Image sensor
    21.
    发明授权

    公开(公告)号:US10559611B2

    公开(公告)日:2020-02-11

    申请号:US16031710

    申请日:2018-07-10

    Abstract: An image sensor includes a control circuit and pixels. Each pixel includes: a photosensitive area, a substantially rectangular storage area adjacent to the photosensitive area, and a read area. First and second insulated vertical electrodes electrically connected to each other are positioned opposite each other and delimit the storage area. The first electrode extends between the storage area and the photosensitive area. The second electrode includes a bent extension opposite a first end of the first electrode, with the storage area emerging onto the photosensitive area on the side of the first end. The control circuit operates to apply a first voltage to the first and second electrodes to perform a charge transfer, and a second voltage to block charge transfer.

    INFRA-RED RESPONSE ENHANCEMENT FOR IMAGE SENSOR

    公开(公告)号:US20190280024A1

    公开(公告)日:2019-09-12

    申请号:US15916912

    申请日:2018-03-09

    Inventor: Francois Roy

    Abstract: A semiconductor body of a first conductivity type and doped with a first doping level includes, at a front side surface thereof, a well of a second conductivity type and a region doped with the first conductivity type at a second doping level greater than the first doping level. An insulated vertical gate structure separates the region from the well. Buried iInsulated electrodes extend from the front side surface completely through the well and into a portion of the semiconductor body underneath the well. A conductive material portion of each buried insulated electrode is configured to receive a bias voltage and a conductive material portion of insulated vertical gate structure is configured to receive a gate voltage. The semiconductor body is delimited by a capacitive deep trench isolation that is biased at the same voltage as the buried insulated electrode.

    Insulating wall and method of manufacturing the same

    公开(公告)号:US10355041B2

    公开(公告)日:2019-07-16

    申请号:US15703251

    申请日:2017-09-13

    Inventor: Francois Roy

    Abstract: A pixel includes a semiconductor layer with a charge accumulation layer extending in the semiconductor layer. A transistor has a read region penetrating into said semiconductor layer down to a first depth. An insulating wall penetrates into the semiconductor layer from an upper surface and containing an insulated conductor connected to a node of application of a potential. The insulating wall includes at least a portion provided with a deep insulating plug penetrating into the insulated conductor down to a second depth greater than the first depth. A continuous portion of the insulating wall laterally delimits, at least partially, a charge accumulation area and includes a wall portion with the deep insulating plug at least partially laterally delimiting the read region of the transistor.

    Image sensor of global shutter type

    公开(公告)号:US10321073B2

    公开(公告)日:2019-06-11

    申请号:US15358737

    申请日:2016-11-22

    Inventor: Francois Roy

    Abstract: Each pixel of a global shutter back-side illuminated image sensor includes a photosensitive area. On a front surface, a first transistor includes a vertical ring-shaped electrode penetrating into the photosensitive area and laterally delimiting a memory area. The memory area penetrates into the photosensitive area less deeply than the insulated vertical ring-shaped electrode. A read area is formed in an intermediate area which is formed in the memory area. The memory area, the intermediate area and read area define a second transistor having an insulated horizontal electrode forming a gate of the second transistor. The memory area may be formed by a first and second memory areas and an output signal is generated indicative of a difference between charge stored in the first memory area and charge stored in the second memory area after a charge transfer to the first memory area.

    Backside illuminated photosensor element with light pipe and light mirror structures

    公开(公告)号:US10192917B2

    公开(公告)日:2019-01-29

    申请号:US15198824

    申请日:2016-06-30

    Abstract: A photosensor is formed within a semiconductor substrate layer having a front side and a back side. An isolation structure delimits an active region of the semiconductor substrate layer which includes a charge collecting region. The front side of semiconductor substrate layer includes a charge transfer circuit. A reflecting mirror is mounted at the back side of the semiconductor substrate layer. The reflecting mirror includes a pupil opening configured to admit light into the active region at the back side. An underside reflective surface of the reflecting mirror is configured to reflect light received from the active region back into the active region.

    Insulating wall and method of manufacturing the same

    公开(公告)号:US09793312B1

    公开(公告)日:2017-10-17

    申请号:US15230055

    申请日:2016-08-05

    Inventor: Francois Roy

    Abstract: A pixel includes a semiconductor layer with a charge accumulation layer extending in the semiconductor layer. A transistor has a read region penetrating into said semiconductor layer down to a first depth. An insulating wall penetrates into the semiconductor layer from an upper surface and containing an insulated conductor connected to a node of application of a potential. The insulating wall includes at least a portion provided with a deep insulating plug penetrating into the insulated conductor down to a second depth greater than the first depth. A continuous portion of the insulating wall laterally delimits, at least partially, a charge accumulation area and includes a wall portion with the deep insulating plug at least partially laterally delimiting the read region of the transistor.

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