公开(公告)号：US20160013469A1

公开(公告)日：2016-01-14

申请号：US14751443

申请日：2015-06-26

Applicant: Semiconductor Energy Laboratory Co., LTD.

Inventor： Ryota TAJIMA ,  Yuugo GOTO ,  Yumiko YONEDA ,  Junya GOTO ,  Takuya MIWA ,  Masaaki HIROKI

IPC: H01M4/13 ,  H01M4/70 ,  H01M10/0525 ,  H01M2/02 ,  H01M4/66

CPC classification number: H01M4/13 ,  H01M2/0275 ,  H01M4/139 ,  H01M10/0525 ,  H01M2002/0205 ,  H01M2004/021 ,  H01M2220/20 ,  H01M2220/30 ,  Y02E60/122

Abstract: An electronic device having a novel structure, specifically, an electronic device having a novel structure that can be changed into various appearances is provided. Specifically, after an active material layer is formed on one or both surfaces of a current collector, the active material layer in a bent region is partly removed. The removed region of the active material layer can be in a linear shape, a dot shape, or a matrix shape, for example. After the active material layer is formed on one or both surfaces of the current collector, laser processing for removing part of the active material layer in an irradiation region is performed using laser light or the like. On the region where the surface of the current collector is exposed, the active material layer is not provided, and this region is a region that does not function as a battery. Owing to this region, a secondary battery with a wide movable region can be achieved.

Abstract translation: 提供具有新颖结构的电子装置，具体地说，具有可以改变为各种外观的新颖结构的电子装置。 具体地说，在集电体的一个或两个表面上形成活性物质层之后，部分除去弯曲区域中的活性物质层。 活性物质层的去除区域例如可以是直线形状，点状或矩阵形状。 在集电体的一个或两个表面上形成活性物质层之后，使用激光等进行用于去除照射区域中的活性物质层的一部分的激光加工。 在集电体的表面暴露的区域，没有设置活性物质层，该区域是不能充当电池的区域。 由于该区域，可以实现具有宽移动区域的二次电池。

公开(公告)号：US20140347490A1

公开(公告)日：2014-11-27

申请号：US14457140

申请日：2014-08-12

Applicant: SEMICONDUCTOR ENERGY LABORATORY CO., LTD.

Inventor： Toru TAKAYAMA ,  Junya MARUYAMA ,  Yuugo GOTO ,  Hideaki KUWABARA ,  Shunpei YAMAZAKI

IPC: B60R1/00 ,  B60R11/02 ,  B60R11/04

CPC classification number: H01L27/1266 ,  B60R1/00 ,  B60R11/0229 ,  B60R11/04 ,  B60R2011/004 ,  B60R2300/202 ,  B60R2300/802 ,  H01L21/6835 ,  H01L21/76251 ,  H01L27/1218 ,  H01L27/3244 ,  H01L2221/68318 ,  H01L2221/6835 ,  H01L2221/68363 ,  H01L2221/68386 ,  H01L2227/323 ,  H01L2227/326

Abstract: To provide a semiconductor device in which a layer to be peeled is attached to a base having a curved surface, and a method of manufacturing the same, and more particularly, a display having a curved surface, and more specifically a light-emitting device having a light emitting element attached to a base with a curved surface. A layer to be peeled, which contains a light emitting element furnished to a substrate using a laminate of a first material layer which is a metallic layer or nitride layer, and a second material layer which is an oxide layer, is transferred onto a film, and then the film and the layer to be peeled are curved, to thereby produce a display having a curved surface.

Abstract translation: 为了提供其中将要剥离的层附着到具有曲面的基底的半导体器件及其制造方法，更具体地，涉及具有弯曲表面的显示器，更具体地说，具有如下的发光器件，其具有 附着到具有弯曲表面的基部的发光元件。 将包含使用层叠金属层或氮化物层的第一材料层的层叠体和作为氧化物层的第二材料层而设置在基板上的发光元件的剥离层转印到膜上， 然后将膜和要剥离的层弯曲，从而产生具有弯曲表面的显示器。

公开(公告)号：US20140339564A1

公开(公告)日：2014-11-20

申请号：US14450927

申请日：2014-08-04

Applicant: Semiconductor Energy Laboratory Co., Ltd.

Inventor： Shunpei YAMAZAKI ,  Toru TAKAYAMA ,  Junya MARUYAMA ,  Yuugo GOTO ,  Yumiko OHNO

IPC: H01L21/70 ,  H01L21/324 ,  H01L27/15 ,  H01L21/28 ,  H01L21/02 ,  H01L21/8234 ,  H01L33/00 ,  H01L21/425

CPC classification number: H01L27/1218 ,  H01L21/02175 ,  H01L21/28008 ,  H01L21/324 ,  H01L21/425 ,  H01L21/707 ,  H01L21/823487 ,  H01L27/1214 ,  H01L27/1266 ,  H01L27/156 ,  H01L27/3244 ,  H01L29/78603 ,  H01L33/005 ,  H01L33/0054 ,  H01L51/003 ,  H01L51/56 ,  H01L2221/68368 ,  H01L2227/326 ,  H01L2933/0016

Abstract: The present invention provides a simplifying method for a peeling process as well as peeling and transcribing to a large-size substrate uniformly. A feature of the present invention is to peel a first adhesive and to cure a second adhesive at the same time in a peeling process, thereby to simplify a manufacturing process. In addition, the present invention is to devise the timing of transcribing a peel-off layer in which up to an electrode of a semiconductor are formed to a predetermined substrate. In particular, a feature is that peeling is performed by using a pressure difference in the case that peeling is performed with a state in which plural semiconductor elements are formed on a large-size substrate.

Abstract translation: 本发明提供了一种剥离方法的简化方法以及均匀地剥离和转录到大尺寸基板。 本发明的一个特征是剥离第一粘合剂并在剥离过程中同时固化第二粘合剂，从而简化制造过程。 另外，本发明是为了将形成半导体的电极的剥离层转印为规定的基板的时机。 特别地，特征在于，在大尺寸基板上形成有多个半导体元件的状态下进行剥离的情况下，通过使用压差来进行剥离。

公开(公告)号：US20140060728A1

公开(公告)日：2014-03-06

申请号：US14074063

申请日：2013-11-07

Applicant: Semiconductor Energy Laboratory Co., Ltd.

Inventor： Akio YAMASHITA ,  Yumiko FUKUMOTO ,  Yuugo GOTO

IPC: G02F1/1333

CPC classification number: H01L33/005 ,  G02F1/1333 ,  G02F1/133305 ,  H01L27/1214 ,  H01L27/1266 ,  H01L27/15 ,  H01L27/322 ,  H01L27/3244 ,  H01L51/003 ,  H01L51/524 ,  H01L51/56 ,  H01L2227/326 ,  H01L2933/0025

Abstract: To provide a method of manufacturing a display device having an excellent impact resistance property with high yield, in particular, a method of manufacturing a display device having an optical film that is formed using a plastic substrate. The method of manufacturing a display device includes the steps of: laminating a metal film, an oxide film, and an optical filter on a first substrate; separating the optical filter from the first substrate; attaching the optical filter to a second substrate; forming a layer including a pixel on a third substrate; and attaching the layer including the pixel to the optical filter.

Abstract translation: 为了提供一种以高产率制造具有优异抗冲击性能的显示装置的方法，特别是制造具有使用塑料基板形成的光学膜的显示装置的方法。 制造显示装置的方法包括以下步骤：在第一基板上层压金属膜，氧化物膜和滤光器; 将所述滤光器与所述第一基板分离; 将所述滤光器附接到第二基板; 在第三基板上形成包括像素的层; 以及将包括像素的层附着到滤光器。

公开(公告)号：US20130306948A1

公开(公告)日：2013-11-21

申请号：US13950990

申请日：2013-07-25

Applicant: Semiconductor Energy Laboratory Co., Ltd.

Inventor： Shunpei YAMAZAKI ,  Toru TAKAYAMA ,  Junya MARUYAMA ,  Yuugo GOTO ,  Yumiko OHNO

IPC: H01L51/56

CPC classification number: H01L27/1218 ,  H01L21/02175 ,  H01L21/28008 ,  H01L21/324 ,  H01L21/425 ,  H01L21/707 ,  H01L21/823487 ,  H01L27/1214 ,  H01L27/1266 ,  H01L27/156 ,  H01L27/3244 ,  H01L29/78603 ,  H01L33/005 ,  H01L33/0054 ,  H01L51/003 ,  H01L51/56 ,  H01L2221/68368 ,  H01L2227/326 ,  H01L2933/0016

Abstract: The present invention provides a simplifying method for a peeling process as well as peeling and transcribing to a large-size substrate uniformly. A feature of the present invention is to peel a first adhesive and to cure a second adhesive at the same time in a peeling process, thereby to simplify a manufacturing process. In addition, the present invention is to devise the timing of transcribing a peel-off layer in which up to an electrode of a semiconductor are formed to a predetermined substrate. In particular, a feature is that peeling is performed by using a pressure difference in the case that peeling is performed with a state in which plural semiconductor elements are formed on a large-size substrate.