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公开(公告)号：US11543378B2
公开(公告)日：2023-01-03
申请号：US16709811
申请日：2019-12-10
Applicant: STMICROELECTRONICS PTE LTD
Inventor： Olivier Le Neel , Alexandre Le Roch , Ayoub Lahlalia , Ravi Shankar
Abstract: The present disclosure is directed to a gas sensor that includes an active sensor area that is exposed to an environment for detection of elements. The gas sensor may be an air quality sensor that can be fixed in position or carried by a user. The gas sensor includes a heater formed above chamber. The gas sensor includes an active sensor layer above the heater that forms the active sensor area. The gas sensor can include a passive conductive layer, such as a hotplate that further conducts and distributes heat from the heater to the active sensor area. The heater can include a plurality of extensions. The heater can also include a first conductive layer and a second conductive layer on the first conductive layer where the second conductive layer includes a plurality of openings to increase an amount of heat and to more evenly distribute heat from the heater to the active sensor area.
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公开(公告)号：US10905362B2
公开(公告)日：2021-02-02
申请号：US16407054
申请日：2019-05-08
Applicant: STMICROELECTRONICS PTE LTD
Inventor： Olivier Le Neel , Suman Cherian , Calvin Leung
IPC: G01N27/327 , A61B5/1473 , A61B5/145 , A61B5/1468
Abstract: A universal electrochemical micro-sensor can be used either as a biosensor or an environmental sensor. Because of its small size and flexibility, the micro-sensor is suitable for continuous use to monitor fluids within a live subject, or as an environmental monitor. The micro-sensor can be formed on a reusable glass carrier substrate. A flexible polymer backing, together with a set of electrodes, forms a reservoir that contains an electrolytic fluid chemical reagent. During fabrication, the glass carrier substrate protects the fluid chemical reagent from degradation. A conductive micromesh further contains the reagent while allowing partial exposure to the ambient biological or atmospheric environment. The micromesh density can be altered to accommodate fluid reagents having different viscosities. Flexibility is achieved by attaching a thick polymer tape and peeling away the micro-sensor from the glass carrier substrate. The final structure is thereby transferred to the polymer tape, providing a flexible product.
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公开(公告)号：US20190195818A1
公开(公告)日：2019-06-27
申请号：US16217631
申请日：2018-12-12
Applicant: STMICROELECTRONICS PTE LTD
Inventor： Malek BRAHEM , Hatem Majeri , Olivier Le Neel , Ravi Shankar
CPC classification number: G01N27/123 , G01N33/0031 , G01N33/0047 , G01N33/0065 , G01N33/0075
Abstract: The present disclosure is directed to a gas sensor device that includes a plurality of gas sensors. Each of the gas sensors includes a semiconductor metal oxide (SMO) film, a heater, and a temperature sensor. Each of the SMO films is designed to be sensitive to a different gas concentration range. As a result, the gas sensor device is able to obtain accurate readings for a wide range of gas concentration levels. In addition, the gas sensors are selectively activated and deactivated based on a current gas concentration detected by the gas sensor device. Thus, the gas sensor device is able to conserve power as gas sensors are on when appropriate instead of being continuously on.
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公开(公告)号：US20180017536A1
公开(公告)日：2018-01-18
申请号：US15213100
申请日：2016-07-18
Applicant: STMicroelectronics Pte Ltd
Inventor： Olivier Le Neel , Tien Choy Loh , Shian Yeu Kam , Ravi Shankar
CPC classification number: G01N33/004 , G01N25/22 , G01N33/0047
Abstract: A microelectronic device capable of detecting multiple gas constituents in ambient air can be used to monitor air quality. The microelectronic air quality monitor includes a plurality of temperature-sensitive gas sensors tuned to detect different gas species. Each gas sensor is tuned by programming an adjacent heater. An insulating air pocket formed below the sensor helps to maintain the sensor at a desired temperature. A temperature sensor may also be integrated with each gas sensor to provide additional feedback control. The heater, temperature sensor, and gas sensors are in the form of patternable thin films integrated on a single microchip. The device can be incorporated into computer workstations, smart phones, clothing, or other wearable accessories to function as a personal air quality monitor that is smaller, more accurate, and less expensive than existing air quality sensors.
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公开(公告)号：US20180017513A1
公开(公告)日：2018-01-18
申请号：US15213230
申请日：2016-07-18
Applicant: STMicroelectronics Pte Ltd
Inventor： Olivier Le Neel , Ravi Shankar , Shian Yeu Kam , Tien Choy Loh
CPC classification number: G01N27/128 , G01N33/0047
Abstract: A miniature gas analyzer capable of detecting VOC gases in ambient air as well as sensing relative humidity and ambient temperature can be used to monitor indoor air quality. The VOC gas sensor is thermally controlled and can be tuned to detect a certain gas by programming an adjacent heater. An insulating air pocket formed below the sensor helps to maintain the VOC gas sensor at a desired temperature. A local temperature sensor may be integrated with each gas sensor to provide feedback control. The heater, local temperature sensor, gas sensor(s), relative humidity sensor, and ambient temperature sensor are in the form of patternable thin films integrated on a single microchip, e.g., an ASIC. The device can be incorporated into computer workstations, smart phones, clothing, or other wearable accessories to function as a personal air quality monitor that is smaller, more accurate, and less expensive than existing air quality sensors.
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Patent Agency Ranking
公开(公告)号：US20170261458A1
公开(公告)日：2017-09-14
申请号：US15605825
申请日：2017-05-25
Applicant: STMicroelectronics Pte Ltd.
Inventor： Olivier Le Neel , Ravi Shankar , Suman Cherian , Calvin Leung , Tien-Choy Loh , Shian-Yeu Kam
CPC classification number: G01N27/223 , G01D21/02 , G01K7/01 , G01K7/16 , G01K7/186 , G01K7/20 , G01L9/12 , G01L19/0092 , H01L25/0652 , H01L25/50 , H01L27/0248 , H01L29/7804 , H01L2924/0002 , H01L2924/00
Abstract: A semiconductor-based multi-sensor module integrates miniature temperature, pressure, and humidity sensors onto a single substrate. Pressure and humidity sensors can be implemented as capacitive thin film sensors, while the temperature sensor is implemented as a precision miniature Wheatstone bridge. Such multi-sensor modules can be used as building blocks in application-specific integrated circuits (ASICs). Furthermore, the multi-sensor module can be built on top of existing circuitry that can be used to process signals from the sensors. An integrated multi-sensor module that uses differential sensors can measure a variety of localized ambient environmental conditions substantially simultaneously, and with a high level of precision. The multi-sensor module also features an integrated heater that can be used to calibrate or to adjust the sensors, either automatically or as needed. Such a miniature integrated multi-sensor module that features low power consumption can be used in medical monitoring and mobile computing, including smart phone applications.
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公开(公告)号：US20160041114A1
公开(公告)日：2016-02-11
申请号：US14887145
申请日：2015-10-19
Applicant: STMicroelectronics Pte Ltd.
Inventor： Olivier Le Neel , Ravi Shankar , Suman Cherian , Calvin Leung , Tien-Choy Loh , Shian-Yeu Kam
CPC classification number: G01N27/223 , G01D21/02 , G01K7/01 , G01K7/16 , G01K7/186 , G01K7/20 , G01L9/12 , G01L19/0092 , H01L25/0652 , H01L25/50 , H01L27/0248 , H01L29/7804 , H01L2924/0002 , H01L2924/00
Abstract: A semiconductor-based multi-sensor module integrates miniature temperature, pressure, and humidity sensors onto a single substrate. Pressure and humidity sensors can be implemented as capacitive thin film sensors, while the temperature sensor is implemented as a precision miniature Wheatstone bridge. Such multi-sensor modules can be used as building blocks in application-specific integrated circuits (ASICs). Furthermore, the multi-sensor module can be built on top of existing circuitry that can be used to process signals from the sensors. An integrated multi-sensor module that uses differential sensors can measure a variety of localized ambient environmental conditions substantially simultaneously, and with a high level of precision. The multi-sensor module also features an integrated heater that can be used to calibrate or to adjust the sensors, either automatically or as needed. Such a miniature integrated multi-sensor module that features low power consumption can be used in medical monitoring and mobile computing, including smart phone applications.
Abstract translation: 基于半导体的多传感器模块将微型温度，压力和湿度传感器集成到单个基板上。 压力和湿度传感器可以实现为电容薄膜传感器，而温度传感器实现为精密微型惠斯通电桥。 这种多传感器模块可以用作专用集成电路（ASIC）中的构建块。 此外，多传感器模块可以构建在可用于处理来自传感器的信号的现有电路之上。 使用差分传感器的集成多传感器模块可以大量同时测量各种局部环境条件，并以高精度测量。 多传感器模块还具有集成加热器，可用于自动或根据需要校准或调整传感器。 这种具有低功耗的微型集成多传感器模块可用于医疗监控和移动计算，包括智能手机应用。
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公开(公告)号：US09082681B2
公开(公告)日：2015-07-14
申请号：US13853886
申请日：2013-03-29
Applicant: STMicroelectronics Pte Ltd.
Inventor： Olivier Le Neel , Shian-Yeu Kam , Tien-Choy Loh , Ditto Adnan , Tze Wei Dennis Chew
CPC classification number: H01L25/16 , B81C1/0023 , G01N27/223 , H01L21/56 , H01L21/561 , H01L23/16 , H01L23/3121 , H01L24/32 , H01L24/48 , H01L24/73 , H01L25/00 , H01L2224/32145 , H01L2224/32225 , H01L2224/48091 , H01L2224/48145 , H01L2224/48227 , H01L2224/73265 , H01L2224/854 , H01L2924/00014 , H01L2924/181 , H01L2924/1815 , H01L2924/00 , H01L2924/00012 , H01L2224/45099
Abstract: A micro-sensor device that includes a passivation-protected ASIC module and a micro-sensor module bonded to a patterned cap provides protection for signal conditioning circuitry while allowing one or more sensing elements in the micro-sensor module to be exposed to an ambient environment. According to a method of fabricating the micro-sensor device, the patterned cap can be bonded to the micro-sensor module using a planarizing adhesive that is chemically compatible with the sensing elements. In one embodiment, the adhesive material is the same material used for the dielectric active elements, for example, a photo-sensitive polyimide film.
Abstract translation: 包括钝化保护ASIC模块和结合到图案化盖的微传感器模块的微传感器装置为信号调节电路提供保护，同时允许微传感器模块中的一个或多个感测元件暴露于周围环境 。 根据制造微传感器装置的方法，图案化盖可以使用与感测元件化学相容的平面化粘合剂结合到微传感器模块。 在一个实施例中，粘合剂材料是用于介电活性元件的材料，例如光敏聚酰亚胺膜。
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公开(公告)号：US20150001075A1
公开(公告)日：2015-01-01
申请号：US13929525
申请日：2013-06-27
Applicant: STMicroelectronics Pte Ltd.
Inventor： Olivier Le Neel , Suman Cherian , Calvin Leung , Ravi Shankar , Tien Choy Loh , Shian Yeu Kam
IPC: G01N27/416 , H01L35/34
CPC classification number: H01L35/34 , G01N27/3274 , Y10T29/49117
Abstract: A bio-fluid sensor is formed by depositing polyimide on a glass substrate. Gold and platinum are deposited on the polyimide and patterned to form fluid sensing electrodes, signal traces, and a temperature sensor. The fluid sensor is then fixed to a flexible tape and peeled off of the glass substrate.
Abstract translation: 通过在玻璃基板上沉积聚酰亚胺形成生物流体传感器。 金和铂沉积在聚酰亚胺上并图案化以形成流体感测电极，信号迹线和温度传感器。 然后将流体传感器固定到柔性带并从玻璃基板上剥离。
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公开(公告)号：US20140133215A1
公开(公告)日：2014-05-15
申请号：US14150676
申请日：2014-01-08
Applicant: STMicroelectronics Pte Ltd.
Inventor： Olivier Le Neel
IPC: G11C13/00
CPC classification number: G11C13/0002 , G11C11/21 , G11C11/56 , G11C11/5678 , G11C13/0007 , G11C13/004 , G11C13/0061 , G11C13/0069 , G11C2013/008 , G11C2213/33 , G11C2213/71
Abstract: An integrated circuit is formed having an array of memory cells located in the dielectric stack above a semiconductor substrate. Each memory cell has two adjustable resistors and two heating elements. A dielectric material separates the heating elements from the adjustable resistors. One heating element alters the resistance of one of the resistors by applying heat thereto to write data to the memory cell. The other heating element alters the resistance of the other resistor by applying heat thereto to erase data from the memory cell.
Abstract translation: 形成集成电路，其具有位于半导体衬底上方的电介质堆叠中的存储器单元的阵列。 每个存储单元具有两个可调电阻器和两个加热元件。 电介质材料将加热元件与可调电阻分开。 一个加热元件通过加热来改变其中一个电阻器的电阻以将数据写入存储单元。 另一个加热元件通过加热来改变另一个电阻器的电阻，从而擦除来自存储单元的数据。
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