公开(公告)号：US12095876B2

公开(公告)日：2024-09-17

申请号：US18300066

申请日：2023-04-13

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jungho Park ,  Yul Kim ,  Sejeong Kwon ,  Soohyung Kim ,  Wonsuk Yang ,  Kyunghwan Lee ,  Junhyuk Lee

IPC: H04L67/50 ,  G06F16/35 ,  H04L41/16 ,  H04L43/04 ,  H04L67/02

CPC classification number: H04L67/535 ,  G06F16/35 ,  H04L41/16 ,  H04L43/04 ,  H04L67/02

Abstract: An electronic apparatus is provided. The electronic apparatus includes a communication interface, a memory storing log data with respect to external devices connected to the electronic apparatus, and a processor configured to identify a plurality of external devices having a history of being connected to the same internet protocol (IP) based on the log data, acquire, based on the log data, a first feature vector with respect to a relationship between the plurality of external devices and a second feature vector with respect to each of the plurality of external devices, acquire a graph of the relationship between the plurality of external devices based on the first feature vector and the second feature vector, and define at least one group configured by the plurality of external devices based on the graph.

公开(公告)号：US11942586B2

公开(公告)日：2024-03-26

申请号：US17693704

申请日：2022-03-14

Applicant: Samsung Electronics Co., Ltd.

Inventor： Dahye Kim ,  Seokhyun Lee ,  Jungho Park

IPC: H01L33/62 ,  H01L23/29 ,  H01L23/31 ,  H01L23/485 ,  H01L23/525 ,  H01L25/075 ,  H01L25/16 ,  H01L27/15 ,  H01L33/48 ,  H01L33/56 ,  H01L25/00

CPC classification number: H01L33/62 ,  H01L33/486 ,  H01L33/56

Abstract: A display module package includes a semiconductor chip, a wiring member disposed on the semiconductor chip, including an insulating layer and a wiring layer, and contacting at least a portion of the semiconductor chip, a light emitting device array disposed on the wiring member and including a plurality of light emitting devices disposed on one surface, wherein the wiring member is between the semiconductor chip and the light emitting device, and a molding member disposed on the wiring member, sealing part of the light emitting device array, and having an opening for exposing the plurality of light emitting devices.

公开(公告)号：US20210066560A1

公开(公告)日：2021-03-04

申请号：US16860255

申请日：2020-04-28

Applicant: Samsung Electronics Co., Ltd.

Inventor： Dahye Kim ,  Seokhyun Lee ,  Jungho Park

IPC: H01L33/62 ,  H01L33/56 ,  H01L33/48

Abstract: A display module package includes a semiconductor chip, a wiring member disposed on the semiconductor chip, including an insulating layer and a wiring layer, and contacting at least a portion of the semiconductor chip, a light emitting device array disposed on the wiring member and including a plurality of light emitting devices disposed on one surface, wherein the wiring member is between the semiconductor chip and the light emitting device, and a molding member disposed on the wiring member, sealing part of the light emitting device array, and having an opening for exposing the plurality of light emitting devices.