manufacturing the same are disclosed The micro light-emitting display apparatus includes a first semiconductor layer, an isolation structure provided on the first semiconductor layer and configured to define a plurality of sub-pixels each configured to emit light, a first light-emitting unit including a first active layer provided in a first sub-pixel among the plurality of sub-pixels, and a second semiconductor layer provided on the first active layer, and a second light-emitting unit including a rod semiconductor layer provided in a second sub-pixel among the plurality of sub-pixels, a second active layer provided on the rod semiconductor layer, and a third semiconductor layer provided on the second active layer. The first active layer is configured to emit blue light and the second active layer is configured to emit green light.