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    TESTING APPARATUS AND TESTING METHOD
    21.
    发明申请
    TESTING APPARATUS AND TESTING METHOD 审中-公开
    测试装置和测试方法

    公开(公告)号：US20140184261A1

    公开(公告)日：2014-07-03

    申请号：US14056214

    申请日：2013-10-17

    Applicant: Siliconware Precision Industries Co., Ltd.

    Inventor： Chia-Chu Lai ,  Ming-Fan Tsai ,  Ho-Chuan Lin ,  Min-Han Chuang ,  Bo-Shiang Fang

    IPC: G01R1/04

    CPC classification number: G01R1/0466

    Abstract: A testing method is provided, including providing a testing apparatus including a carrier member and a testing element, the carrier member comprising a first surface, a second surface opposing the first surface, and an elastic conductive area defined on the first surface; disposing an object-to-be-tested on the elastic conductive area; electrically connecting the testing element to the object-to-be-tested and the carrier member, to form an electric loop among the carrier member, the object-to-be-tested and the testing element. Through the design of the elastic conductive area, the object-to-be-tested can be secured with a small pressure applied thereto, and is prevented from being cracked.

    Abstract translation: 提供了一种测试方法，包括提供包括载体构件和测试元件的测试装置，所述载体构件包括第一表面，与第一表面相对的第二表面和限定在第一表面上的弹性导电区域; 在弹性导电区域上设置待测物体; 将测试元件电连接到待测对象和载体构件，以在载体构件，待测对象和测试元件之间形成电循环。 通过弹性导电区域的设计，可以用施加在其上的小的压力来确保待测对象，并且防止被破坏。

    Electronic package and manufacturing method thereof
    22.
    发明授权
    Electronic package and manufacturing method thereof 有权

    公开(公告)号：US12293952B2

    公开(公告)日：2025-05-06

    申请号：US18659692

    申请日：2024-05-09

    Applicant: SILICONWARE PRECISION INDUSTRIES CO., LTD.

    Inventor： Ho-Chuan Lin ,  Min-Han Chuang ,  Chia-Chu Lai

    IPC: H01L23/31 ,  H01L21/56 ,  H01L23/00 ,  H01L23/528

    Abstract: An electronic package is provided, in which an electronic component with a conductive layer on an outer surface thereof is embedded in an encapsulant, where at least one electrode pad is disposed on an active surface of the electronic component, and at least one wire electrically connected to the electrode pad is arranged inside the electronic component, so that the conductive layer is electrically connected to the wire, such that the electrode pad, the wire and the conductive layer are used as a power transmission structure which serves as a current path to reduce DC resistance and improve an impedance issue associated with the supply of power.

    FABRICATION METHOD OF SEMICONDUCTOR SUBSTRATE
    27.
    发明申请
    FABRICATION METHOD OF SEMICONDUCTOR SUBSTRATE 审中-公开

    公开(公告)号：US20170271251A1

    公开(公告)日：2017-09-21

    申请号：US15612390

    申请日：2017-06-02

    Applicant: Siliconware Precision Industries Co., Ltd.

    Inventor： Bo-Shiang Fang ,  Ho-Chuan Lin ,  Chia-Chu Lai ,  Min-Han Chuang ,  Li-Fang Lin

    IPC: H01L23/498 ,  H01L23/14 ,  H01L21/768 ,  H01L23/13

    Abstract: A semiconductor substrate is disclosed. The semiconductor substrate includes a substrate body having at least an opening formed on a surface thereof, wherein the surface of the substrate body and a wall of the opening are made of an insulating material; and a circuit layer formed on the surface of the substrate body, wherein the circuit layer covers an end of the opening and is electrically insulated from the opening. The opening facilitates to increase the thickness of the insulating structure between the circuit layer and the substrate body of a silicon material to prevent signal degradation when high frequency signals are applied to the circuit layer.

    Duplexer, circuit structure thereof and RF transceiver apparatus comprising the duplexer
    28.
    发明授权
    Duplexer, circuit structure thereof and RF transceiver apparatus comprising the duplexer 有权
    双工器，其电路结构和包括双工器的RF收发器设备

    公开(公告)号：US09503043B2

    公开(公告)日：2016-11-22

    申请号：US13875550

    申请日：2013-05-02

    Applicant: Siliconware Precision Industries Co., Ltd.

    Inventor： Min-Han Chuang ,  Chia-Chu Lai ,  Bo-Shiang Fang ,  Ho-Chuan Lin ,  Yen-Yu Chen

    IPC: H03H7/46 ,  H03H7/09 ,  H03H7/01 ,  H03H1/00

    CPC classification number: H03H7/463 ,  H03H7/09 ,  H03H7/1775 ,  H03H7/1783 ,  H03H2001/0064 ,  H03H2001/0078

    Abstract: A duplexer is provided, which includes a first, a second and a third signal ports; a first filter and a second filter. The first filter has first, second, and third resonant circuits that have first, second and third inductors, respectively. The first, second and third inductors are mutually inductive. The first and third resonant circuits are electrically connected to the first and second signal ports, respectively. The second filter has fourth, fifth and sixth resonant circuits that have fourth, fifth and sixth inductors, respectively. The fourth resonant circuit is connected in series with the first resonant circuit. The fifth inductor and the fourth inductor are mutually inductive. The sixth resonant circuit is electrically connected to the third signal port. The second filter further has a main capacitor connected in series with the fifth and sixth resonant circuits respectively and located therebetween.

    Abstract translation: 提供了一种双工器，其包括第一，第二和第三信号端口; 第一过滤器和第二过滤器。 第一滤波器具有分别具有第一，第二和第三电感器的第一，第二和第三谐振电路。 第一，第二和第三电感器是互感的。 第一和第三谐振电路分别电连接到第一和第二信号端口。 第二滤波器具有分别具有第四，第五和第六电感器的第四，第五和第六谐振电路。 第四谐振电路与第一谐振电路串联连接。 第五电感器和第四电感器是互感的。 第六谐振电路与第三信号端口电连接。 第二滤波器还具有分别与第五和第六谐振电路串联连接的主电容器，并位于它们之间。

    SUBSTRATE STRUCTURE
    29.
    发明申请
    SUBSTRATE STRUCTURE 审中-公开
    基板结构

    公开(公告)号：US20160240302A1

    公开(公告)日：2016-08-18

    申请号：US14981184

    申请日：2015-12-28

    Applicant: Siliconware Precision Industries Co., Ltd.

    Inventor： Ming-Fan Tsai ,  Ho-Chuan Lin ,  Ying-Wei Lu

    IPC: H01F27/28 ,  H01F1/04

    CPC classification number: H01F17/0006 ,  H01F1/24 ,  H01F2017/0046 ,  H01F2017/0066 ,  H01F2017/0073

    Abstract: A substrate structure is provided, which includes: a first dielectric layer having a magnetic material; a circuit layer having an inductor circuit and a plurality of conductive traces; and a second dielectric layer bonded to the first dielectric layer and encapsulating the circuit layer. As such, the inductance value of the inductor circuit is increased due to the magnetic material of the first dielectric layer, thereby eliminating the need to increase the number of coils of the inductor circuit.

    Abstract translation: 提供一种基板结构，其包括：具有磁性材料的第一介电层; 具有电感器电路和多个导电迹线的电路层; 以及结合到第一介电层并封装电路层的第二电介质层。 因此，由于第一介电层的磁性材料，电感电路的电感值增加，从而不需要增加电感器电路的线圈数。

    Balanced-to-unbalanced converter
    30.
    发明授权
    Balanced-to-unbalanced converter 有权
    平衡到不平衡转换器

    公开(公告)号：US09148113B2

    公开(公告)日：2015-09-29

    申请号：US13644507

    申请日：2012-10-04

    Applicant: Siliconware Precision Industries Co., Ltd.

    Inventor： Ming-Fan Tsai ,  Hsin-Hung Lee ,  Chia-Chu Lai ,  Yen-Yu Chen ,  Ho-Chuan Lin

    IPC: H03H7/42

    CPC classification number: H03H7/42

    Abstract: A balanced-to-unbalanced converter (balun) is provided, including: a converting circuit having a first processing circuit including a first inductor and a first capacitor connected in series, a second processing circuit including a second capacitor and a second inductor connected in series, the second capacitor being electrically connected to the first inductor, and two balanced output ends connected to the first processing circuit and the second processing circuit, respectively; and a preprocessing circuit connected to the converting circuit and including an unbalanced input end for converting real impedance at the unbalanced input end into complex impedance at the balanced output ends. Accordingly, the balun satisfies the need of the wireless communication chips by providing differential signals with complex impedance. This is done by employing the preprocessing circuit in conjunction with the converting circuit to convert an unbalanced signal with real impedance into a balanced signal with complex impedance.

    Abstract translation: 提供了一种平衡 - 不平衡转换器（balun），包括：具有第一处理电路的转换电路，包括第一电感器和串联连接的第一电容器，第二处理电路包括串联连接的第二电容器和第二电感器 所述第二电容器电连接到所述第一电感器，以及两个平衡输出端分别连接到所述第一处理电路和所述第二处理电路; 以及连接到转换电路并且包括用于将不平衡输入端处的实际阻抗转换成平衡输出端的复阻抗的不平衡输入端的预处理电路。 因此，平衡 - 不平衡变压器通过提供具有复阻抗的差分信号来满足无线通信芯片的需要。 这通过使用预处理电路与转换电路结合来实现，将具有实际阻抗的不平衡信号转换成具有复阻抗的平衡信号。

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