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公开(公告)号:US20180350997A1
公开(公告)日:2018-12-06
申请号:US16044600
申请日:2018-07-25
Applicant: Semiconductor Energy Laboratory Co., Ltd.
Inventor: Tetsuhiro TANAKA , Mitsuhiro ICHIJO , Toshiya ENDO , Akihisa SHIMOMURA , Yuji EGI , Sachiaki TEZUKA , Shunpei YAMAZAKI
IPC: H01L29/786 , H01L29/423 , H01L29/49
CPC classification number: H01L29/7869 , H01L29/42384 , H01L29/4908 , H01L29/78606 , H01L29/78648
Abstract: A transistor with stable electrical characteristics. A semiconductor device includes a first insulator over a substrate, a second insulator over the first insulator, an oxide semiconductor in contact with at least part of a top surface of the second insulator, a third insulator in contact with at least part of a top surface of the oxide semiconductor, a first conductor and a second conductor electrically connected to the oxide semiconductor, a fourth insulator over the third insulator, a third conductor which is over the fourth insulator and at least part of which is between the first conductor and the second conductor, and a fifth insulator over the third conductor. The first insulator contains a halogen element.
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公开(公告)号:US20180182899A1
公开(公告)日:2018-06-28
申请号:US15900845
申请日:2018-02-21
Applicant: Semiconductor Energy Laboratory Co., Ltd.
Inventor: Yuta ENDO , Hideomi SUZAWA , Sachiaki TEZUKA , Tetsuhiro TANAKA , Toshiya ENDO , Mitsuhiro ICHIJO
IPC: H01L29/786 , H01L29/66 , H01L21/8258 , H01L29/423 , H01L27/12 , H01L27/092 , H01L27/06 , H01L29/49
CPC classification number: H01L29/78648 , H01L21/8258 , H01L27/0688 , H01L27/092 , H01L27/1207 , H01L27/1225 , H01L29/42384 , H01L29/4908 , H01L29/66742 , H01L29/66969 , H01L29/78651 , H01L29/7869 , H01L29/78696
Abstract: A miniaturized transistor is provided. A first layer is formed over a third insulator over a semiconductor; a second layer is formed over the first layer; an etching mask is formed over the second layer; the second layer is etched using the etching mask until the first layer is exposed to form a third layer; a selective growth layer is formed on a top surface and a side surface of the third layer; the first layer is etched using the third layer and the selective growth layer until the third insulator is exposed to form a fourth layer; and the third insulator is etched using the third layer, the selective growth layer, and the fourth layer until the semiconductor is exposed to form a first insulator.
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公开(公告)号:US20170186779A1
公开(公告)日:2017-06-29
申请号:US15390894
申请日:2016-12-27
Applicant: Semiconductor Energy Laboratory Co., Ltd.
Inventor: Daigo ITO , Takahisa ISHIYAMA , Katsuaki TOCHIBAYASHI , Yoshinori ANDO , Yasutaka SUZUKI , Mitsuhiro ICHIJO , Toshiya ENDO , Shunpei YAMAZAKI
IPC: H01L27/12 , H01L29/786 , H01L29/49
CPC classification number: H01L27/1225 , H01L27/124 , H01L27/1248 , H01L27/1255 , H01L29/24 , H01L29/4908 , H01L29/7781 , H01L29/7782 , H01L29/7786 , H01L29/7869 , H01L2224/05 , H01L2224/48463
Abstract: A highly reliable semiconductor device which includes an oxide semiconductor is provided. Alternatively, a transistor having normally-off characteristics which includes an oxide semiconductor is provided. The transistor includes a first conductor, a first insulator, a second insulator, a third insulator, a first oxide, an oxide semiconductor, a second conductor, a second oxide, a fourth insulator, a third conductor, a fourth conductor, a fifth insulator, and a sixth insulator. The second conductor is separated from the sixth insulator by the second oxide. The third conductor and the fourth conductor are separated from the sixth insulator by the fifth insulator. The second oxide has a function of suppressing permeation of oxygen as long as oxygen contained in the sixth insulator is sufficiently supplied to the oxide semiconductor through the second oxide. The fifth insulator has a barrier property against oxygen.
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公开(公告)号:US20170033234A1
公开(公告)日:2017-02-02
申请号:US15293434
申请日:2016-10-14
Applicant: Semiconductor Energy Laboratory Co., Ltd.
Inventor: Kunio KIMURA , Mitsuhiro ICHIJO , Toshiya ENDO
IPC: H01L29/786 , H01L29/66 , H01L27/146 , H01L29/423 , H01L27/12
Abstract: One object is to provide a semiconductor device including an oxide semiconductor, which has stable electric characteristics and high reliability. Another object is to manufacture a highly reliable semiconductor device in a high yield. In a top-gate staggered transistor including an oxide semiconductor film, as a first gate insulating film in contact with the oxide semiconductor film, a silicon oxide film is formed by a plasma CVD method with use of a deposition gas containing silicon fluoride and oxygen; and as a second gate insulating film stacked over the first gate insulating film, a silicon oxide film is formed by a plasma CVD method with use of a deposition gas containing silicon hydride and oxygen.
Abstract translation: 一个目的是提供一种具有稳定的电特性和高可靠性的氧化物半导体的半导体装置。 另一个目的是以高产量制造高度可靠的半导体器件。 在包括氧化物半导体膜的顶栅交错晶体管中,作为与氧化物半导体膜接触的第一栅极绝缘膜,通过使用含有氟化硅和氧的沉积气体的等离子体CVD法形成氧化硅膜; 并且作为层叠在第一栅极绝缘膜上的第二栅极绝缘膜,通过使用含有氢化硅和氧的沉积气体的等离子体CVD法形成氧化硅膜。
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公开(公告)号:US20140001470A1
公开(公告)日:2014-01-02
申请号:US14018712
申请日:2013-09-05
Applicant: Semiconductor Energy Laboratory Co., Ltd.
Inventor: Mitsuhiro ICHIJO , Toshiya ENDO , Kunihiko SUZUKI
IPC: H01L29/786
CPC classification number: H01L29/7869 , H01L21/02565 , H01L21/441 , H01L21/477 , H01L29/247 , H01L29/42384 , H01L29/47 , H01L29/4908 , H01L29/495 , H01L29/66969 , H01L29/78606 , H01L29/78696
Abstract: An object is to provide a semiconductor device having good electrical characteristics. A gate insulating layer having a hydrogen concentration less than 6×1020 atoms/cm3 and a fluorine concentration greater than or equal to 1×1020 atoms/cm3 is used as a gate insulating layer in contact with an oxide semiconductor layer forming a channel region, so that the amount of hydrogen released from the gate insulating layer can be reduced and diffusion of hydrogen into the oxide semiconductor layer can be prevented. Further, hydrogen present in the oxide semiconductor layer can be eliminated with the use of fluorine; thus, the hydrogen content in the oxide semiconductor layer can be reduced. Consequently, the semiconductor device having good electrical characteristics can be provided.
Abstract translation: 目的在于提供具有良好电气特性的半导体器件。 使用具有小于6×1020原子/ cm3的氢浓度和大于或等于1×1020原子/ cm3的氟浓度的栅极绝缘层作为与形成沟道区的氧化物半导体层接触的栅极绝缘层, 从而可以减少从栅极绝缘层释放的氢的量,并且可以防止氢向氧化物半导体层的扩散。 此外,可以通过使用氟来消除存在于氧化物半导体层中的氢; 因此,可以降低氧化物半导体层中的氢含量。 因此,可以提供具有良好电特性的半导体器件。
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