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21.
公开(公告)号:US20180210130A1
公开(公告)日:2018-07-26
申请号:US15870291
申请日:2018-01-12
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor: Sunghoon LEE , Joonyong PARK , Dongouk KIM , Jihyun BAE , Bongsu SHIN , Dongsik SHIM , Jaeseung CHUNG
Abstract: An input coupler includes: a plurality of semi-reflectors located along an optical path along which a light incident from a light source travels, each of the plurality of semi-reflectors comprising a reflective surface that is inclined with respect to the optical path and configured to reflect a first portion of the light and transmit a second portion of the light; and a plurality of optical path changing members configured to change an optical path of the light transmitted through the plurality of semi-reflectors, wherein the plurality of semi-reflectors and the plurality of optical path changing members are arranged such that the light passing through at least one of the plurality of semi-reflectors and emitted in one direction has a linear beam distribution.
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公开(公告)号:US20180128962A1
公开(公告)日:2018-05-10
申请号:US15656349
申请日:2017-07-21
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor: Hyunjoon KIM , Bongsu SHIN , Dongouk KIM , Joonyong PARK , Jihyun BAE , Dongsik SHIM , Sunghoon LEE , Jaeseung CHUNG , Seokho SONG
IPC: F21V8/00
CPC classification number: G02B6/0061 , G02B6/0035 , G02B6/0036 , G02B6/005 , G02B6/0068
Abstract: A directional backlight unit and an image display apparatus including the directional backlight unit are provided. The directional backlight unit includes at least one light source and a light guide plate that guides light emitted by the light source. An interval between grating patterns formed on the light guide plate satisfies at least one condition of a first range and a second range in order to minimize a spreading of light caused by the grating patterns.
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23.
公开(公告)号:US20180113250A1
公开(公告)日:2018-04-26
申请号:US15440535
申请日:2017-02-23
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor: Sunghoon LEE , Joonyong PARK , Bongsu SHIN , Dongouk KIM , Jihyun BAE , Dongsik SHIM , Jaeseung CHUNG
IPC: F21V8/00 , G02F1/1335 , G02B5/30
CPC classification number: G02F1/133504 , G02B5/3058 , G02B6/005 , G02B6/0056 , G02F1/133528 , G02F2001/133548 , G02F2001/133626
Abstract: A three-dimensional (3D) image display apparatus includes a directional backlight unit and a display panel. The 3D image display apparatus may include an absorptive wire grid polarizer in the directional backlight unit or the display panel, for minimizing a distance between a diffraction device of the directional backlight unit and a pixel of the display panel.
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公开(公告)号:US20170082850A1
公开(公告)日:2017-03-23
申请号:US15220930
申请日:2016-07-27
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor: Dongsik SHIM , Hongseok LEE , Seogwoo HONG , Joonyong PARK
CPC classification number: G02B26/04 , G02B6/0051 , G02B6/0068 , G02B26/023 , G09G3/3413 , G09G3/3473
Abstract: A mirror display includes a light source, a light guide plate configured to guide light emitted from the light source, a first electrode layer spaced apart from the light guide plate and including at least one first hole, a first spacer provided between the light guide plate and the first electrode layer, a second electrode layer spaced apart from the first electrode layer and including at least one second hole not facing the first hole, and a substrate provided on the second electrode layer.
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25.
公开(公告)号:US20160051226A1
公开(公告)日:2016-02-25
申请号:US14665213
申请日:2015-03-23
Applicant: Samsung Electronics Co., Ltd.
Inventor: Seogwoo HONG , Dongsik SHIM , Seokwhan CHUNG
CPC classification number: H04R31/006 , B06B1/0292
Abstract: An ultrasonic transducer module may comprise: an ultrasonic transducer comprising a substrate, a thin film separated from the substrate, a support portion for supporting the thin film, and a first electrode pad on the substrate; and/or a circuit board comprising a main body, an opening in the main body for accommodating the thin film, and a second electrode pad attached to the first electrode pad. An ultrasonic transducer may comprise: a substrate; a plurality of first electrode layers on the substrate, with spaces between the first electrode layers; an insulating layer between the substrate and the first electrode layers; a support portion on the first electrode layers; a thin film supported by the support portion, with cavities between each of the first electrode layers and the thin film; and/or a second electrode layer on the thin film.
Abstract translation: 超声换能器模块可以包括:超声波换能器,包括基底,与基底分离的薄膜,支撑薄膜的支撑部分和在基底上的第一电极垫; 和/或电路板,包括主体,用于容纳薄膜的主体中的开口,以及附接到第一电极焊盘的第二电极焊盘。 超声换能器可以包括:基底; 在所述基板上的多个第一电极层,在所述第一电极层之间具有空间; 在所述基板和所述第一电极层之间的绝缘层; 第一电极层上的支撑部分; 由所述支撑部支撑的薄膜,在所述第一电极层和所述薄膜中的每一个之间具有空腔; 和/或薄膜上的第二电极层。
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26.
公开(公告)号:US20230258966A1
公开(公告)日:2023-08-17
申请号:US18307080
申请日:2023-04-26
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor: Dongsik SHIM , Changgyun Shin , Changbum Lee
CPC classification number: G02F1/025 , G01S7/4814 , H01S5/0201 , H01S5/0218 , H01S5/0282 , H01S5/3013 , H01S5/0071 , H01S5/021 , H01S5/4025 , H01S5/4075 , H01S2301/176 , G02F1/292
Abstract: Provided in a method of fabricating an optical element array including providing a silicon substrate, providing a first element layer on the silicon substrate, the first element layer including a plurality of passive optical elements, providing a plurality of semiconductor blocks on a compound semiconductor wafer, providing semiconductor dies by dicing the compound semiconductor wafer by the plurality of semiconductor blocks, and providing a second element layer by providing the semiconductor dies on the first element layer, each of the plurality of semiconductor blocks contacting at least one corresponding passive optical element from among the plurality of passive optical elements.
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公开(公告)号:US20200249384A1
公开(公告)日:2020-08-06
申请号:US16858129
申请日:2020-04-24
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor: Sunghoon LEE , Joonyong PARK , Dongouk KIM , Jihyun BAE , Bongsu SHIN , Dongsik SHIM , Jaeseung CHUNG
Abstract: A method for manufacturing a pattern structure includes preparing a wafer that has a plurality of fine patterns, generating a first trench by processing the wafer from a first surface to a first depth, and generating a second trench connected to the first trench by processing the wafer from a second surface which is opposite to the first surface to a second depth, thereby cutting the wafer.
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28.
公开(公告)号:US20190033609A1
公开(公告)日:2019-01-31
申请号:US16148554
申请日:2018-10-01
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor: Hyunjoon KIM , Joonyong PARK , Bongsu SHIN , Dongouk KIM , Jihyun BAE , Dongsik SHIM , SungHoon LEE , Jaeseung CHUNG , Seogwoo HONG
Abstract: A directional backlight unit, a three-dimensional (3D) image display apparatus, and a 3D image displaying method are provided. The directional backlight unit includes a light guide plate having an emission surface on which a plurality of grating elements including first and second groups of grating elements are provided. The plurality of grating elements are arranged such that light beams emitted from the first and second groups of grating elements commonly propagate through a plurality of pixel points and respectively form first and second groups of view points of which corresponding regions do not overlap with each other.
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公开(公告)号:US20170219747A1
公开(公告)日:2017-08-03
申请号:US15337648
申请日:2016-10-28
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor: Sunghoon LEE , Jaeseung CHUNG , Dongouk KIM , Hyunjoon KIM , Joonyong PARK , Jihyun BAE , Bongsu SHIN , Dongsik SHIM , Seogwoo HONG
IPC: G02B5/18 , F21V8/00 , G02F1/1335
CPC classification number: G02B5/1852 , B23K26/0006 , B23K26/364 , B23K26/38 , B23K26/402 , B23K26/53 , B23K2101/40 , B23K2103/54 , B23K2103/56 , G02B5/18 , G02B5/3058 , G02B6/0038 , G02F1/133512 , G02F1/133528 , G02F1/133606 , G02F2001/133548 , G02F2001/133607 , G03F7/0002 , G03F7/0007
Abstract: A method of manufacturing a pattern structure is provided. The method includes forming a fine pattern on a wafer, cutting the wafer by irradiating the wafer with a laser while changing a focal depth of the laser, thereby forming a unit pattern structure having a fine pattern, and bonding cutting surfaces of at least two unit pattern structures. The cutting of the wafer comprises moving a focal position of the laser in a horizontal direction and changing the focal depth of the laser, such that the unit pattern structure has a cutting surface profile in which a first surface of the unit pattern structure on which the fine pattern is formed protrudes, in a direction substantially parallel to the first surface, from a second surface of the unit pattern structure that is opposite to the first surface.
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公开(公告)号:US20170199420A1
公开(公告)日:2017-07-13
申请号:US15404717
申请日:2017-01-12
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor: Bongsu SHIN , Hyunjoon KIM , Joonyong PARK , Dongouk KIM , Jihyun BAE , Dongsik SHIM , Sunghoon LEE , Jaeseung CHUNG , Seogwoo HONG
IPC: G02F1/1335 , F21V8/00 , G02B27/22
Abstract: A three-dimensional (3D) image display apparatus includes a backlight unit configured to provide collimated white light, and a display panel configured to modulate the light provided from the backlight unit based on image information and to display the light in a plurality of viewing zones. The display panel includes a diffractive color filter in which a diffractive element for providing directivity is disposed on a color filter, thereby improving an optical efficiency in 3D image formation.
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