Low-noise wide dynamic range image sensor

    公开(公告)号:US11195872B2

    公开(公告)日:2021-12-07

    申请号:US16547231

    申请日:2019-08-21

    Abstract: A semiconductor image sensor includes a plurality of pixels. Each pixel of the sensor includes a semiconductor substrate having opposite front and back sides and laterally delimited by a first insulating wall including a first conductive core insulated from the substrate, electron-hole pairs being capable of forming in the substrate due to a back-side illumination. A circuit is configured to maintain, during a first phase in a first operating mode, the first conductive core at a first potential and to maintain, during at least a portion of the first phase in a second operating mode, the first conductive core at a second potential different from the first potential.

    Single photon avalanche gate sensor device

    公开(公告)号:US11145780B2

    公开(公告)日:2021-10-12

    申请号:US16789045

    申请日:2020-02-12

    Inventor: Francois Roy

    Abstract: A semiconductor substrate doped with a first doping type is positioned adjacent an insulated gate electrode that is biased by a gate voltage. A first region within the semiconductor substrate is doped with the first doping type and biased with a bias voltage. A second region within the semiconductor substrate is doped with a second doping type that is opposite the first doping type. Voltage application produces an electrostatic field within the semiconductor substrate causing the formation of a fully depleted region within the semiconductor substrate. The fully depleted region responds to absorption of a photon with an avalanche multiplication that produces charges that are collected at the first and second regions.

    Insulating wall and method of manufacturing the same

    公开(公告)号:US10361238B2

    公开(公告)日:2019-07-23

    申请号:US15703246

    申请日:2017-09-13

    Inventor: Francois Roy

    Abstract: A pixel includes a semiconductor layer with a charge accumulation layer extending in the semiconductor layer. A transistor has a read region penetrating into said semiconductor layer down to a first depth. An insulating wall penetrates into the semiconductor layer from an upper surface and containing an insulated conductor connected to a node of application of a potential. The insulating wall includes at least a portion provided with a deep insulating plug penetrating into the insulated conductor down to a second depth greater than the first depth. A continuous portion of the insulating wall laterally delimits, at least partially, a charge accumulation area and includes a wall portion with the deep insulating plug at least partially laterally delimiting the read region of the transistor.

    Single photon avalanche gate sensor device

    公开(公告)号:US10193009B1

    公开(公告)日:2019-01-29

    申请号:US15945972

    申请日:2018-04-05

    Inventor: Francois Roy

    Abstract: A semiconductor substrate doped with a first doping type is positioned adjacent an insulated gate electrode that is biased by a gate voltage. A first region within the semiconductor substrate is doped with the first doping type and biased with a bias voltage. A second region within the semiconductor substrate is doped with a second doping type that is opposite the first doping type. Voltage application produces an electrostatic field within the semiconductor substrate causing the formation of a fully depleted region within the semiconductor substrate. The fully depleted region responds to absorption of a photon with an avalanche multiplication that produces charges that are collected at the first and second regions.

    Time-of-flight detection pixel
    5.
    发明授权

    公开(公告)号:US10162048B2

    公开(公告)日:2018-12-25

    申请号:US15392032

    申请日:2016-12-28

    Abstract: A pixel is formed on a semiconductor substrate that includes a photosensitive area having a first doped layer and a charge collection area of a first conductivity type extending through at least part of the first doped layer. At least two charge storage areas, each including a well of the first conductivity type, are separated from the charge collection area at least by a first portion of the first layer. The first portion is covered by a first gate. Each charge storage area is laterally delimited by two insulated conductive electrodes. A second doped layer of the second conductivity type covers the charge collection area and the charge storage areas.

    IMAGE SENSOR
    6.
    发明申请
    IMAGE SENSOR 审中-公开

    公开(公告)号:US20180323228A1

    公开(公告)日:2018-11-08

    申请号:US16031710

    申请日:2018-07-10

    Abstract: An image sensor includes a control circuit and pixels. Each pixel includes: a photosensitive area, a substantially rectangular storage area adjacent to the photosensitive area, and a read area. First and second insulated vertical electrodes electrically connected to each other are positioned opposite each other and delimit the storage area. The first electrode extends between the storage area and the photosensitive area. The second electrode includes a bent extension opposite a first end of the first electrode, with the storage area emerging onto the photosensitive area on the side of the first end. The control circuit operates to apply a first voltage to the first and second electrodes to perform a charge transfer, and a second voltage to block charge transfer.

    Image sensor
    7.
    发明授权

    公开(公告)号:US10043837B2

    公开(公告)日:2018-08-07

    申请号:US15488691

    申请日:2017-04-17

    Abstract: An image sensor includes a control circuit and pixels. Each pixel includes: a photosensitive area, a substantially rectangular storage area adjacent to the photosensitive area, and a read area. First and second insulated vertical electrodes electrically connected to each other are positioned opposite each other and delimit the storage area. The first electrode extends between the storage area and the photosensitive area. The second electrode includes a bent extension opposite a first end of the first electrode, with the storage area emerging onto the photosensitive area on the side of the first end. The control circuit operates to apply a first voltage to the first and second electrodes to perform a charge transfer, and a second voltage to block charge transfer.

    CONTACT TRENCH BETWEEN STACKED SEMICONDUCTOR SUBSTRATES

    公开(公告)号:US20180090435A1

    公开(公告)日:2018-03-29

    申请号:US15275619

    申请日:2016-09-26

    Inventor: Francois Roy

    CPC classification number: H01L23/5226 H01L25/0657

    Abstract: A first semiconductor substrate layer supports a first transistor including a first source-drain formed by a doped region of the substrate layer. A second semiconductor substrate layer supports a second transistor including a second source-drain formed by a doped region of the substrate layer. The second semiconductor substrate layer is stacked over the first semiconductor substrate layer and separated therefrom by an insulating layer. A metal wiring extends from an electrical contact with the doped region for the first source-drain, through the insulating layer and passing through an electrical isolation structure in the second semiconductor substrate layer to make an electrical contact with the doped region for the second source-drain. The electrical isolation structure is formed by one of a trench isolation or the doped region of the second source-drain itself. The isolation structure has a thickness equal to a thickness of the second semiconductor substrate layer.

    VERTICAL TRANSFER GATE TRANSISTOR AND ACTIVE CMOS IMAGE SENSOR PIXEL INCLUDING A VERTICAL TRANSFER GATE TRANSISTOR

    公开(公告)号:US20180061875A1

    公开(公告)日:2018-03-01

    申请号:US15251745

    申请日:2016-08-30

    Inventor: Francois Roy

    CPC classification number: H01L27/14614 H01L27/14689

    Abstract: A transfer gate transistor includes a semiconductor substrate including a charge collection source region, a portion forming a channel region and a top region forming a drain region. A trench in the substrate surrounds the top region and the portion of the substrate. A vertical insulated gate structure for the transistor is formed in the trench. The vertical insulated gate structure includes an insulating liner on sidewalls and a bottom of said trench and an electrode including an upper conductive part and a lower conductive part. A width of the upper conductive part parallel to an upper surface of the substrate increases as depth from the upper surface of the substrate increases. A thickness of the insulating liner adjacent the upper conductive part decreases as depth from the upper surface of the substrate increases. A thickness of the insulating liner adjacent the lower conductive part is substantially constant.

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