公开(公告)号：US09444070B2

公开(公告)日：2016-09-13

申请号：US13937069

申请日：2013-07-08

Applicant: SAMSUNG DISPLAY CO., LTD.

Inventor： Hee-Kwon Lee

IPC: H05B33/04 ,  H01L51/52 ,  H01L27/32

CPC classification number: H01L51/5246 ,  H01L27/32

Abstract: An organic light emitting display device includes: a cover window having a receiving recess, the receiving recess having a bottom surface and a side surface inclined with respect to the bottom surface; a display panel assembly in the receiving recess; an adhesive layer between the bottom surface and the display panel assembly and coupling the bottom surface to the display panel assembly; and a sealing part between the side surface and the display panel assembly to couple the side surface and the display panel assembly.

Abstract translation: 一种有机发光显示装置，包括：盖窗，其具有收容凹部，所述收容凹部具有底面和相对于所述底面倾斜的侧面; 显示面板组件; 在所述底表面和所述显示面板组件之间的粘合层，并将所述底表面联接到所述显示面板组件; 以及侧表面和显示面板组件之间的密封部分，以联接侧表面和显示面板组件。

公开(公告)号：US20140292184A1

公开(公告)日：2014-10-02

申请号：US13937069

申请日：2013-07-08

Applicant: SAMSUNG DISPLAY CO., LTD.

Inventor： Hee-Kwon Lee

IPC: H05B33/04

CPC classification number: H01L51/5246 ,  H01L27/32

Abstract: An organic light emitting display device includes: a cover window having a receiving recess, the receiving recess having a bottom surface and a side surface inclined with respect to the bottom surface; a display panel assembly in the receiving recess; an adhesive layer between the bottom surface and the display panel assembly and coupling the bottom surface to the display panel assembly; and a sealing part between the side surface and the display panel assembly to couple the side surface and the display panel assembly.

Abstract translation: 一种有机发光显示装置，包括：盖窗，其具有收容凹部，所述收容凹部具有底面和相对于所述底面倾斜的侧面; 显示面板组件; 在所述底表面和所述显示面板组件之间的粘合层，并将所述底表面联接到所述显示面板组件; 以及侧表面和显示面板组件之间的密封部分，以联接侧表面和显示面板组件。

公开(公告)号：US20140118969A1

公开(公告)日：2014-05-01

申请号：US14062678

申请日：2013-10-24

Applicant: Samsung Display Co., Ltd.

Inventor： Hee-Kwon Lee

IPC: H05K9/00

CPC classification number: H05K9/00 ,  G02F1/13452 ,  H01L23/4985 ,  H01L23/552 ,  H01L24/16 ,  H01L2224/16225 ,  H01L2924/12041 ,  H01L2924/12044 ,  H05K1/0224 ,  H05K1/0281 ,  H05K1/189 ,  H05K2201/09681 ,  H05K2201/10128 ,  H01L2924/00

Abstract: A chip on film according to an exemplary embodiment includes: a driving film, a wire layer formed on a first surface of the driving film, a driving chip connected to the wire layer, and an electromagnetic wave blocking layer formed on a second surface of the driving film, in which a mesh portion may be formed on a portion of the electromagnetic wave blocking layer.

Abstract translation: 根据示例性实施例的胶片上的芯片包括：驱动膜，形成在驱动膜的第一表面上的线层，连接到导线层的驱动芯片，以及形成在第二表面上的电磁波阻挡层 驱动膜，其中可以在电磁波阻挡层的一部分上形成网状部分。