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公开(公告)号：US11476572B2
公开(公告)日：2022-10-18
申请号：US16750459
申请日：2020-01-23
发明人： Chih-Yuan Shih , Chih-Hsien Chiu , Yueh-Chiung Chang , Tsung-Li Lin , Chi-Pin Tsai , Chien-Cheng Lin , Tsung-Hsien Tsai , Heng-Cheng Chu , Ming-Fan Tsai
IPC分类号： H01Q1/52 , H01Q9/42 , H01Q1/24 , H01L21/56 , H01L23/31 , H01L23/498 , H01L23/552 , H01L23/66 , H01Q1/22 , H01Q1/48
摘要： An electronic package structure is provided, including a substrate with an electronic component, an antenna element and a shielding element disposed on the substrate. The shielding element is positioned between the antenna element and the electronic component to prevent electromagnetic interference (EMI) from occurring between the antenna element and the electronic component. A method for fabricating the electronic package structure is also provided.
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公开(公告)号：US10587041B2
公开(公告)日：2020-03-10
申请号：US15596113
申请日：2017-05-16
发明人： Chih-Yuan Shih , Chih-Hsien Chiu , Yueh-Chiung Chang , Tsung-Li Lin , Chi-Pin Tsai , Chien-Cheng Lin , Tsung-Hsien Tsai , Heng-Cheng Chu , Ming-Fan Tsai
IPC分类号： H01L23/552 , H01Q1/52 , H01Q9/42 , H01Q1/24 , H01L21/56 , H01L23/31 , H01L23/498 , H01L23/66 , H01Q1/22 , H01Q1/48
摘要： An electronic package structure is provided, including a substrate with an electronic component, an antenna element and a shielding element disposed on the substrate. The shielding element is positioned between the antenna element and the electronic component to prevent electromagnetic interference (EMI) from occurring between the antenna element and the electronic component. A method for fabricating the electronic package structure is also provided.
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3.发明申请公开(公告)号：US20170194238A1
公开(公告)日：2017-07-06
申请号：US15069387
申请日：2016-03-14
IPC分类号： H01L23/498 , H01L21/56 , H01L21/306 , H01L21/48 , H01L21/304
CPC分类号： H01L23/49827 , H01L21/304 , H01L21/306 , H01L21/486 , H01L21/563 , H01L23/3128 , H01L23/49811 , H01L23/49833 , H01L2224/16225
摘要： A substrate structure is provided, which includes: a substrate body having a first surface and a second surface opposite to the first surface; and a plurality of conductive posts disposed on the first surface of the substrate body and electrically connected to the substrate body. By replacing conventional through silicon vias (TSVs) with the conductive posts, the present disclosure greatly reduces the fabrication cost. The present disclosure further provides an electronic package having the substrate structure and a method for fabricating the electronic package.
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公开(公告)号：US10096541B2
公开(公告)日：2018-10-09
申请号：US15666005
申请日：2017-08-01
IPC分类号： H01L23/00 , H01L23/498 , H01L21/56 , H01L21/306 , H01L21/304 , H01L21/48
摘要： A substrate structure is provided, which includes: a substrate body having a first surface and a second surface opposite to the first surface; and a plurality of conductive posts disposed on the first surface of the substrate body and electrically connected to the substrate body. By replacing conventional through silicon vias (TSVs) with the conductive posts, the present disclosure greatly reduces the fabrication cost. The present disclosure further provides an electronic package having the substrate structure and a method for fabricating the electronic package.
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5.发明授权公开(公告)号：US09754868B2
公开(公告)日：2017-09-05
申请号：US15069387
申请日：2016-03-14
IPC分类号： H01L21/50 , H01L23/498 , H01L21/48 , H01L21/304 , H01L21/306 , H01L21/56
CPC分类号： H01L23/49827 , H01L21/304 , H01L21/306 , H01L21/486 , H01L21/563 , H01L23/3128 , H01L23/49811 , H01L23/49833 , H01L2224/16225
摘要： A substrate structure is provided, which includes: a substrate body having a first surface and a second surface opposite to the first surface; and a plurality of conductive posts disposed on the first surface of the substrate body and electrically connected to the substrate body. By replacing conventional through silicon vias (TSVs) with the conductive posts, the present disclosure greatly reduces the fabrication cost. The present disclosure further provides an electronic package having the substrate structure and a method for fabricating the electronic package.
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公开(公告)号：US20200161756A1
公开(公告)日：2020-05-21
申请号：US16750459
申请日：2020-01-23
发明人： Chih-Yuan Shih , Chih-Hsien Chiu , Yueh-Chiung Chang , Tsung-Li Lin , Chi-Pin Tsai , Chien-Cheng Lin , Tsung-Hsien Tsai , Heng-Cheng Chu , Ming-Fan Tsai
IPC分类号： H01Q1/52 , H01Q1/48 , H01Q1/22 , H01L23/66 , H01L23/552 , H01L23/498 , H01L23/31 , H01L21/56 , H01Q1/24 , H01Q9/42
摘要： An electronic package structure is provided, including a substrate with an electronic component, an antenna element and a shielding element disposed on the substrate. The shielding element is positioned between the antenna element and the electronic component to prevent electromagnetic interference (EMI) from occurring between the antenna element and the electronic component. A method for fabricating the electronic package structure is also provided.
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公开(公告)号：US09058971B2
公开(公告)日：2015-06-16
申请号：US13905703
申请日：2013-05-30
发明人： Chih-Yuan Shih , Shih-Liang Peng , Jung-Pin Huang , Chin-Yu Ku , Hsien-Wen Chen
IPC分类号： H01L27/15 , H01L29/26 , H01L31/12 , H01L33/00 , H01L25/00 , H01S5/022 , H01S5/024 , H01S5/062 , H01S5/42
CPC分类号： H01L25/00 , H01L2224/48091 , H01S5/02252 , H01S5/0226 , H01S5/02276 , H01S5/02288 , H01S5/02469 , H01S5/06226 , H01S5/423 , H01L2924/00014
摘要： An electro-optical module is provided, which includes: a substrate having a first surface with a groove and an opposite second surface; a plurality of support members disposed on the first surface of the substrate; at least an electro-optical element having opposite active and non-active surfaces and disposed in the groove of the substrate via the non-active surface thereof; an interposer disposed on the first surface of the substrate and the electro-optical element for electrically connecting the electro-optical element to the substrate, wherein the interposer has a through hole corresponding in position to the active surface of the electro-optical element; and a transparent plate disposed over the first surface of the substrate and the interposer through the support members and having a lens portion corresponding in position to the through hole of the interposer, thereby reducing signal losses, improving alignment precision, and achieving preferred thermal dissipation and EMI shielding effects.
摘要翻译： 提供了一种电光模块，其包括：具有第一表面和第二表面的基板; 设置在所述基板的第一表面上的多个支撑构件; 至少一个电光元件具有相对的有源和非有源表面，并经由其非有效表面设置在衬底的沟槽中; 设置在基板的第一表面上的插入器和用于将电光元件电连接到基板的电光元件，其中插入器具有与电光元件的有源表面相对应的通孔; 以及设置在基板的第一表面上的透明板和穿过支撑构件的中介层，并且具有与插入件的通孔对应的透镜部分，从而减少信号损失，提高对准精度，并实现优选的散热和 EMI屏蔽效果。
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公开(公告)号：US20140192832A1
公开(公告)日：2014-07-10
申请号：US13905703
申请日：2013-05-30
发明人： Chih-Yuan Shih , Shih-Liang Peng , Jung-Pin Huang , Chin-Yu Ku , Hsien-Wen Chen
IPC分类号： H01S5/062
CPC分类号： H01L25/00 , H01L2224/48091 , H01S5/02252 , H01S5/0226 , H01S5/02276 , H01S5/02288 , H01S5/02469 , H01S5/06226 , H01S5/423 , H01L2924/00014
摘要： An electro-optical module is provided, which includes: a substrate having a first surface with a groove and an opposite second surface; a plurality of support members disposed on the first surface of the substrate; at least an electro-optical element having opposite active and non-active surfaces and disposed in the groove of the substrate via the non-active surface thereof; an interposer disposed on the first surface of the substrate and the electro-optical element for electrically connecting the electro-optical element to the substrate, wherein the interposer has a through hole corresponding in position to the active surface of the electro-optical element; and a transparent plate disposed over the first surface of the substrate and the interposer through the support members and having a lens portion corresponding in position to the through hole of the interposer, thereby reducing signal losses, improving alignment precision, and achieving preferred thermal dissipation and EMI shielding effects.
摘要翻译： 提供了一种电光模块，其包括：具有第一表面和第二表面的基板; 设置在所述基板的第一表面上的多个支撑构件; 至少一个电光元件具有相对的有源和非有源表面，并经由其非有效表面设置在衬底的沟槽中; 设置在基板的第一表面上的插入器和用于将电光元件电连接到基板的电光元件，其中插入器具有与电光元件的有源表面相对应的通孔; 以及设置在基板的第一表面上的透明板和穿过支撑构件的中介层，并且具有与插入件的通孔对应的透镜部分，从而减少信号损失，提高对准精度，并实现优选的散热和 EMI屏蔽效果。
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公开(公告)号：US11437325B2
公开(公告)日：2022-09-06
申请号：US16943344
申请日：2020-07-30
发明人： Ho-Chuan Lin , Hsiu-Fang Chien , Chih-Yuan Shih , Tsung-Li Lin
IPC分类号： H01L23/538 , H01L23/528 , H01L23/00
摘要： An electronic package is provided and has a packaging substrate including a ground pad and a power pad. The power pad surrounds at least three directions of the ground pad so as to increase the footprint of the power pad on the packaging substrate, thereby avoiding cracking of an electronic element disposed on the packaging substrate and effectively reducing the voltage drop.
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公开(公告)号：US20210358851A1
公开(公告)日：2021-11-18
申请号：US16943344
申请日：2020-07-30
发明人： Ho-Chuan Lin , Hsiu-Fang Chien , Chih-Yuan Shih , Tsung-Li Lin
IPC分类号： H01L23/538 , H01L23/00 , H01L23/528
摘要： An electronic package is provided and has a packaging substrate including a ground pad and a power pad. The power pad surrounds at least three directions of the ground pad so as to increase the footprint of the power pad on the packaging substrate, thereby avoiding cracking of an electronic element disposed on the packaging substrate and effectively reducing the voltage drop.
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